Method for embedding integrated circuit flip chip

• US 10,558,906 B2
• Filed: 11/22/2016
• Issued: 02/11/2020
• Est. Priority Date: 12/04/2015
• Status: Active Grant

• Current Assignee: Eng Seng Ng
• Original Assignee: Smartflex Technology Pte., Ltd. (NovoFlex Pte Ltd.)
• Inventors: Ng, Eng Seng, Pang, Sze Yong
• Primary Examiner(s): Kebede, Brook
• Application Number:
  US15/767,043
• Publication Number:
  US 20180300597A1
• Time in Patent Office: 1,176 Days
• Field of Search: 438108
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence

Abstract

Embodiments of the invention relate to processes for fabricating a smart device (200), e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers (220, 240) interposing a flexible film (230) having conductor pattern thereon, at least one flip chip (250) for operating the smart card device is embedded in a first substrate (220) such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip (250) is arranged at a position in a first vertical plane; and a contact pad (260), for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane. The contact pad (260) is projected through a cavity in a second substrate to form a continuous even plane from an outer surface of the laminated substrate layers to the contact pad (260).

Claims

1. A smart card device comprising:

a laminated carrier core comprising;

a first substrate;

a second substrate; and

a flexible film having a conductor pattern and interposed between the first and the second substrate, characterised in that the conductor pattern includes;

at least one flip chip embedded into the first or the second substrate,

a contact pad arranged offset relative to the at least one flip chip,

at least one conductor path electrically coupling the contact pad to the at least one flip chip, wherein the at least one conductor path and the contact pad are formed on the flexible film and wherein the contact pad is projected through a cavity in the second substrate to form a continuous even plane from an outer surface of the laminated carrier core to the contact pad such that a region between the contact pad and the outer surface of the laminated carrier core is devoid of gap.

2. The smart card device of claim 1, wherein the laminated carrier core is dimensioned as 85.60 mm×

53.98 mm.

3. The smart card device of claim 2, wherein the contact pad is dimensioned to include at least a first contact location, a second contact location, a third contact location, a fifth contact location, a sixth contact location, a seventh location wherein

the first contact location is within 19.23 mm to 20.93 mm from an upper edge of the laminated carrier core and within 10.25 mm and 12.25 mm from a left edge of the laminated carrier core, which is adjacent to the upper edge,

the second contact location is within 21.77 mm to 23.47 mm from the upper edge and within 10.25 mm to 12.25 mm from the left edge,

the third contact location is within 24.31 mm to 26.01 mm from the upper edge and within 10.25 mm to 12.25 mm from the left edge,

the fifth contact location is within 19.23 mm to 20.93 mm from the upper edge and within 17.87 mm to 19.87 mm from the left edge,

the sixth contact location is within 21.77 mm to 23.47 mm from the upper edge and within 17.87 mm to 19.87 mm from the left edge,

the seventh contact location is within 24.31 mm to 26.01 mm from the upper edge and within 17.87 mm to 19.87 mm from the left edge,

and wherein the contact pad is dimensioned to optionally include

a fourth contact location within 26.85 mm to 28.55 mm from the upper edge and within 10.25 mm to 12.25 mm from the left edge,

an eighth contact location within 26.85 mm to 28.55 mm from the upper edge and within 17.87 mm to 19.87 mm from the left edge.

4. The smart card device of claim 3, wherein the outer surface of the laminated core includes an embossing area which is designated on the laminated carrier core and has a width of 85.47 to 85.90 mm and a height of 24.03 mm.

5. The smart card device of claim 4, wherein the embossing area is configured to be embossed with information being at least one selected from the group consisting of identification number, name and address.

6. The smart card device of claim 5, wherein the conductor pattern further includes at least one antenna coil electrically coupled to the at least one flip chip, wherein the at least one antenna coil is formed on the flexible film.

7. The smart card device of claim 1, wherein the at least one flip chip and the contact pad are arranged on opposite sides of the flexible film.

8. The smart card device of claim 7, wherein the conductor pattern further includes at least one antenna coil electrically coupled to the at least one flip chip, wherein the at least one antenna coil is formed on the flexible film.

9. The smart card device of claim 1, wherein the at least one flip chip and the contact pad are arranged on same side of the flexible film.

10. The smart card device of claim 9, wherein the conductor pattern further includes at least one antenna coil electrically coupled to the at least one flip chip, wherein the at least one antenna coil is formed on the flexible film.

11. The smart card device of claim 1, wherein the conductor pattern further includes at least one antenna coil electrically coupled to the at least one flip chip, wherein the at least one antenna coil is formed on the flexible film.

12. The smart card device of claim 11, wherein the first or the second substrate provides an encapsulation to the at least one flip chip, the encapsulation having an area and a volume which are greater than the contact pad.

13. The smart card device of claim 1, wherein the first or the second substrate provides an encapsulation to the at least one flip chip, the encapsulation having an area and a volume which are greater than the contact pad.

14. The smart card device of claim 2, wherein the conductor pattern further includes at least one antenna coil electrically coupled to the at least one flip chip, wherein the at least one antenna coil is formed on the flexible film.

15. The smart card device of claim 3, wherein the conductor pattern further includes at least one antenna coil electrically coupled to the at least one flip chip, wherein the at least one antenna coil is formed on the flexible film.

16. The smart card device of claim 4, wherein the conductor pattern further includes at least one antenna coil electrically coupled to the at least one flip chip, wherein the at least one antenna coil is formed on the flexible film.

17. The smart card device of claim 2, wherein the first or the second substrate provides an encapsulation to the at least one flip chip, the encapsulation having an area and a volume which are greater than the contact pad.

18. The smart card device of claim 3, wherein the first or the second substrate provides an encapsulation to the at least one flip chip, the encapsulation having an area and a volume which are greater than the contact pad.

19. The smart card device of claim 4, wherein the first or the second substrate provides an encapsulation to the at least one flip chip, the encapsulation having an area and a volume which are greater than the contact pad.

20. The smart card device of claim 5, wherein the first or the second substrate provides an encapsulation to the at least one flip chip, the encapsulation having an area and a volume which are greater than the contact pad.

21. The smart card device of claim 7, wherein the first or the second substrate provides an encapsulation to the at least one flip chip, the encapsulation having an area and a volume which are greater than the contact pad.

22. The smart card device of claim 9, wherein the first or the second substrate provides an encapsulation to the at least one flip chip, the encapsulation having an area and a volume which are greater than the contact pad.