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Workpiece processing method

  • US 10,559,472 B2
  • Filed: 08/24/2018
  • Issued: 02/11/2020
  • Est. Priority Date: 08/25/2017
  • Status: Active Grant
First Claim
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1. A method of processing a workpiece comprising:

  • providing a workpiece which includes a plurality of holes formed on a surface of the workpiece, wherein the plurality of holes include a small diameter hole and a large diameter hole having a diameter larger than the small diameter hole, and wherein the workpiece has an initial size difference which is a difference between the diameters of the large diameter hole and the small diameter hole;

    performing a first sequence on the workpiece, the first sequence including;

    a first process of forming a film on an inner surface of each of the plurality of holes and wherein the first process includes forming the film with a thickness on the inner surface of the small diameter hole which is smaller than a thickness of the film formed on the inner surface of the large diameter hole; and

    a second process of isotropically etching the film, and during the second process the film of the small diameter hole is etched to a small hole film inner diameter and the film of the large diameter hole is etched to a large hole film inner diameter, and wherein the workpiece has a post-etch size difference which is a difference between the large hole film inner diameter and the small hole film inner diameter, and after the isotropically etching the post-etch size difference is smaller than the initial size difference, andwherein the first process includes a film forming process using a plasma CVD method, and the film contains silicon.

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