Method for polymer-assisted chip transfer
First Claim
Patent Images
1. A method comprising:
- depositing a first adhesive layer on a first substrate, the first adhesive layer comprises a first material;
drying the first adhesive layer;
providing a second substrate with one or more chips attached;
placing the one or more chips on the first substrate through the first adhesive layer, the one or more chips attached to the second substrate;
depositing a second adhesive layer on the first substrate, the second adhesive layer covering edges of the second substrate and an edge portion of at least one of the one or more chips, the second adhesive layer not covering other portions of the one or more chips, the second adhesive layer made of a second material that is different from the first material, at least one of the first and second materials being a polymer material;
performing laser lift-off on an interface of the one or more chips and the second substrate;
removing at least the portions of the second adhesive layer covering the edges of the second substrate after performing the laser lift-off;
removing the second substrate from the one or more chips after performing the laser lift-off;
softening the first adhesive layer after removing the second substrate; and
removing the one or more chips from the first substrate.
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Abstract
One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.
63 Citations
20 Claims
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1. A method comprising:
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depositing a first adhesive layer on a first substrate, the first adhesive layer comprises a first material; drying the first adhesive layer; providing a second substrate with one or more chips attached; placing the one or more chips on the first substrate through the first adhesive layer, the one or more chips attached to the second substrate; depositing a second adhesive layer on the first substrate, the second adhesive layer covering edges of the second substrate and an edge portion of at least one of the one or more chips, the second adhesive layer not covering other portions of the one or more chips, the second adhesive layer made of a second material that is different from the first material, at least one of the first and second materials being a polymer material; performing laser lift-off on an interface of the one or more chips and the second substrate; removing at least the portions of the second adhesive layer covering the edges of the second substrate after performing the laser lift-off; removing the second substrate from the one or more chips after performing the laser lift-off; softening the first adhesive layer after removing the second substrate; and removing the one or more chips from the first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method comprising:
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securing one or more chips to a first substrate by; depositing a first adhesive layer on the first substrate, the first adhesive layer comprising a first material; providing a second substrate with one or more chips attached; placing one or more chips on the first substrate through the first adhesive layer, the one or more chips attached to the second substrate; and depositing a second adhesive layer on the first substrate, the second adhesive layer covering edges of the second substrate and an edge portion of at least one of the one or more chips, the second adhesive layer not covering other portions of the one or more chips, the second adhesive layer made of a second material that is different from the first material, at least one of the first and second materials being a polymer material; and detaching the one or more chips from the first substrate by; removing the second adhesive layer from the first substrate; softening the first adhesive layer after removing the second adhesive layer; and removing the one or more chips from the first substrate after softening the first adhesive layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification