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Wire bond wires for interference shielding

  • US 10,559,537 B2
  • Filed: 09/10/2018
  • Issued: 02/11/2020
  • Est. Priority Date: 10/12/2015
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • a substrate having an upper surface and a lower surface opposite the upper surface and having bond pads on the upper surface;

    a microelectronic device coupled to the upper surface of the substrate;

    wire bond wires having ends bonded to the bond pads;

    wherein the wire bond wires extend away from the upper surface of the substrate and are arranged in a preselected manner to shield from one or more frequencies of an interference generated by the microelectronic device;

    wherein the wire bond wires are positioned alongside of at least one side of the microelectronic device to provide a shielding region with respect to the interference; and

    a conductive surface positioned above the wire bond wires for covering at least a portion of the shielding region.

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