Semiconductor device with integrated antenna and manufacturing method therefor
First Claim
Patent Images
1. A package comprising:
- an integrated circuit embedded in an electrically non-conductive moulded material, the moulded material including at least one moulded groove pattern on at least one surface of the moulded material, and at least one electrically conductive track of conductive material disposed in the moulded groove pattern, wherein the at least one moulded groove pattern is positioned on an exterior surface of the moulded material and the moulded material is positioned between the integrated circuit and the at least one electrically conductive track of conductive material, wherein the integrated circuit is encapsulated within the moulded material, the moulded material is positioned between and in contact with both the at least one electrically conductive track of conductive material and the integrated circuit, and the at least one electrically conductive track of conductive material overlaps the integrated circuit in plan view.
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Abstract
There is disclosed a package comprising at least an integrated circuit embedded in an electrically non-conductive moulded material. The moulded material includes at least one moulded pattern on at least one surface thereof, and at least one electrically conductive track in the pattern. There is further provided at least one capacitive, inductive or galvanic component electrically connecting between at least two parts of the at least one electrically conductive track. The conductive track can be configured as antenna, and the capacitive, inductive or galvanic component is used to adjust tuning and other characteristics of the antenna.
21 Citations
24 Claims
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1. A package comprising:
an integrated circuit embedded in an electrically non-conductive moulded material, the moulded material including at least one moulded groove pattern on at least one surface of the moulded material, and at least one electrically conductive track of conductive material disposed in the moulded groove pattern, wherein the at least one moulded groove pattern is positioned on an exterior surface of the moulded material and the moulded material is positioned between the integrated circuit and the at least one electrically conductive track of conductive material, wherein the integrated circuit is encapsulated within the moulded material, the moulded material is positioned between and in contact with both the at least one electrically conductive track of conductive material and the integrated circuit, and the at least one electrically conductive track of conductive material overlaps the integrated circuit in plan view. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A device comprising:
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a moulded material comprising a groove pattern on a surface of the moulded material; an electrically conductive material disposed within the groove pattern as an electrically conductive track; and an integrated circuit embedded in the moulded material, the integrated circuit being coupled to the electrically conductive material, and the moulded material being positioned between the integrated circuit and the electrically conductive material disposed within the groove pattern, wherein the integrated circuit is encapsulated within the moulded material, the moulded material is positioned between and in contact with both the electrically conductive track and the integrated circuit, and the electrically conductive track overlaps the integrated circuit in plan view. - View Dependent Claims (21, 22)
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23. An antenna module comprising:
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an integrated circuit encapsulated within an over-moulded material; a moulded groove disposed on an exterior surface of the over-moulded material; and an electrically conductive material disposed within the moulded groove, wherein the integrated circuit is encapsulated within the over-moulded material, the over-moulded material is positioned between and in contact with both the electrically conductive material and the integrated circuit, and the electrically conductive material overlaps the integrated circuit in plan view.
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24. A package comprising:
an integrated circuit embedded in an electrically non-conductive moulded material, the moulded material including at least one moulded groove pattern on at least one surface of the moulded material, and at least one electrically conductive track of conductive material disposed in the moulded groove pattern, wherein the electrically conductive track overlaps the embedded integrated circuit in plan view of the package, the integrated circuit is encapsulated within the moulded material, and the moulded material is positioned between and in contact with both the at least one electrically conductive track and the integrated circuit.
Specification