Optical device

• US 10,559,723 B2
• Filed: 08/21/2018
• Issued: 02/11/2020
• Est. Priority Date: 08/25/2017
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Toyama, Tomoichiro
• Primary Examiner(s): Diallo, Mamadou L
• Application Number:
  US16/107,209
• Publication Number:
  US 20190067527A1
• Time in Patent Office: 539 Days
• CPC Class Codes: H01L 2224/13016 in side view
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48505 at the bonding interface
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An example of an optical device of the present disclosure includes a substrate, an obverse-surface conductive layer, a reverse-surface conductive layer, a first conductive part, an optical element and a reflector. The first conductive part extends through the substrate and overlaps with a first obverse-surface conducting region of the obverse-surface conductive layer and the reverse-surface conductive layer as viewed in a thickness direction of the substrate. The reflector has an inner surface that surrounds the optical element as viewed in the thickness direction. The optical element is located on first obverse-surface conducting region, and the second obverse-surface conducting region is located between the first obverse-surface conducting region and the inner surface of the reflector as viewed in the thickness direction. A second obverse-surface conducting region of the obverse-surface conductive layer is spaced apart from the inner surface of the reflector as viewed in the thickness direction.

Claims

1. An optical device comprising:

a substrate having an obverse surface and a reverse surface facing away from each other;

an obverse-surface conductive layer formed on the obverse surface of the substrate, the obverse-surface conductive layer including a first obverse-surface conducting region and a second obverse-surface conductive region;

a reverse-surface conductive layer formed on the reverse surface of the substrate;

a first conductive part extending through the substrate and overlapping with the first obverse-surface conducting region and the reverse-surface conductive layer as viewed in a thickness direction of the substrate;

an optical element disposed on the obverse-surface conductive layer; and

a reflector disposed on the substrate, the reflector having an inner surface that surrounds the optical element as viewed in the thickness direction,

wherein the optical element is located on the first obverse-surface conducting region, and the second obverse-surface conducting region is located between the first obverse-surface conducting region and the inner surface of the reflector as viewed in the thickness direction,

wherein the second obverse-surface conducting region is spaced apart from the inner surface of the reflector as viewed in the thickness direction, and

wherein the obverse-surface conductive layer includes a third obverse-surface conducting region that is disposed between the first obverse-surface conducting region and the second obverse-surface conducting region as viewed in the thickness direction and that connects the first obverse-surface conducting region and the second obverse-surface conducting region.

2. The optical device according to claim 1, further comprising a bonding layer disposed between and in contact with the optical element and the obverse-surface conductive layer.

3. The optical device according to claim 1,

wherein an entirety of the obverse-surface conductive layer is located inside the inner surface as viewed in the thickness direction.

4. The optical device according to claim 1,

wherein the first conductive part is located inside the inner surface as viewed in the thickness direction.

5. The optical device according to claim 1,

wherein a distance between the second obverse-surface conducting region and the inner surface is smaller than a distance between the second obverse-surface conducting region and the first obverse-surface conducting region.

6. The optical device according to claim 1,

wherein the third obverse-surface conducting region extends from the first obverse-surface conducting region in a first direction, and

wherein the third obverse-surface conducting region is smaller than the first obverse-surface conducting region in dimension in a second direction that is perpendicular to both the first direction and the thickness direction.

7. The optical device according to claim 6,

wherein the third obverse-surface conducting region is smaller than the second obverse-surface conducting region in dimension in the second direction.

8. The optical device according to claim 1, further comprising

a wire bonded to the optical element and the obverse-surface conductive layer,

wherein the obverse-surface conductive layer includes a fourth obverse-surface conducting region to which the wire is bonded, and

wherein the fourth obverse-surface conducting region is spaced apart from the inner surface of the reflector as viewed in the thickness direction.

9. The optical device according to claim 8, further comprising

a second conductive part that extends through the substrate, the second conductive part overlapping with the fourth obverse-surface conducting region and the reverse-surface conductive layer as viewed in the thickness direction of the substrate,

wherein the second conductive part is located inside the inner surface as viewed in the thickness direction.

10. The optical device according to claim 9,

wherein the reverse-surface conductive layer includes a first reverse-surface conductive region and a second reverse-surface conductive region,

wherein the first reverse-surface conductive region overlaps with the first conductive part and the reflector as viewed in the thickness direction, and

wherein the second reverse-surface conductive region overlaps with the second conductive part and the reflector as viewed in the thickness direction.

11. The optical device according to claim 1,

wherein the substrate has two side surfaces facing away from each other,

wherein the substrate has:

a first boundary between the reverse surface and one of the side surfaces; and

a second boundary between the reverse surface and the other of the side surfaces, and

wherein the reverse-surface conductive layer extends on the reverse surface of the substrate from the first boundary to the second boundary as viewed in the thickness direction.

12. The optical device according to claim 1,

wherein the reflector and the substrate contain the same material.

13. The optical device according to claim 10,

wherein the reflector is made of an opaque material.

14. An optical device comprising:

a substrate having an obverse surface and a reverse surface facing away from each other;

an obverse-surface conductive layer formed on the obverse surface of the substrate, the obverse-surface conductive layer including a first obverse-surface conducting region and a second obverse-surface conductive region;

a reverse-surface conductive layer formed on the reverse surface of the substrate;

a first conductive part extending through the substrate and overlapping with the first obverse-surface conducting region and the reverse-surface conductive layer as viewed in a thickness direction of the substrate;

an optical element disposed on the obverse-surface conductive layer;

a reflector disposed on the substrate, the reflector having an inner surface that surrounds the optical element as viewed in the thickness direction; and

a light-transmitting resin package disposed on the substrate,

wherein the optical element is located on the first obverse-surface conducting region, and the second obverse-surface conducting region is located between the first obverse-surface conducting region and the inner surface of the reflector as viewed in the thickness direction,

wherein the second obverse-surface conducting region is spaced apart from the inner surface of the reflector as viewed in the thickness direction,

wherein the light-transmitting resin package has two light-transmitting outer surfaces facing away from each other,

wherein the reflector has two reflector outer surfaces facing away from each other,

wherein each of the two light-transmitting outer surfaces and the two reflector outer surfaces is parallel to the thickness direction of the substrate, and

wherein the two light-transmitting outer surfaces are flush with the two reflector outer surfaces, respectively.

15. The optical device according to claim 14,

wherein the light-transmitting resin package has a surface curved outward in a direction from the substrate to the optical element.

16. An optical device comprising:

a substrate having an obverse surface and a reverse surface facing away from each other;

an obverse-surface conductive layer formed on the obverse surface of the substrate, the obverse-surface conductive layer including a first obverse-surface conducting region and a second obverse-surface conductive region;

a reverse-surface conductive layer formed on the reverse surface of the substrate;

a first conductive part extending through the substrate and overlapping with the first obverse-surface conducting region and the reverse-surface conductive layer as viewed in a thickness direction of the substrate;

an optical element disposed on the obverse-surface conductive layer; and

a reflector disposed on the substrate, the reflector having an inner surface that surrounds the optical element as viewed in the thickness direction,

wherein the optical element is located on the first obverse-surface conducting region, and the second obverse-surface conducting region is located between the first obverse-surface conducting region and the inner surface of the reflector as viewed in the thickness direction,

wherein an entirety of the second obverse-surface conducting region is spaced apart from the inner surface of the reflector by a predetermined distance as viewed in the thickness direction, and

wherein the obverse surface of the substrate is exposed in a region containing the predetermined distance as viewed in the thickness direction.

17. The optical device according to claim 16, wherein the predetermined distance is at least 40 μ

m.

18. The optical device according to claim 16, wherein the inner surface of the reflector is perpendicular to the obverse surface of the substrate.

19. The optical device according to claim 16, further comprising a bonding layer, wherein the reflector and the obverse surface of the substrate are spaced apart from each other via the bonding layer.

20. The optical device according to claim 19, wherein the bonding layer is smaller in thickness than the second obverse-surface conductive region.