Pin coupling based thermoelectric device

• US 10,559,738 B2
• Filed: 03/28/2019
• Issued: 02/11/2020
• Est. Priority Date: 12/05/2016
• Status: Active Grant

• Current Assignee: Nimbus Materials Inc
• Original Assignee: Sridhar Kasichainula
• Inventors: Kasichainula, Sridhar
• Primary Examiner(s): Mershon, Jayne L
• Application Number:
  US16/368,834
• Publication Number:
  US 20190229250A1
• Time in Patent Office: 320 Days
• CPC Class Codes: F24S 10/742 the conduits being parallel to each other
• CPC Class Codes: F24S 70/60 characterised by the structure or construction absorbing coatings or surface treatment for increasing absorption F24S70/20; auxiliary coatings F24S70/30
• CPC Class Codes: F24S 80/50 Elements for transmitting incoming solar rays and preventing outgoing heat radiation; Transparent coverings
• CPC Class Codes: H02S 10/30 Thermophotovoltaic systems photovoltaic cells specially adapted for conversion or sensing of infrared [IR] radiation H01L31/00; thermoelectric devices H10N10/00
• CPC Class Codes: H02S 40/44 Means to utilise heat energy, e.g. hybrid systems producing warm water and electricity at the same time directly associated with the PV cell or integrated with the PV cell H01L31/0525
• CPC Class Codes: H10N 10/01 Manufacture or treatment
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device
• CPC Class Codes: H10N 10/817 the junction being non-separable, e.g. being cemented, sintered or soldered
• CPC Class Codes: Y02E 10/44 Heat exchange systems
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y02E 10/60 Thermal-PV hybrids

Abstract

A thermoelectric device includes a flexible first substrate, and a number of sets of N and P thermoelectric legs coupled to the first substrate. Each set includes an N and a P thermoelectric leg electrically contacting each other through a conductive material on the first substrate. The thermoelectric device also includes a rigid second substrate, a conductive thin film formed on the second substrate, and a number of pins corresponding to the number of sets of N and P thermoelectric legs. Each pin couples the each set on an end thereof away from the first substrate to the conductive thin film formed on the second substrate, and is several times longer than a height of the N and P thermoelectric legs.

Claims

1. A thermoelectric device comprising:

a flexible first substrate;

a plurality of sets of N and P thermoelectric legs coupled to the first substrate, each set comprising an N thermoelectric leg and a P thermoelectric leg electrically contacting each other through a conductive material on the first substrate;

a rigid second substrate;

a conductive thin film formed on the second substrate; and

a plurality of pins corresponding to the plurality of sets of N and P thermoelectric legs, each pin coupling the each set on an end thereof away from the first substrate to the conductive thin film formed on the second substrate, and the each pin being several times longer than a height of the N thermoelectric leg and the P thermoelectric leg of the each set,

wherein a temperature difference across the N thermoelectric leg and the P thermoelectric leg of the each set on the first substrate is controlled based on at least one of;

varying a height of the each pin, varying a thickness of the each pin and replacing the each pin with another pin having a different area therefrom.

2. The thermoelectric device of claim 1, wherein the plurality of sets of N and P thermoelectric legs is deposited on the first substrate through a roll-to-roll sputtering process.

3. The thermoelectric device of claim 1, wherein the conductive thin film is formed on the second substrate through sputtering.

4. The thermoelectric device of claim 1, wherein the each pin is a pogo pin.

5. The thermoelectric device of claim 1, wherein one of:

heat and cold is configured to be applied at an end of the first substrate.

6. The thermoelectric device of claim 5, further comprising a set of terminals formed on the first substrate to measure potential difference generated based on the application of the one of:

the heat and the cold to the end of the first substrate.

7. The thermoelectric device of claim 1, wherein one of:

heat and cold is configured to be applied at an end of the second substrate.

8. The thermoelectric device of claim 7, further comprising a set of terminals formed on the first substrate to measure potential difference generated based on the application of the one of:

the heat and the cold to the end of the second substrate.

9. A thermoelectric device comprising:

a flexible first substrate;

a plurality of sets of N and P thermoelectric legs coupled to the first substrate, each set comprising an N thermoelectric leg and a P thermoelectric leg electrically contacting each other through a conductive material on the first substrate;

a rigid second substrate;

a conductive thin film formed on the second substrate; and

a plurality of pins corresponding to the plurality of sets of N and P thermoelectric legs, each pin coupling the each set on an end thereof away from the first substrate to the conductive thin film formed on the second substrate, and the each pin being several times longer than a height of the N thermoelectric leg and the P thermoelectric leg of the each set,

wherein one of;

heat and cold is configured to be applied at an end of one of;

the first substrate and the second substrate, and

wherein, in accordance with the application of the one of;

the heat and the cold at the end of the one of;

the first substrate and the second substrate, a temperature difference across the N thermoelectric leg and the P thermoelectric leg of the each set on the first substrate is controlled based on at least one of;

varying a height of the each pin, varying a thickness of the each pin and replacing the each pin with another pin having a different area therefrom.

10. The thermoelectric device of claim 9, wherein the plurality of sets of N and P thermoelectric legs is deposited on the first substrate through a roll-to-roll sputtering process.

11. The thermoelectric device of claim 9, wherein the conductive thin film is formed on the second substrate through sputtering.

12. The thermoelectric device of claim 9, wherein the each pin is a pogo pin.

13. The thermoelectric device of claim 9, further comprising a set of terminals formed on the first substrate to measure potential difference generated based on the application of the one of:

the heat and the cold to the end of the one of;

the first substrate and the second substrate.

14. A thermoelectric device comprising:

a flexible first substrate;

a plurality of sets of N and P thermoelectric legs coupled to the first substrate, each set comprising an N thermoelectric leg and a P thermoelectric leg electrically contacting each other through a conductive material on the first substrate;

a rigid second substrate;

a conductive thin film formed on the second substrate;

a plurality of pins corresponding to the plurality of sets of N and P thermoelectric legs, each pin coupling the each set on an end thereof away from the first substrate to the conductive thin film formed on the second substrate, and the each pin being several times longer than a height of the N thermoelectric leg and the P thermoelectric leg of the each set; and

a set of terminals formed on the first substrate to measure potential difference generated based on application of one of;

heat and cold at an end of the thermoelectric device,

wherein a temperature difference across the N thermoelectric leg and the P thermoelectric leg of the each set on the first substrate is controlled based on at least one of;

varying a height of the each pin, varying a thickness of the each pin and replacing the each pin with another pin having a different area therefrom.

15. The thermoelectric device of claim 14, wherein the plurality of sets of N and P thermoelectric legs is deposited on the first substrate through a roll-to-roll sputtering process.

16. The thermoelectric device of claim 14, wherein the conductive thin film is formed on the second substrate through sputtering.

17. The thermoelectric device of claim 14, wherein the each pin is a pogo pin.

18. The thermoelectric device of claim 14, wherein the one of:

the heat and the cold is configured to be applied at an end of the first substrate.

19. The thermoelectric device of claim 14, wherein the one of:

the heat and the cold is configured to be applied at an end of the second substrate.

20. The thermoelectric device of claim 14, wherein the height of the each pin is adjusted through a spring associated therewith.