Low equivalent series resistance RF filter for an active implantable medical device utilizing a ceramic reinforced metal composite filled via

• US 10,561,837 B2
• Filed: 04/23/2019
• Issued: 02/18/2020
• Est. Priority Date: 03/01/2011
• Status: Active Grant

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Stevenson, Robert A., Frysz, Christine A., Marzano, Thomas, Seitz, Keith W., Martino, Marc Gregory
• Primary Examiner(s): Wehrheim, Lindsey G
• Application Number:
  US16/391,801
• Publication Number:
  US 20190255319A1
• Time in Patent Office: 301 Days
• CPC Class Codes: A61N 1/08 Arrangements or circuits for monitoring, protecting, controlling or indicating for external stimulators A61N1/3603; for implantable neurostimulators A61N1/36128; for heart stimulators A61N1/37; for defibrillators A61N1/3925
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/12 Ceramic dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/236 leading through the housing, i.e. lead-through
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters

Abstract

A filtered feedthrough assembly for an active implantable medical device (AIMD) includes an insulator hermetically sealed to an opening of an electrically conductive ferrule. A ceramic reinforced metal composite of platinum and alumina (CRMC) material is disposed in an insulator via hole surrounding a substantially pure platinum fill. A capacitor disposed on the insulator device side has a capacitor dielectric with a dielectric constant k that is greater than 0 and less than 1000. Coming from the body fluid side to the device side of the AIMD, the capacitor is the first filter capacitor electrically connected to the substantially pure platinum fill. An active electrical connection electrically connects the substantially pure platinum fill to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and subsequently to the housing of the AIMD.

Claims

1. A filtered feedthrough assembly, comprising:

a) a hermetic feedthrough, comprising;

i) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to a housing of an active implantable medical device (AIMD) to thereby separate a body fluid side opposite a device side, wherein, when the ferrule is attached to the housing of the AIMD, the ferrule body fluid side and the ferrule device side reside outside and inside the AIMD housing, respectively;

ii) an insulator assembly disposed in the ferrule opening, the insulator assembly comprising;

A) an insulator comprising an insulator body fluid side opposite an insulator device side;

B) at least one via hole comprising a via hole inner surface extending along a longitudinal axis through the insulator to the insulator body fluid and device sides; and

C) a ceramic reinforced metal composite (CRMC) material comprising a mixture of platinum and ceramic material disposed in the at least one first via hole, wherein the CRMC material extends to a CRMC material first end residing at or adjacent to the insulator body fluid side and a CRMC material second end residing at or adjacent to the insulator device side with an inner surface of the CRMC material being spaced toward the longitudinal axis with respect to the via hole inner surface; and

D) a substantially pure metal fill surrounded by the CRMC material in the at least one via hole;

iii) a first gold braze hermetically sealing the insulator to the ferrule;

b) at least one capacitor disposed on the insulator device side, the capacitor comprising;

i) a capacitor dielectric supporting at least one active electrode plate interleaved in a capacitive relationship with at least one ground electrode plate, wherein the capacitor dielectric has a dielectric constant k that is greater than 0 but less than 1,000;

ii) a capacitor active metallization contacting the capacitor dielectric and being electrically connected to the at least one active electrode plate; and

iii) a capacitor ground metallization contacting the capacitor dielectric and being electrically connected to the at least one ground electrode plate; and

c) an active electrical connection electrically connecting the substantially pure metal fill in the at least one insulator via hole to the capacitor active metallization; and

d) a ground electrical connection electrically connecting the capacitor ground metallization to the ferrule.

2. The filtered feedthrough assembly of claim 1, wherein the CRMC material comprises platinum and, by weight or by volume, about 15% to about 80% alumina.

3. The filtered feedthrough assembly of claim 1, wherein substantially pure metal fill is a substantially pure platinum fill.

4. The filtered feedthrough assembly of claim 3, wherein both the substantially pure platinum fill and the CRMC material extend to the insulator body fluid and device sides.

5. The filtered feedthrough assembly of claim 3, wherein the CRMC material disposed in the at least one insulator via hole extends to a CRMC material first end and a CRMC material second end, the CRMC material first end being spaced inwardly from the insulator body fluid side and the CRMC material second end being spaced inwardly from the insulator device side, and wherein the substantially pure platinum fill comprises a platinum fill body fluid side portion and a platinum fill device side portion, the platinum fill body fluid side portion extending from the inwardly spaced CRMC material first end to the insulator body fluid side and the platinum fill device side portion extending from the inwardly spaced CRMC material second end to the insulator device side so that the CRMC material is disposed in the at least one via hole surrounding the substantially pure platinum fill between the platinum fill body fluid side and device side portions.

6. The filtered feedthrough assembly of claim 3, wherein the CRMC material disposed in the at least one insulator via hole extends to a CRMC material first end and a CRMC material second end, the CRMC material first end being spaced inwardly from the insulator body fluid side and the CRMC material second end being spaced inwardly from the insulator device side, and wherein the substantially pure platinum fill comprises a platinum fill body fluid side portion and a platinum fill device side portion, the platinum fill body fluid side portion extending from the inwardly spaced CRMC material first end towards but spaced inwardly from the insulator body fluid side and the platinum fill device side portion extending from the inwardly spaced CRMC material second end towards but spaced from the insulator device side so that the CRMC material is disposed in the at least one via hole surrounding the substantially pure platinum fill between the platinum fill body fluid side and device side portions, and wherein a body fluid side platinum end cap extends from the platinum fill body fluid side portion to the insulator body fluid side and a device side platinum end cap extends from the platinum fill device side portion to the insulator device side.

7. The filtered feedthrough assembly of claim 1, wherein a platinum wire extends through the substantially pure metal fill so that the substantially pure metal fill is disposed between the CRMC material and the platinum wire.

8. The filtered feedthrough assembly of claim 7, wherein the platinum wire is exposed at at least one of the insulator body fluid and device sides.

9. The filtered feedthrough assembly of claim 1, wherein the substantially pure metal fill is a platinum wire extending to the insulator body fluid and device sides.

10. The filtered feedthrough assembly of claim 1, wherein an insulator metallization is disposed on an outer surface of the insulator, and wherein the first gold braze hermetically seals between the ferrule and the insulator metallization on the outer surface of the insulator.

11. The filtered feedthrough assembly of claim 10, wherein the insulator metallization comprises an adhesion layer disposed on the insulator outer surface and a wetting layer disposed on the adhesion layer, and wherein the adhesion layer is titanium and the wetting layer is at least one of molybdenum and niobium.

12. The filtered feedthrough assembly of claim 1, wherein the at least one capacitor is selected from the group consisting of a monolithic ceramic feedthrough filter capacitor, an internally grounded feedthrough capacitor, a hybrid internally grounded feedthrough capacitor, a flat-through capacitor, an MLCC chip capacitor, and an X2Y attenuator.

13. The filtered feedthrough assembly of claim 1, wherein the at least one capacitor is a multi-element broadband lowpass filter having at least one inductor, the multi-element broadband lowpass filter forming one of the group consisting of an L-filter, a reverse L-filter, an LL-filter, a reverse LL-filter, a T-filter, a Pi-filter, and an n-element lowpass filter.

14. The filtered feedthrough assembly of claim 1, wherein the ferrule comprises a device side end surface having at least one pocket formed therein with a gold pocket-pad disposed in the at least one pocket, and wherein at least a portion of the ground electrical connection physically contacts the gold pocket-pad to thereby form an oxide-resistant electrical attachment of the capacitor ground electrode plate to the ferrule.

15. The filtered feedthrough assembly of claim 1, wherein the at least one capacitor is a feedthrough capacitor, and wherein the capacitor active metallization is disposed in a first passageway extending through the feedthrough capacitor with the active metallization electrically connecting the substantially pure metal fill in the at least one insulator via hole to the capacitor active metallization in the first passageway, and the capacitor ground metallization is disposed on an outer perimeter surface of the capacitor dielectric with the ground electrical connection electrically connecting the capacitor ground metallization to the ferrule.

16. The filtered feedthrough assembly of claim 15, wherein a capacitor first perimeter edge of the at least one capacitor extends outwardly beyond a ferrule first perimeter edge of the ferrule, and a capacitor second perimeter edge is recessed inwardly from a ferrule second perimeter edge with the capacitor ground metallization being disposed on at least a portion of the capacitor second perimeter edge, and wherein the ground electrical connection electrically connects the capacitor ground metallization disposed on the capacitor second perimeter edge to the ferrule.

17. The filtered feedthrough assembly of claim 16, wherein the at least one capacitor is a rectangular-shaped capacitor.

18. The filtered feedthrough assembly of claim 16, wherein the ferrule comprises a device side end surface having at least one pocket formed therein with a gold pocket-pad disposed in the at least one pocket, and wherein at least a portion of the ground electrical connection physically connects the capacitor ground metallization disposed on the capacitor second perimeter edge to the gold pocket-pad to thereby form an oxide-resistant attachment of the capacitor ground electrode plate to the ferrule.

19. The filtered feedthrough assembly of claim 1, wherein the at least one capacitor is an internally grounded feedthrough capacitor with the capacitor ground metallization electrically connected to the at least one ground electrode plate being disposed in a second passageway extending through the feedthrough capacitor and with the ground electrical connection electrically connecting the capacitor ground metallization disposed in the second passageway to the ferrule.

20. The filtered feedthrough assembly of claim 19, wherein an outer perimeter surface of the capacitor dielectric for the internally grounded feedthrough capacitor is devoid of the capacitor ground metallization.

21. The filtered feedthrough assembly of claim 19, wherein the ferrule comprises either a peninsula extending into the ferrule opening or a bridge extending across the ferrule opening, and wherein a ground conductive leadwire disposed through the second passageway of the internally grounded feedthrough capacitor is electrically connected to the at least one ground electrode plate of the capacitor and to the ferrule peninsula or ferrule bridge by the ground electrical connection.

22. The filtered feedthrough assembly of claim 19, wherein the internally grounded feedthrough capacitor is a hybrid internally grounded feedthrough capacitor with an outer portion of the capacitor ground metallization contacting at least a portion of an outer perimeter surface of the capacitor dielectric and being electrically connected to the at least one ground electrode plate of the at least one capacitor and with the ground electrical connection electrically connecting the outer portion of the capacitor ground metallization to the ferrule.

23. The filtered feedthrough assembly of claim 22, wherein the ground electrical connection electrically connects the outer portion of the capacitor ground metallization contacting the outer perimeter of the capacitor dielectric to the first gold braze hermetically sealing the insulator to the ferrule.

24. The filtered feedthrough assembly of claim 22, wherein the ferrule comprises a device side end surface having at least one pocket formed therein with a gold pocket-pad disposed in the at least one pocket, and wherein at least a portion of the ground electrical connection physically contacts the gold pocket-pad to thereby form an oxide-resistant attachment of the capacitor ground electrode plate to the ferrule.

25. The filtered feedthrough assembly of claim 24, wherein:

a) a capacitor first perimeter edge of the at least one capacitor extends outwardly beyond a ferrule first perimeter edge of the ferrule, and a capacitor second perimeter edge is recessed inwardly from a ferrule second perimeter edge with the capacitor ground metallization being disposed on at least a portion of the capacitor second perimeter edge, and wherein the capacitor ground metallization contacts at least a portion of the capacitor second perimeter edge of the at least one capacitor, and

b) wherein the ferrule comprises a device side end surface having at least one pocket formed therein with a gold pocket-pad disposed in the at least one pocket, and

c) wherein the ground electrical connection electrically connects the capacitor ground metallization contacting the capacitor second perimeter edge to the gold pocket-pad to thereby form an oxide-resistant electrical attachment of the capacitor ground electrode plate to the ferrule.

26. The filtered feedthrough assembly of claim 1, wherein the at least one capacitor is an MLCC chip capacitor.

27. The filtered feedthrough assembly of claim 26, wherein the MLCC chip capacitor is mounted to a circuit board, and wherein the circuit board is mounted to at least one of the ferrule and the insulator.

28. The filtered feedthrough assembly of claim 27, wherein at least one circuit board ground plate is disposed externally on or internally in the circuit board, and wherein a second ground electrical connection electrically connects the at least one circuit board ground plate to the capacitor ground metallization electrically connected to the at least one ground plate of the at least one capacitor, and a third ground electrical connection electrically connects that at least one circuit board ground plate to the ferrule.

29. The filtered feedthrough assembly of claim 28, wherein the ferrule comprises a device side end surface having at least one pocket formed therein with a gold pocket-pad disposed in the at least one pocket, and wherein the third ground electrical connection electrically connects the at least one circuit board ground plate to the gold pocket-pad to thereby form an oxide-resistant attachment of the capacitor ground electrode plate to the ferrule.

30. The filtered feedthrough assembly of claim 27, wherein at least one internal circuit board ground plate is disposed internally in the circuit board and at least one external circuit board ground plate is disposed externally on the circuit board, the external ground plate being located between the circuit board and at least one of the insulator and the ferrule, and wherein the at least one internal and external circuit board ground plates are electrically connected to the capacitor ground metallization of the at least one capacitor and to the ferrule.

31. The filtered feedthrough assembly of claim 1, further comprising an oxide-resistant metal addition laser welded or brazed to the ferrule, the metal addition being of a different metal in comparison to the ferrule, wherein the ground electrical connection is electrically connected to the oxide-resistant metal addition.

32. The filtered feedthrough assembly of claim 1, wherein at least a portion of the ground electrical connection physically contacts the first gold braze.

33. The filtered feedthrough assembly of claim 1, wherein the active and ground electrical connections comprise an anisotropic film that is disposed between the at least one capacitor and the insulator.

34. The filtered feedthrough assembly of claim 1, wherein the at least one capacitor is the first filter capacitor on the ferrule device side that is electrically connected to the substantially pure metal fill disposed in the at least one via hole of the insulator.

35. The filtered feedthrough assembly of claim 1, wherein an equivalent series resistance (ESR) is the sum of a dielectric loss plus an ohmic loss of the at least one capacitor, and wherein a dielectric loss tangent of the at least one capacitor measured in ohms at an MRI RF pulsed frequency is greater than zero but less than five percent of the capacitor'"'"'s ESR.

36. The filtered feedthrough assembly of claim 35, wherein the ESR of the at least one capacitor at an MRI RF pulsed frequency is greater than zero, but less than 0.5 ohm.

37. The filtered feedthrough assembly of claim 35, wherein the ESR of the at least one capacitor at an MRI RF pulsed frequency is greater than zero but less than 2.0 ohms.

38. The filtered feedthrough assembly of claim 1, wherein the at least one capacitor has a capacitance ranging from 10 and 20,000 picofarads.

39. The filtered feedthrough assembly of claim 35, wherein the MRI RF pulsed frequency is 64 MHz or 128 MHz or, is a range of frequencies centered at 64 MHz or 128 MHz.