Metal oxy-flouride films based on oxidation of metal flourides
First Claim
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1. A method comprising:
- performing atomic layer deposition (ALD), chemical vapor deposition (CVD) or electron beam ion assisted deposition (EB-IAD) to deposit a yttrium-based fluoride coating having a thickness of about 10 nm to about 10 microns onto a surface of a chamber component for a processing chamber;
heating the chamber component to an elevated temperature of about 150-1500°
C.;
exposing the chamber component to an oxygen source comprising an oxygen-based plasma or radicals at the elevated temperature for a duration of about 0.1-72 hours; and
converting the yttrium-based fluoride coating into a yttrium-based oxy-fluoride coating.
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Abstract
An article comprises a body having a coating. The coating comprises a Y-O-F coating or other yttrium-based oxy-fluoride coating generated either by performing a fluorination process on a yttrium-based oxide coating or an oxidation process on a yttrium-based fluorine coating.
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Citations
9 Claims
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1. A method comprising:
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performing atomic layer deposition (ALD), chemical vapor deposition (CVD) or electron beam ion assisted deposition (EB-IAD) to deposit a yttrium-based fluoride coating having a thickness of about 10 nm to about 10 microns onto a surface of a chamber component for a processing chamber; heating the chamber component to an elevated temperature of about 150-1500°
C.;exposing the chamber component to an oxygen source comprising an oxygen-based plasma or radicals at the elevated temperature for a duration of about 0.1-72 hours; and converting the yttrium-based fluoride coating into a yttrium-based oxy-fluoride coating. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification