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Temperature-triggered fuse device and method of production thereof

  • US 10,566,164 B2
  • Filed: 04/27/2017
  • Issued: 02/18/2020
  • Est. Priority Date: 04/27/2017
  • Status: Active Grant
First Claim
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1. A temperature-triggered fuse device for protection against power surges and thermal runaways in an electronic circuit, the temperature-triggered fuse device comprising:

  • a base substrate;

    a first metal pad and a second metal pad located on top of the base substrate or on a sputtered seed layer on top of the base substrate, wherein inner edges of the first metal pad and the second metal pad are separated by a gap formed on the base substrate;

    an electrically-insulating de-wetting film located on top of the base substrate and below the gap;

    a first wetting material bay positioned on top of an inner segment of the first metal pad, and a first de-wetting material bay positioned on top of an outer segment of the first metal pad;

    a second wetting material bay positioned on top of an inner segment of the second metal pad, and a second de-wetting material bay positioned on top of an outer segment of the second metal pad; and

    a solder bridge or a solder ball placed on top of an inner segment of the first wetting material bay and an inner segment of the second wetting material bay across the gap on the base substrate coated with the electrically-insulating de-wetting film, wherein the solder bridge or the solder ball is configured to break apart due to a wetting force, when a surrounding temperature rises to an ambient threshold temperature in the temperature-triggered fuse device.

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