Semiconductor device manufacturing method and soldering support jig
First Claim
Patent Images
1. A soldering support jig comprising:
- a columnar covering member having a covering surface at a bottom of the columnar covering member, whereinthe soldering support jig is used for a substrate, the substrate having an arrangement area on which a component is to be arranged and a connection area to which a wiring member is to be directly connected, the connection area neighboring the arrangement area, andthe covering surface of the soldering support jig is formed to correspond to the connection area.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device manufacturing method includes: applying solder to an arrangement area of a substrate, the substrate having a connection area to which a wiring member is to be directly connected, the connection area neighboring the arrangement area; arranging a component on the arrangement area via the solder; and soldering the component to the arrangement area by heating the solder while covering the connection area. A soldering support jig includes a columnar covering member having a covering surface at a bottom of the columnar covering member.
1 Citation
7 Claims
-
1. A soldering support jig comprising:
-
a columnar covering member having a covering surface at a bottom of the columnar covering member, wherein the soldering support jig is used for a substrate, the substrate having an arrangement area on which a component is to be arranged and a connection area to which a wiring member is to be directly connected, the connection area neighboring the arrangement area, and the covering surface of the soldering support jig is formed to correspond to the connection area. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
Specification