Manufacturable multi-emitter laser diode
First Claim
1. A multi-emitter laser diode device, the laser diode device comprising:
- a carrier chip singulated from a carrier wafer, the carrier chip being characterized by a length and a width;
a plurality of epitaxial mesa dice regions transferred to the carrier chip from a substrate and attached to the carrier chip with a bonding material at a bond region, the substrate having multiple epitaxial mesa dice regions positioned at an epitaxial wafer die pitch, the epitaxial wafer die pitch being designated as a first pitch;
each of the epitaxial mesa dice regions arranged on the carrier chip in a substantially parallel configuration and positioned at a second pitch defining the distance between adjacent epitaxial mesa dice regions, each of the plurality of epitaxial mesa dice regions comprising epitaxial material;
the epitaxial material comprising an n-type cladding region, an active region comprising at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the at least one active layer;
a plurality of laser diode stripe regions formed in a ridge region in a top portion of the plurality of epitaxial mesa dice regions and away from the bonding material in the bond region;
each of the laser diode stripe regions configured with a pair of facets wherein a first facet is configured on a first end of the stripe and a second facet is configured on the second end of the stripe region to form a cavity region; and
wherein a pair of the laser diode stripe regions is spaced by a third pitch from an adjacent pair of the laser diode stripe regions, wherein a pair of the laser diode stripe regions form a multiple-stripe laser die, the second pitch is a first integer multiple, N, of the epitaxial wafer die pitch, and the third pitch is a second integer multiple, M, of the epitaxial wafer die pitch, wherein N≥
1 and M>
N.
1 Assignment
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Accused Products
Abstract
A multi-emitter laser diode device includes a carrier chip singulated from a carrier wafer. The carrier chip has a length and a width, and the width defines a first pitch. The device also includes a plurality of epitaxial mesa dice regions transferred to the carrier chip from a substrate and attached to the carrier chip at a bond region. Each of the epitaxial mesa dice regions is arranged on the carrier chip in a substantially parallel configuration and positioned at a second pitch defining the distance between adjacent epitaxial mesa dice regions. Each of the plurality of epitaxial mesa dice regions includes epitaxial material, which includes an n-type cladding region, an active region having at least one active layer region, and a p-type cladding region. The device also includes one or more laser diode stripe regions, each of which has a pair of facets forming a cavity region.
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Citations
19 Claims
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1. A multi-emitter laser diode device, the laser diode device comprising:
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a carrier chip singulated from a carrier wafer, the carrier chip being characterized by a length and a width; a plurality of epitaxial mesa dice regions transferred to the carrier chip from a substrate and attached to the carrier chip with a bonding material at a bond region, the substrate having multiple epitaxial mesa dice regions positioned at an epitaxial wafer die pitch, the epitaxial wafer die pitch being designated as a first pitch;
each of the epitaxial mesa dice regions arranged on the carrier chip in a substantially parallel configuration and positioned at a second pitch defining the distance between adjacent epitaxial mesa dice regions, each of the plurality of epitaxial mesa dice regions comprising epitaxial material;
the epitaxial material comprising an n-type cladding region, an active region comprising at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the at least one active layer;a plurality of laser diode stripe regions formed in a ridge region in a top portion of the plurality of epitaxial mesa dice regions and away from the bonding material in the bond region; each of the laser diode stripe regions configured with a pair of facets wherein a first facet is configured on a first end of the stripe and a second facet is configured on the second end of the stripe region to form a cavity region; and wherein a pair of the laser diode stripe regions is spaced by a third pitch from an adjacent pair of the laser diode stripe regions, wherein a pair of the laser diode stripe regions form a multiple-stripe laser die, the second pitch is a first integer multiple, N, of the epitaxial wafer die pitch, and the third pitch is a second integer multiple, M, of the epitaxial wafer die pitch, wherein N≥
1 and M>
N. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification