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Thermally conductive substrate article

  • US 10,568,233 B2
  • Filed: 03/07/2013
  • Issued: 02/18/2020
  • Est. Priority Date: 06/28/2012
  • Status: Active Grant
First Claim
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1. An article comprising:

  • a flexible thermally conductive polymeric layer comprising an epoxy resin and a long-strand polymeric nonwoven material embedded in the epoxy resin, wherein the polymeric nonwoven material is heat stable at about 280°

    C., and wherein the polymeric nonwoven material is a chemically etched polymeric nonwoven material having a density less than about 7 g/m2.

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