Heat pipe with non-condensable gas

• US 10,571,201 B2
• Filed: 12/01/2017
• Issued: 02/25/2020
• Est. Priority Date: 12/01/2017
• Status: Active Grant

• Current Assignee: Celsia Technologies Taiwan, Inc.
• Original Assignee: Celsia Technologies Taiwan, Inc.
• Inventors: Meyer, IV, George A., Sun, Chien-Hung
• Primary Examiner(s): Norman, Marc E
• Application Number:
  US15/828,559
• Publication Number:
  US 20190170447A1
• Time in Patent Office: 816 Days
• CPC Class Codes: F28D 1/035 with U-flow or serpentine-flow inside the conduits F28D1/0341 takes precedence
• CPC Class Codes: F28D 1/0383 with U-flow or serpentine-flow inside the conduits
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 3/042 in the form of local deformations of the element
• CPC Class Codes: F28F 3/044 the deformations being pontual, e.g. dimples
• CPC Class Codes: F28F 3/046 the deformations being linear, e.g. corrugations
• CPC Class Codes: H05K 7/20127 Natural convection
• CPC Class Codes: H05K 7/202 Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps

Abstract

A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.

Claims

1. A heat pipe with a non-condensable gas, comprising:

a thermal conductor, having a hollow chamber, a heat-absorbing side attached to a heat-generating electronic component, and exothermal side thermally conductively coupled to a radiator, and the exothermal side having at least one protrusion formed thereon, and the exothermal side reducing the contact area with the radiator by the at least one protrusion;

a working fluid, filled into the hollow chamber;

a non-condensable gas, filled into the hollow chamber, and the heat pipe lowering the conduction efficiency by the non-condensable gas and the at least one protrusion, so that the heat-generating electronic component achieves a work efficiency in an operation within a working temperature range;

a plurality of blocking portions staggered with respect to each other and disposed in the hollow chamber and capable of extending a flow path of the working fluid,

wherein the blocking portions are concavely extended from the inner wall of the thermal conductor and in a direction towards the interior of the thermal conductor.

2. The heat pipe with a non-condensable gas according to claim 1, wherein the at least one protrusion is disposed on the exothermal side and at an end proximate to the heat-generating electronic component.

3. The heat pipe with a non-condensable gas according to claim 1, wherein the at least one protrusion comprises a plurality of protrusions and the protrusions are disposed with an interval apart from one another.

4. The heat pipe with a non-condensable gas according to claim 3, wherein the protrusions are in a wavy shape.

5. The heat pipe with a non-condensable gas according to claim 1, wherein the at least one protrusion is protruded from an inner wall of the thermal conductor and in a direction towards an outer side of the thermal conductor.

6. The heat pipe with a non-condensable gas according to claim 1, wherein the non-condensable gas is air.

7. The heat pipe with a non-condensable gas according to claim 1, wherein the blocking portions are coupled to an inner wall surface of the thermal conductor.

8. The heat pipe with a non-condensable gas according to claim 1, wherein the blocking portions are disposed at an end of the thermal conductor away from the heat-generating electronic component.