Hybrid touch module
First Claim
1. A hybrid touch module, comprising:
- a bottom layer structure including;
a substrate;
a conductive layer disposed on a top face of the substrate; and
a bezel disposed on the conductive layer;
a common layer structure disposed on the bezel and spaced apart from the conductive layer, and the common layer structure including;
a common film having a first surface and a second surface opposite to the first surface, and the first surface facing the top face of the substrate;
a resistive conductive layer disposed on the first surface of the common film; and
a capacitive conductive layer disposed on one of the first surface and the second surface of the common film; and
a top layer structure attached to the common layer structure, and the top layer structure including;
an insulation film having a bottom face facing the second surface of the common film; and
an electrode layer disposed on the insulation film;
wherein the common layer structure is capable of being cooperated with the bottom layer structure so as to provide a resistive touch function, and the common layer structure is capable of being cooperated with the top layer structure so as to provide a capacitive touch function;
wherein the resistive conductive layer and the capacitive conductive layer are commonly disposed on the first surface of the common film and are spaced apart from each other, and the electrode layer is disposed on the bottom face of the insulation film;
wherein the resistive conductive layer surrounds a plurality of accommodating grooves, and the capacitive conductive layer is disposed in the accommodating grooves.
1 Assignment
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Accused Products
Abstract
A hybrid touch module includes a bottom layer structure, a common layer structure, and a top layer structure. The bottom layer structure includes a conductive layer, and a bezel disposed on the conductive layer. The common layer structure is disposed on the bezel. The common layer structure includes a common film, a resistive conductive layer, and a capacitive conductive layer. The resistive conductive layer and the capacitive conductive layer are disposed on a first surface of the common film. The top layer structure is attached to the common layer structure, and the top layer structure includes an insulation film and an electrode layer disposed on the insulation film. The common layer structure can be cooperated with the bottom layer structure to provide a resistive touch function, and the common layer structure can be cooperated with the top layer structure to provide a capacitive touch function.
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Citations
4 Claims
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1. A hybrid touch module, comprising:
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a bottom layer structure including; a substrate; a conductive layer disposed on a top face of the substrate; and a bezel disposed on the conductive layer; a common layer structure disposed on the bezel and spaced apart from the conductive layer, and the common layer structure including; a common film having a first surface and a second surface opposite to the first surface, and the first surface facing the top face of the substrate; a resistive conductive layer disposed on the first surface of the common film; and a capacitive conductive layer disposed on one of the first surface and the second surface of the common film; and a top layer structure attached to the common layer structure, and the top layer structure including; an insulation film having a bottom face facing the second surface of the common film; and an electrode layer disposed on the insulation film; wherein the common layer structure is capable of being cooperated with the bottom layer structure so as to provide a resistive touch function, and the common layer structure is capable of being cooperated with the top layer structure so as to provide a capacitive touch function; wherein the resistive conductive layer and the capacitive conductive layer are commonly disposed on the first surface of the common film and are spaced apart from each other, and the electrode layer is disposed on the bottom face of the insulation film; wherein the resistive conductive layer surrounds a plurality of accommodating grooves, and the capacitive conductive layer is disposed in the accommodating grooves. - View Dependent Claims (2, 3, 4)
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Specification