Micro-transfer printing with selective component removal
First Claim
1. A method of micro-transfer printing, comprising:
- providing a component source wafer having micro-transfer printable components disposed on or in the component source wafer, wherein selected ones of the micro-transfer printable components are selected components and the micro-transfer printable components that are not selected are non-selected components;
providing a stamp comprising a body and spaced-apart posts protruding away from the body, the posts having a spatial distribution on the body matched to a spatial distribution of the micro-transfer printable components on or in the component source wafer;
providing a light source;
contacting each of the posts to a component of the micro-transfer printable components to adhere the component to the post, wherein posts contacting the selected components are selected posts and posts contacting the non-selected components are non-selected posts;
removing the stamp with the adhered components from the component source wafer; and
irradiating each of the selected posts through the body with light from the light source to detach the selected components adhered to the selected posts from the selected posts, leaving the non-selected components adhered to the non-selected posts,wherein the body and the posts are substantially transparent to the light.
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Accused Products
Abstract
An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.
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Citations
20 Claims
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1. A method of micro-transfer printing, comprising:
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providing a component source wafer having micro-transfer printable components disposed on or in the component source wafer, wherein selected ones of the micro-transfer printable components are selected components and the micro-transfer printable components that are not selected are non-selected components; providing a stamp comprising a body and spaced-apart posts protruding away from the body, the posts having a spatial distribution on the body matched to a spatial distribution of the micro-transfer printable components on or in the component source wafer; providing a light source; contacting each of the posts to a component of the micro-transfer printable components to adhere the component to the post, wherein posts contacting the selected components are selected posts and posts contacting the non-selected components are non-selected posts; removing the stamp with the adhered components from the component source wafer; and irradiating each of the selected posts through the body with light from the light source to detach the selected components adhered to the selected posts from the selected posts, leaving the non-selected components adhered to the non-selected posts, wherein the body and the posts are substantially transparent to the light. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification