Oxygen inserted Si-layers in vertical trench power devices
First Claim
1. A semiconductor device;
- comprising;
a gate trench extending into a Si substrate;
a body region in the Si substrate adjacent the gate trench;
a source region in the Si substrate above the body region;
a contact trench extending into the Si substrate and filled with an electrically conductive material which contacts the source region at a sidewall of the contact trench and a highly doped body contact region at a bottom of the contact trench;
a diffusion barrier structure formed along the sidewall of the gate trench, the diffusion barrier structure comprising alternating layers of Si and oxygen-doped Si and a Si capping layer on the alternating layers of Si and oxygen-doped Si; and
a channel region formed in the Si capping layer and which vertically extends along the sidewall of the gate trench.
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0 Petitions
Accused Products
Abstract
A semiconductor device includes a gate trench extending into a Si substrate, a body region in the Si substrate adjacent the gate trench, a source region in the Si substrate above the body region, a contact trench extending into the Si substrate and filled with an electrically conductive material which contacts the source region at a sidewall of the contact trench and a highly doped body contact region at a bottom of the contact trench, a diffusion barrier structure formed along the sidewall of the gate trench, the diffusion barrier structure comprising alternating layers of Si and oxygen-doped Si and a Si capping layer on the alternating layers of Si and oxygen-doped Si, and a channel region formed in the Si capping layer and which vertically extends along the sidewall of the gate trench. Corresponding methods of manufacture are also described.
20 Citations
24 Claims
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1. A semiconductor device;
- comprising;
a gate trench extending into a Si substrate; a body region in the Si substrate adjacent the gate trench; a source region in the Si substrate above the body region; a contact trench extending into the Si substrate and filled with an electrically conductive material which contacts the source region at a sidewall of the contact trench and a highly doped body contact region at a bottom of the contact trench; a diffusion barrier structure formed along the sidewall of the gate trench, the diffusion barrier structure comprising alternating layers of Si and oxygen-doped Si and a Si capping layer on the alternating layers of Si and oxygen-doped Si; and a channel region formed in the Si capping layer and which vertically extends along the sidewall of the gate trench. - View Dependent Claims (2, 3, 4, 5)
- comprising;
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6. A method of manufacturing a semiconductor device, the method comprising:
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forming a gate trench which extends into a Si substrate; forming a body region in the Si substrate adjacent the gate trench; forming a source region in the Si substrate above the body region; forming a contact trench which extends into the Si substrate and is filled with an electrically conductive material which contacts the source region at a sidewall of the contact trench and a highly doped body contact region at a bottom of the contact trench; forming a diffusion barrier structure along the sidewall of the gate trench, the diffusion barrier structure comprising alternating layers of Si and oxygen-doped Si and a Si capping layer on the alternating layers of Si and oxygen-doped Si; and forming a channel region in the Si capping layer and which vertically extends along the sidewall of the gate trench. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification