Insert molding around glass members for portable electronic devices

• US 10,575,421 B2
• Filed: 05/24/2018
• Issued: 02/25/2020
• Est. Priority Date: 11/11/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Pakula, David, Lynch, Stephen Brian, Dinh, Richard Hung Minh, Tan, Tang Yew, Tan, Lee Hua
• Primary Examiner(s): Ngo, Hung V
• Application Number:
  US15/989,133
• Publication Number:
  US 20180270976A1
• Time in Patent Office: 642 Days
• CPC Class Codes: A45C 11/00 Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 specially adapted for toiletry or cosmetic equipment A45D29/20, A45D44/18; travelling sewing kits A45F3/48
• CPC Class Codes: A45F 5/00 Holders or carriers for hand articles; Holders or carriers for use while travelling or camping
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: H02G 11/02 using take-up reel or drum
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0266 for a display module assembly
• CPC Class Codes: H05K 5/0017 with operator interface units
• CPC Class Codes: H05K 5/03 Covers

Abstract

An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.

Claims

1. An electronic device, comprising:

a support structure;

a first glass cover member having an edge and coupled to the support structure, the first glass cover member defining a front exterior surface of the electronic device;

a first support member molded to the first glass cover member and having a portion positioned between the edge of the first glass cover member and the support structure;

a display positioned below the first glass cover member;

a second glass cover member having an edge and coupled to the support structure opposite to the first glass cover member, the second glass cover member defining a rear exterior surface of the electronic device; and

a second support member molded to the second glass cover member and having a portion positioned between the edge of the second glass cover member and the support structure.

2. The electronic device of claim 1, wherein the first glass cover member, the second glass cover member, and the support structure form at least a portion of an external sidewall that extends along sides of the electronic device.

3. The electronic device of claim 1, wherein the first glass cover member and the first support member form a gap-free interface.

4. An electronic device housing, comprising:

a first glass cover member comprising at least one of a rounded or chamfered edge and defining a front exterior surface of an electronic device;

a second glass cover member comprising at least one of a rounded or chamfered edge and defining a rear exterior surface of the electronic device;

a support structure positioned between the first glass cover member and the second glass cover member and defining at least a portion of an exterior side surface of the electronic device housing;

a first interior support member molded against at least a portion of the at least one of the rounded or chamfered edge of the first glass cover member and coupled to the support structure; and

a second interior support member molded against at least a portion of the at least one of the rounded or chamfered edge of the second glass cover member and coupled to the support structure.

5. The electronic device housing of claim 4, wherein:

the first glass cover member defines a first portion of the exterior side surface;

the second glass cover member defines a second portion of the exterior side surface; and

the support structure defines a third portion of the exterior side surface.

6. The electronic device housing of claim 4, wherein:

the first and the second interior support members are formed from a polymer; and

the support structure is formed from a metal.

7. The electronic device housing of claim 4, wherein:

the electronic device housing further comprises a display; and

the first glass cover member is situated in front of the display forming part of a display area of the electronic device housing.

8. The electronic device housing of claim 4, wherein the first and the second glass cover members comprise a rounded edge.

9. The electronic device housing of claim 4, wherein the first glass cover member and the support structure define a gapless interface.

10. The electronic device housing of claim 4, wherein the first glass cover member, the second glass cover member, and the support structure form at least a portion of an external surface of an external sidewall of the electronic device housing.

11. A method of assembling an electronic device, comprising:

molding a first support member around a periphery of a first interior surface of a first glass cover member, the first glass cover member defining a front exterior surface of the electronic device;

molding a second support member around a periphery of a second interior surface of a second glass cover member, the second glass cover member defining a rear exterior surface of the electronic device, the rear exterior surface being opposite to the front exterior surface;

securing the first interior surface of the first glass cover member to a front side of a support structure; and

securing the second interior surface of the second glass cover member to a rear side of the support structure.

12. The method of assembling the electronic device of claim 11, wherein electrical components are placed within an internal space defined between the first glass cover member and the second glass cover member.

13. The method of assembling the electronic device of claim 11, wherein a thickness of the first glass cover member is about 0.3-1.0 mm.

14. The method of assembling the electronic device of claim 11, wherein at least one of the first glass cover member or the second glass cover member comprises a rounded edge.

15. The method of assembling the electronic device of claim 11, further comprising:

a first interior support member positioned adjacent to the periphery of the first interior surface of the first glass cover member and adjacent to the support structure.

16. The method of assembling the electronic device of claim 15, wherein:

the first interior support member is formed from a first metal; and

the support structure is formed from a second metal that is different from the first metal.