Forward viewing camera module for vehicular vision system

• US 10,576,908 B2
• Filed: 02/25/2019
• Issued: 03/03/2020
• Est. Priority Date: 05/09/2014
• Status: Active Grant

• Current Assignee: Magna Electronics Incorporated (Magna International Incorporated)
• Original Assignee: Magna Electronics Incorporated (Magna International Incorporated)
• Inventors: Achenbach, Garret F., Gorman, Brian A., Smith, Brian F., Gebauer, Steven G.
• Primary Examiner(s): Walker, Jared
• Application Number:
  US16/283,920
• Publication Number:
  US 20190184911A1
• Time in Patent Office: 372 Days
• Field of Search: 348148
• CPC Class Codes: B60R 1/00 Optical viewing arrangements; Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles
• CPC Class Codes: B60R 1/24 in front of the vehicle
• CPC Class Codes: B60R 11/04 Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 7/181 for receiving images from a plurality of remote sources
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00

Abstract

A camera module for a vehicular vision system includes a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager and an imager PCB. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. The imager assembly includes a flexible cable that connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion. The thermal element includes a thermally conductive resilient material.

Claims

1. A camera module for a vehicular vision system, the camera module comprising:

a camera housing comprising an upper housing portion and a lower housing portion;

wherein said camera housing, with said upper housing portion connected to said lower housing portion, houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly;

wherein said imager assembly comprises an imager;

wherein said imager comprises a two dimensional array of rows and columns of photosensing elements;

wherein said imager comprises at least one million photosensing elements;

wherein said imager assembly comprises a lens barrel that houses at least one lens;

wherein said imager assembly comprises an imager PCB;

wherein electronic circuitry disposed at said imager PCB of said imager assembly comprises said imager;

wherein said main PCB has an upper side and a lower side;

wherein electronic circuitry of said main PCB is disposed at said upper side of said main PCB and at said lower side of said main PCB;

wherein said lower side of said main PCB faces said lower housing portion and said upper side of said main PCB faces said upper housing portion;

wherein said imager assembly comprises a flexible cable that, when connected to a connector at said main PCB, connects electronic circuitry disposed at said imager PCB with electronic circuitry disposed at said main PCB;

wherein an electronic component of electronic circuitry disposed at said main PCB is in thermal conductivity with a thermal element;

wherein said thermal element is in thermal conductivity with said lower housing portion of said camera housing;

wherein said thermal element comprises a thermally conductive resilient material that enhances heat transfer from the electronic component of electronic circuitry disposed at said main PCB to said lower housing portion of said camera housing;

wherein said thermally conductive resilient material of said thermal element is compressed when in thermal conductivity with said lower housing portion of said camera housing;

wherein the camera module is configured to attach at an in-cabin side of a windshield of a vehicle equipped with the vehicular vision system; and

wherein, with the camera module attached at the in-cabin side of the windshield, said imager views through the windshield forward of the equipped vehicle.

2. The camera module of claim 1, wherein said thermally conductive resilient material comprises a sil pad.

3. The camera module of claim 1, wherein said camera housing comprises fins configured to dissipate heat.

4. The camera module of claim 1, wherein said thermally conductive resilient material comprises a thermally conductive paste.

5. The camera module of claim 1, wherein said flexible cable carries low-voltage differential signaling (LVDS) signals conveying image data captured by said imager to an image processor disposed at said main PCB.

6. The camera module of claim 5, wherein said imager assembly is at least partially disposed above said upper side of said main PCB, and wherein said imager views through an aperture of said upper housing portion of said camera housing.

7. The camera module of claim 5, wherein said connector at said main PCB is disposed at said lower side of said main PCB.

8. The camera module of claim 7, wherein said flexible cable passes through a portion of said main PCB to connect to said connector at said lower side of said main PCB.

9. The camera module of claim 1, wherein said camera housing is configured for mounting the camera module at a bracket attached at the in-cabin side of the windshield of the equipped vehicle, and wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, said imager views forward of the equipped vehicle through the windshield.

10. The camera module of claim 9, wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, the camera module may be detached for replacement or service with the bracket remaining attached at the windshield.

11. The camera module of claim 10, wherein the bracket attaches at the in-cabin side of the windshield via direct adhesive attachment.

12. The camera module of claim 11, wherein said imager views through an aperture of said upper housing portion of said camera housing, and wherein said lens barrel protrudes through the aperture of said upper housing portion of said camera housing to exterior of said camera housing.

13. The camera module of claim 12, wherein said lens barrel protrudes through the aperture of said upper housing portion of said camera housing at an acute angle.

14. The camera module of claim 12, wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, a stray light shield is disposed between the camera module and the windshield, said imager viewing forward of the equipped vehicle via the stray light shield.

15. The camera module of claim 14, wherein the bracket comprises the stray light shield.

16. The camera module of claim 14, wherein the stray light shield is separate from the bracket.

17. The camera module of claim 1, wherein said thermal element comprises a thermally conductive pad.

18. A camera module for a vehicular vision system, the camera module comprising:

a camera housing comprising an upper housing portion and a lower housing portion;

wherein said camera housing, with said upper housing portion connected to said lower housing portion, houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly;

wherein said imager assembly comprises an imager;

wherein said camera housing is configured for mounting the camera module at a bracket attached at an in-cabin side of a windshield of a vehicle equipped with the vehicular vision system;

wherein the bracket attaches at the in-cabin side of the windshield via direct adhesive attachment;

wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, said imager views forward of the equipped vehicle through the windshield;

wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, the camera module may be detached for replacement or service with the bracket remaining attached at the windshield;

wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, a stray light shield is disposed between the camera module and the windshield;

wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, said imager views forward of the equipped vehicle via the stray light shield;

wherein said imager comprises a two dimensional array of rows and columns of photosensing elements;

wherein said imager comprises at least one million photosensing elements;

wherein said imager assembly comprises a lens barrel that houses at least one lens;

wherein said imager views through an aperture of said upper housing portion of said camera housing;

wherein said lens barrel protrudes through the aperture to exterior of said camera housing;

wherein said imager assembly comprises an imager PCB;

wherein electronic circuitry disposed at said imager PCB of said imager assembly comprises said imager;

wherein said main PCB has an upper side and a lower side;

wherein electronic circuitry of said main PCB is disposed at said upper side of said main PCB and at said lower side of said main PCB;

wherein said lower side of said main PCB faces said lower housing portion and said upper side of said main PCB faces said upper housing portion;

wherein said imager assembly is at least partially disposed above said upper side of said main PCB;

wherein said imager assembly comprises a flexible cable that, when connected to a connector at said main PCB, connects electronic circuitry disposed at said imager PCB with electronic circuitry disposed at said main PCB;

wherein an electronic component of electronic circuitry disposed at said main PCB is in thermal conductivity with a thermal element;

wherein said thermal element is in thermal conductivity with said lower housing portion of said camera housing; and

wherein said thermal element comprises a thermally conductive material that enhances heat transfer from the electronic component of electronic circuitry disposed at said main PCB to said lower housing portion of said camera housing.

19. The camera module of claim 18, wherein said thermal element comprises a thermal pad, and wherein said thermal pad is compressed when in thermal conductivity with said lower housing portion of said camera housing.

20. The camera module of claim 19, wherein said connector at said main PCB is disposed at said lower side of said main PCB.

21. The camera module of claim 20, wherein said flexible cable passes through a portion of said main PCB to connect to said connector at said lower side of said main PCB.

22. The camera module of claim 18, wherein the stray light shield is separate from the bracket.

23. The camera module of claim 22, wherein said lens barrel protrudes through the aperture of said upper housing portion of said camera housing at an acute angle.

24. The camera module of claim 18, wherein said flexible cable carries low-voltage differential signaling (LVDS) signals conveying image data captured by said imager to an image processor disposed at said main PCB.

25. The camera module of claim 24, wherein said connector at said main PCB is disposed at said lower side of said main PCB.

26. The camera module of claim 25, wherein said flexible cable passes through a portion of said main PCB to connect to said connector at said lower side of said main PCB.

27. The camera module of claim 18, wherein said camera housing comprises fins configured to dissipate heat.

28. The camera module of claim 27, wherein said thermally conductive material comprises a sil pad.

29. A camera module for a vehicular vision system, the camera module comprising:

a camera housing comprising an upper housing portion and a lower housing portion;

wherein said camera housing, with said upper housing portion connected to said lower housing portion, houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly;

wherein said imager assembly comprises an imager;

wherein said camera housing is configured for mounting the camera module at a bracket attached at an in-cabin side of a windshield of a vehicle equipped with the vehicular vision system;

wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, said imager views forward of the equipped vehicle through the windshield;

wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, the camera module may be detached for replacement or service with the bracket remaining attached at the windshield;

wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, a stray light shield is disposed between the camera module and the windshield;

wherein the stray light shield is separate from the bracket;

wherein, with the camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, said imager views forward of the equipped vehicle via the stray light shield;

wherein said imager comprises a two dimensional array of rows and columns of photosensing elements;

wherein said imager comprises at least one million photosensing elements;

wherein said imager assembly comprises a lens barrel that houses at least one lens;

wherein said imager views through an aperture of said upper housing portion of said camera housing;

wherein said lens barrel protrudes through the aperture to exterior of said camera housing;

wherein said imager assembly comprises an imager PCB;

wherein electronic circuitry disposed at said imager PCB of said imager assembly comprises said imager;

wherein said main PCB has an upper side and a lower side;

wherein electronic circuitry of said main PCB is disposed at said upper side of said main PCB and at said lower side of said main PCB;

wherein said lower side of said main PCB faces said lower housing portion and said upper side of said main PCB faces said upper housing portion;

wherein said imager assembly is at least partially disposed above said upper side of said main PCB;

wherein said imager assembly comprises a flexible cable that, when connected to a connector at said main PCB, connects electronic circuitry disposed at said imager PCB with electronic circuitry disposed at said main PCB;

wherein said flexible cable carries low-voltage differential signaling (LVDS) signals conveying image data captured by said imager to an image processor disposed at said main PCB;

wherein an electronic component of electronic circuitry disposed at said main PCB is in thermal conductivity with a thermal element;

wherein said thermal element is in thermal conductivity with said lower housing portion of said camera housing; and

wherein said thermal element comprises a thermally conductive material that enhances heat transfer from the electronic component of electronic circuitry disposed at said main PCB to said lower housing portion of said camera housing.

30. The camera module of claim 29, wherein said connector at said main PCB is disposed at said lower side of said main PCB, and wherein said flexible cable passes through a portion of said main PCB to connect to said connector at said lower side of said main PCB.

31. The camera module of claim 30, wherein said lens barrel protrudes through the aperture of said upper housing portion of said camera housing at an acute angle.

32. The camera module of claim 31, wherein said camera housing comprises fins configured to dissipate heat.

33. The camera module of claim 30, wherein said thermal element comprises a thermal pad, and wherein said thermal pad is compressed when in thermal conductivity with said lower housing portion of said camera housing.

34. The camera module of claim 30, wherein said thermally conductive material comprises a sil pad.