×

Polyphenylene sulfide resin composition and hollow forming products using the same

  • US 10,577,501 B2
  • Filed: 06/23/2017
  • Issued: 03/03/2020
  • Est. Priority Date: 06/29/2016
  • Status: Active Grant
First Claim
Patent Images

1. A polyphenylene sulfide resin composition comprising a polyphenylene sulfide resin (A), an amino group-containing compound (B), and an epoxy group-containing elastomer (C), wherein said polyphenylene sulfide resin (A) forms a continuous phase consisting of polyphenylene sulfide resin (A) and optionally a compatibilizer and said amino group-containing compound (B) and said epoxy group-containing elastomer (C) form a dispersed phase in a morphology of a forming product composed of said resin composition observed with a transmission electron microscope, and a modulus of elongation, the elastic modulus determined by performing a tensile test on an ASTM type 1 dumbbell test piece obtained by injection molding at a cylinder temperature of 300°

  • C. and at a mold temperature of 150°

    C., under the conditions in which the distance between chucks is 114 mm, the test piece distance is 100 mm, and the elongation rate is 10 mm/min, of said resin composition is 1.0 MPa or more and 1000 MPa or less, wherein said amino group-containing compound (B) is a polyamide resin.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×