Co-packaging photonic integrated circuits and application specific integrated circuits
First Claim
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1. A co-packaging arrangement comprising:
- a photonic integrated circuit (PIC) and an application specific integrated circuit (ASIC), wherein the PIC and the ASIC are disposed on a substrate within a housing;
wherein said PIC is coupled to at least two optical fibers that couple light between structures outside the housing to optical waveguides on the PIC,wherein said PIC includes one or more optical modulators and one or more optical detectors and said substrate includes electrical interconnects for interconnecting the PIC to the ASIC; and
wherein the one or more optical modulators are driven directly from a digital-to-analog converter (DAC) that is located on the ASIC.
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Abstract
Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
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Citations
20 Claims
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1. A co-packaging arrangement comprising:
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a photonic integrated circuit (PIC) and an application specific integrated circuit (ASIC), wherein the PIC and the ASIC are disposed on a substrate within a housing; wherein said PIC is coupled to at least two optical fibers that couple light between structures outside the housing to optical waveguides on the PIC, wherein said PIC includes one or more optical modulators and one or more optical detectors and said substrate includes electrical interconnects for interconnecting the PIC to the ASIC; and wherein the one or more optical modulators are driven directly from a digital-to-analog converter (DAC) that is located on the ASIC. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A co-packaging arrangement comprising:
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a photonic integrated circuit (PIC) and an application specific integrated circuit (ASIC), wherein the PIC and the ASIC are disposed on a substrate within a housing; wherein the PIC comprises a transceiver having one or more optical modulators driven directly from a digital-to-analog converter (DAC) that is located on the ASIC; wherein the PIC is coupled to at least two optical fibers that couple light between structures outside the housing to optical waveguides on the PIC; and a tunable laser disposed outside of the housing, such that there are no cooling devices within the housing. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification