Electronic device
First Claim
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1. An electronic device comprising:
- a substrate;
a protruding pattern disposed on the substrate to protrude upward;
a first conductive pattern disposed on the substrate and covering the protruding pattern;
an insulating layer disposed on the first conductive pattern and in which an opening overlapping at least a portion of the protruding pattern is defined; and
a second conductive pattern disposed on the insulating layer and connected to the first conductive pattern through the opening on the protruding pattern,wherein the protruding pattern is disposed between the first conductive pattern and the substrate,wherein a thickness of the protruding pattern is greater than a thickness of the insulating layer, andwherein a contact portion of the first conductive pattern in contact with the second conductive pattern overlaps the protruding pattern in a plan view.
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Abstract
An electronic device is provided, which includes a substrate, a protruding pattern, a first conductive pattern, an insulating layer, and a second conductive pattern. The protruding pattern is disposed on the substrate. The first conductive pattern is disposed on the substrate and covers the protruding pattern. The insulating layer is disposed on the first conductive pattern. The insulating layer includes an opening overlapping at least a portion of the protruding pattern. The second conductive pattern is disposed on the insulating layer. The second conductive pattern is connected to the first conductive pattern through the opening.
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Citations
25 Claims
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1. An electronic device comprising:
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a substrate; a protruding pattern disposed on the substrate to protrude upward; a first conductive pattern disposed on the substrate and covering the protruding pattern; an insulating layer disposed on the first conductive pattern and in which an opening overlapping at least a portion of the protruding pattern is defined; and a second conductive pattern disposed on the insulating layer and connected to the first conductive pattern through the opening on the protruding pattern, wherein the protruding pattern is disposed between the first conductive pattern and the substrate, wherein a thickness of the protruding pattern is greater than a thickness of the insulating layer, and wherein a contact portion of the first conductive pattern in contact with the second conductive pattern overlaps the protruding pattern in a plan view. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. An electronic device comprising:
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a substrate; an insulating pattern disposed on the substrate to protrude upward further than an area adjacent thereto; a conductive pattern disposed on the substrate to cover the insulating pattern, and the conductive pattern overlaps the insulating pattern and an area adjacent to the insulating pattern in a plan view; an insulating layer disposed between the conductive pattern and the insulating pattern and in which an opening overlapping at least a portion of the insulating pattern is defined, wherein the insulating pattern is disposed between the conductive pattern and the substrate, wherein the conductive pattern comprises a recessed part defined along the opening, and wherein a protrude height of the insulating pattern is greater than a maximum thickness of the insulating layer. - View Dependent Claims (22, 23, 24, 25)
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Specification