Heat management around a phase delay coil in a probe

• US 10,581,492 B1
• Filed: 03/01/2018
• Issued: 03/03/2020
• Est. Priority Date: 03/07/2017
• Status: Active Grant

• Current Assignee: Quantum Wave LLC
• Original Assignee: Cpg Technologies, LLC
• Inventors: Corum, James F., Corum, Kenneth L., Lamon, Christopher R., Salvitti, Jr., James M., Galloway, Jr., Robert S., Darnell, James T., Genz, Fredrick A., Pogorzelski, Wes, Taylor, Michael P., Pesavento, Philip V., Lougheed, Jr., Timothy J., Lomax, Jerry A.
• Primary Examiner(s): Takaoka, Dean O
• Assistant Examiner(s): Wong, Alan
• Application Number:
  US15/908,917
• Time in Patent Office: 733 Days
• CPC Class Codes: H01Q 1/1242 Rigid masts specially adapted for supporting an aerial
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 1/50 Structural association of antennas with earthing switches, lead-in devices or lightning protectors
• CPC Class Codes: H04B 3/52 Systems for transmission between fixed stations via waveguides
• CPC Class Codes: H04B 5/73 for taking measurements, e.g. using sensing coils
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

Various embodiments for heat management around a phase delay coil in a probe are described. A guided surface waveguide probe may be at least partially housed or enclosed in a structure and configured to generate electrical energy in the form of a guided surface wave traveling along a terrestrial medium, where the guided surface waveguide probe comprises at least one electromagnetic coil encapsulated by an exterior of the structure. A cooling device may be provided and configured to manage heat in the structure by providing cold air between the at least one electromagnetic coil and the exterior of the structure.

Claims

1. A system, comprising:

a structure;

a guided surface waveguide probe at least partially housed in the structure, wherein the guided surface waveguide probe comprises at least one electromagnetic coil encapsulated by at least one wall of the structure; and

a cooling device configured to manage heat in the structure by providing cold air between the at least one electromagnetic coil and the at least one wall of the structure.

2. The system of claim 1, wherein the cooling device is configured to provide the cold air annularly around a circumference of the at least one electromagnetic coil.

3. The system of claim 2, wherein the cooling device or a duct coupled to the cooling device is positioned below the at least one electromagnetic coil to provide the cold air annularly around the circumference of the at least one electromagnetic coil.

4. The system of claim 1, wherein the at least one wall of the structure is formed of a load-bearing non-conductive support structure material.

5. The system of claim 1, wherein the at least one electromagnetic coil is one of a plurality of electromagnetic coils, wherein at least a portion of the plurality of electromagnetic coils are internal phasing coils.

6. The system of claim 1, further comprising a sensor configured to measure a temperature or a humidity level of an area of the structure in which at least a portion of the at least one electromagnetic coil resides.

7. The system of claim 6, wherein the cooling device is configured to provide the cold air in response to the temperature or the humidity level measured by the sensor satisfying a predetermined condition.

8. A method, comprising:

providing a structure having at least a portion of a guided surface waveguide probe residing therein, wherein the guided surface waveguide probe comprises at least one electromagnetic coil encapsulated by an exterior of the structure; and

managing heat emitted by the at least one electromagnetic coil in the structure by providing cold air between the at least one electromagnetic coil and the exterior of the structure using a cooling device.

9. The method of claim 8, wherein providing the cold air between the at least one electromagnetic coil and the exterior of the structure using the cooling device further comprises providing the cold air annularly around a circumference of the at least one electromagnetic coil.

10. The method of claim 9, further comprising positioning the cooling device or a duct coupled to the cooling device below the at least one electromagnetic coil to provide the cold air annularly around the circumference of the at least one electromagnetic coil.

11. The method of claim 8, wherein the exterior of the structure is formed of a load-bearing non-conductive support structure material.

12. The method of claim 8, wherein the at least one electromagnetic coil is one of a plurality of electromagnetic coils, wherein at least a portion of the plurality of electromagnetic coils are internal phasing coils.

13. The method of claim 8, further comprising measuring a temperature or a humidity level of an area of the structure in which at least a portion of the at least one electromagnetic coil resides with a sensor.

14. The method of claim 13, wherein the cold air is provided by the cooling device in response to the temperature or the humidity level measured by the sensor satisfying a predetermined condition.

15. A system, comprising:

means for operating a guided surface waveguide probe, wherein the guided surface waveguide probe at least partially resides in a structure, the guided surface waveguide probe comprising at least one electromagnetic coil encapsulated by an exterior of the structure; and

means for managing heat generated by the at least one electromagnetic coil by providing cold air between the at least one electromagnetic coil and the exterior of the structure.

16. The system of claim 15, wherein the means for managing heat is a cooling device configured to provide the cold air annularly around a circumference of the at least one electromagnetic coil.

17. The system of claim 16, wherein the cooling device or a duct coupled to the cooling device is positioned below the at least one electromagnetic coil to provide the cold air annularly around the circumference of the at least one electromagnetic coil.

18. The system of claim 15, wherein the exterior of the structure is formed of a nonconductive material.

19. The system of claim 15, wherein the at least one electromagnetic coil is one of a plurality of electromagnetic coils, wherein at least a portion of the plurality of electromagnetic coils are internal phasing coils.

20. The system of claim 15, further comprising:

means for measuring a temperature or a humidity level of an area of the structure in which at least a portion of the at least one electromagnetic coil resides; and

means for providing the cold air in response to the temperature or the humidity level satisfying a predetermined condition.