Multi-functional ingester system for additive manufacturing

• US 10,583,484 B2
• Filed: 10/27/2016
• Issued: 03/10/2020
• Est. Priority Date: 10/30/2015
• Status: Active Grant

• Current Assignee: Seurat Technologies, Inc.
• Original Assignee: Seurat Technologies, Inc.
• Inventors: DeMuth, James A., Toomre, Erik, Leard, Francis L., Kamshad, Kourosh, Fees, Heiner, Berdichevsky, Eugene M.
• Primary Examiner(s): Rogers, David A
• Application Number:
  US15/336,239
• Publication Number:
  US 20170120529A1
• Time in Patent Office: 1,230 Days
• CPC Class Codes: B22F 10/00 Additive manufacturing of workpieces or articles from metallic powder apparatus or devices therefor B22F12/00
• CPC Class Codes: B22F 10/10 Formation of a green body
• CPC Class Codes: B22F 10/20 Direct sintering or melting
• CPC Class Codes: B22F 10/28 Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
• CPC Class Codes: B22F 10/32 of the atmosphere, e.g. composition or pressure in a building chamber
• CPC Class Codes: B22F 10/34 of powder characteristics, e.g. density, oxidation or flowability
• CPC Class Codes: B22F 10/36 of energy beam parameters
• CPC Class Codes: B22F 10/39 Traceability, e.g. incorporating identifier into a workpiece or article
• CPC Class Codes: B22F 10/47 characterised by structural features
• CPC Class Codes: B22F 10/50 Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up
• CPC Class Codes: B22F 10/64 by thermal means control of energy beam parameters for post heating B22F10/364
• CPC Class Codes: B22F 10/70 Recycling
• CPC Class Codes: B22F 10/73 of powder
• CPC Class Codes: B22F 12/00 Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
• CPC Class Codes: B22F 12/17 to heat the build chamber or platform
• CPC Class Codes: B22F 12/20 Cooling means
• CPC Class Codes: B22F 12/222 for motion along a direction orthogonal to the plane of a layer
• CPC Class Codes: B22F 12/226 for rotary motion
• CPC Class Codes: B22F 12/30 Platforms or substrates
• CPC Class Codes: B22F 12/33 translatory in the deposition plane
• CPC Class Codes: B22F 12/41 : characterised by the type, e.g. laser or electron beam
• CPC Class Codes: B22F 12/44 : characterised by the configuration of the radiation means
• CPC Class Codes: B22F 12/45 : Two or more
• CPC Class Codes: B22F 12/53 : Nozzles
• CPC Class Codes: B22F 12/90 : Means for process control, e.g. cameras or sensors
• CPC Class Codes: B22F 2003/247 : Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface
• CPC Class Codes: B22F 2003/248 : Thermal after-treatment
• CPC Class Codes: B22F 2203/03 : for feed-back
• CPC Class Codes: B22F 2998/10 : Processes characterised by the sequence of their steps
• CPC Class Codes: B22F 2999/00 : Aspects linked to processes or compositions used in powder metallurgy
• CPC Class Codes: B22F 3/24 : After-treatment of workpieces or articles B22F3/1146 takes precedence
• CPC Class Codes: B23K 15/0006 : specially adapted for particular articles
• CPC Class Codes: B23K 15/0013 : Positioning or observing workpieces, e.g. with respect to the impact; Aligning, aiming or focusing electronbeams
• CPC Class Codes: B23K 15/002 : Devices involving relative movement between electronbeam and workpiece
• CPC Class Codes: B23K 15/0026 : Auxiliary equipment
• CPC Class Codes: B23K 15/0086 : welding for purposes other than joining, e.g. built-up welding
• CPC Class Codes: B23K 15/0093 : characterised by the properties of the materials to be welded
• CPC Class Codes: B23K 15/06 : within a vacuum chamber B23K15/04 takes precedence
• CPC Class Codes: B23K 2101/001 : Turbines
• CPC Class Codes: B23K 2101/008 : Gears
• CPC Class Codes: B23K 2101/02 : Honeycomb structures
• CPC Class Codes: B23K 2101/24 : Frameworks
• CPC Class Codes: B23K 2103/00 : Materials to be soldered, welded or cut
• CPC Class Codes: B23K 2103/42 : Plastics B23K2103/16 takes precedence
• CPC Class Codes: B23K 2103/50 : Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/0006 : taking account of the properties of the material involved B23K26/32, B23K26/40 take precedence
• CPC Class Codes: B23K 26/03 : Observing, e.g. monitoring, the workpiece
• CPC Class Codes: B23K 26/032 : using optical means
• CPC Class Codes: B23K 26/082 : Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• CPC Class Codes: B23K 26/083 : Devices involving movement of the workpiece in at least one axial direction
• CPC Class Codes: B23K 26/0846 : for moving elongated workpieces longitudinally, e.g. wire or strip material
• CPC Class Codes: B23K 26/1224 : in vacuum
• CPC Class Codes: B23K 26/123 : in an atmosphere of particular gases
• CPC Class Codes: B23K 26/127 : in an enclosure
• CPC Class Codes: B23K 26/142 : for the removal of by-products
• CPC Class Codes: B23K 26/144 : the fluid stream containing particles, e.g. powder
• CPC Class Codes: B23K 26/16 : Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece by a fluid stream B23K26/142
• CPC Class Codes: B23K 26/342 : Build-up welding
• CPC Class Codes: B23K 26/36 : Removing material B23K26/55, B23K26/57 take precedence
• CPC Class Codes: B23K 26/702 : Auxiliary equipment
• CPC Class Codes: B23K 26/703 : Cooling arrangements by using a fluid stream B23K26/14
• CPC Class Codes: B23K 26/704 : Beam dispersers, e.g. beam wells
• CPC Class Codes: B23K 37/0408 : for planar work
• CPC Class Codes: B23K 37/0426 : Fixtures for other work
• CPC Class Codes: B25J 11/00 : Manipulators not otherwise provided for
• CPC Class Codes: B28B 1/001 : Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material selective deposition modelling of metallic powder B22F10/00; rapid manufacturing of 3D objects in general and in particular of plastics B29C64/00
• CPC Class Codes: B29C 64/153 : using layers of powder being selectively joined, e.g. by selective laser sintering or melting
• CPC Class Codes: B29C 64/264 : Arrangements for irradiation
• CPC Class Codes: B29C 64/268 : using laser beams; using electron beams [EB]
• CPC Class Codes: B29C 64/35 : Cleaning
• CPC Class Codes: B29C 64/357 : Recycling
• CPC Class Codes: B29C 64/379 : Handling of additively manufactured objects, e.g. using robots
• CPC Class Codes: B29C 64/386 : Data acquisition or data processing for additive manufacturing
• CPC Class Codes: B29C 64/393 : for controlling or regulating additive manufacturing processes
• CPC Class Codes: B29K 2105/251 : Particles, powder or granules expandable particles B29K2105/046
• CPC Class Codes: B33Y 10/00 : Processes of additive manufacturing
• CPC Class Codes: B33Y 30/00 : Apparatus for additive manufacturing; Details thereof or accessories therefor
• CPC Class Codes: B33Y 40/00 : Auxiliary operations or equipment, e.g. for material handling
• CPC Class Codes: B33Y 50/02 : for controlling or regulating additive manufacturing processes
• CPC Class Codes: B33Y 70/00 : Materials specially adapted for additive manufacturing
• CPC Class Codes: B33Y 80/00 : Products made by additive manufacturing
• CPC Class Codes: B33Y 99/00 : Subject matter not provided for in other groups of this subclass
• CPC Class Codes: G02B 15/04 : by changing a part
• CPC Class Codes: G02B 15/10 : by adding a part, e.g. close-up attachment
• CPC Class Codes: G02B 19/0028 : refractive and reflective surfaces, e.g. non-imaging catadioptric systems
• CPC Class Codes: G02B 19/0047 : for use with a light source G02B19/009, G02B19/0095 take precedence; details of lighting devices in general F21V; non-semiconductor lasers having optical devices external to the laser cavity H01S3/005
• CPC Class Codes: G02B 26/0816 : by means of one or more reflecting elements
• CPC Class Codes: G02B 27/0068 : having means for controlling the degree of correction, e.g. using phase modulators, movable elements controlling the phase of light using moving or deformable elements G02B26/06
• CPC Class Codes: G02B 27/0905 : Dividing and/or superposing multiple light beams
• CPC Class Codes: G02B 27/108 : for sampling a portion of a beam or combining a small beam in a larger one, e.g. wherein the area ratio or power ratio of the divided beams significantly differs from unity, without spectral selectivity
• CPC Class Codes: G02B 27/141 : using dichroic mirrors
• CPC Class Codes: G02B 27/283 : used for beam splitting or combining
• CPC Class Codes: G02B 27/286 : for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another G02B5/3083 takes precedence; light guide coupling means utilising polarising elements G02B6/34
• CPC Class Codes: G02B 7/14 : adapted to interchange lenses G02B7/027 takes precedence
• CPC Class Codes: G02B 7/16 : Rotatable turrets
• CPC Class Codes: G02B 7/1827 : Motorised alignment
• CPC Class Codes: G02F 1/0136 : for the control of polarisation, e.g. state of polarisation [SOP] control, polarisation scrambling, TE-TM mode conversion or separation G02F1/0353 takes precedence
• CPC Class Codes: G02F 1/133362 : Optically addressed liquid crystal cells G02F1/135 takes precedence
• CPC Class Codes: G02F 1/135 : Liquid crystal cells structurally associated with a photoconducting or a ferro-electric layer, the properties of which can be optically or electrically varied G02F1/133348 takes precedence
• CPC Class Codes: G05B 17/02 : electric
• CPC Class Codes: G05B 2219/49023 : 3-D printing, layer of powder, add drops of binder in layer, new powder
• CPC Class Codes: G07C 3/146 : during manufacturing process
• CPC Class Codes: H01S 5/005 : Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping H01S5/026, H01S5/18388 take precedence
• CPC Class Codes: H01S 5/4012 : Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
• CPC Class Codes: Y02P 10/25 : Process efficiency
• CPC Class Codes: Y02P 80/40 : Minimising material used in manufacturing processes

Abstract

A method and an apparatus for collecting powder samples in real-time in powder bed fusion additive manufacturing may involves an ingester system for in-process collection and characterizations of powder samples. The collection may be performed periodically and uses the results of characterizations for adjustments in the powder bed fusion process. The ingester system of the present disclosure is capable of packaging powder samples collected in real-time into storage containers serving a multitude purposes of audit, process adjustments or actions.

Claims

1. A method comprising the steps of:

collecting a plurality of powder samples of a powdered material in real-time during a print job;

performing a set of characterizations on the powder samples;

determining whether to modify a set of printing parameters employed during the print job or abort the print job according to a result of the set of characterizations; and

packaging the powder samples in a plurality of sample canisters, with a second atmosphere in the sample canisters substantially equivalent to a first atmosphere utilized during the print job.

2. The method of claim 1, wherein the collecting of the powder samples of the powdered material in real-time comprises collecting the powder samples of the powdered material periodically at a predetermined interval, randomly, or at one or more predetermined stages during, before, or after the print job.

3. The method of claim 1, further comprising the step of aborting the print job when an unlicensed powder is used.

4. The method of claim 1, wherein the set of printing parameters comprises one or more of:

a temperature of the powder material;

a intensity of an energy source incident on the powder material;

a duration of the energy source incident on the powder material;

a pulse shape of energy source incident on the powder material modulated over time and position on the bed;

a thickness of a layer the powder material being dispensed; and

a rate of dispensing a layer of the powdered material.

5. The method of claim 1, wherein the first atmosphere or the second atmosphere comprises air or an inert gas.

6. The method of claim 5, wherein the inert gas comprises nitrogen, carbon dioxide, argon, helium, or other noble gas.

7. An apparatus implementable in an ingester system, comprising:

an ingester capable of collecting a plurality of powder samples of a powdered material during a print job; and

a storage container capable of packaging the powder samples in a plurality of sample canisters for audit purposes,

wherein, in packaging the powder samples in the sample canister, the storage container is configured to provide a second atmosphere in the sample canisters substantially equivalent to a first atmosphere utilized during the print job, and

wherein the first atmosphere or the second atmosphere comprises air or an inert gas.

8. The apparatus of claim 7, further comprising:

a test suite capable of performing a set of characterizations on the powder samples;

a powder dispensing assembly capable of dispensing a plurality layers of the powdered material;

a build platform configured to support a powder bed formed by the layers of the powdered material; and

an energy source configured to emit energy to bond the powdered material to form one or more integral objects.

9. The apparatus of claim 7, wherein, in collecting the powder samples of the powder material during the print job, the ingester is configured to collect the powder samples of the powdered material periodically at a predetermined interval, randomly, or at one or more predetermined stages during the print job.

10. The apparatus of claim 7, wherein the inert gas comprises nitrogen, carbon dioxide, argon, helium, or other noble gas.

11. The apparatus of claim 7, wherein the set of printing parameters comprises at least one of:

a temperature of the powder material;

an intensity of an energy source incident on the powder material;

a duration of the energy source incident on the powder material;

a pulse shape of energy source incident on the powder material modulated over time and position on the bed;

a thickness of a layer of the powder material being dispensed; and

a rate of dispensing a layer of the powdered material.

12. The apparatus of claim 7, wherein, in controlling the ingester system, the processor is configured to control the ingester system to perform operations comprising one or more of:

collecting the powder samples of the powder material in real-time during a print job;

packaging the powder samples in the sample canisters having a second atmosphere in the sample canisters substantially equivalent to a first atmosphere utilized during the print job;

performing the characterizations on the powder samples during the print job; and

determining whether to modify a set of printing parameters employed for the print job or abort the print job according a result of the characterizations.