Temperature controlled showerhead

• US 10,584,415 B2
• Filed: 03/04/2019
• Issued: 03/10/2020
• Est. Priority Date: 10/16/2007
• Status: Active Grant

• Current Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Original Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Inventors: Meinhold, Henner, Doble, Dan M., Lau, Stephen, Wilson, Vince, Srinivasan, Easwar
• Primary Examiner(s): Zervigon, Rudy
• Application Number:
  US16/291,822
• Publication Number:
  US 20190256977A1
• Time in Patent Office: 372 Days
• Field of Search: 118715, 15634534, 15634533
• CPC Class Codes: C23C 16/45563 Gas nozzles
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: C23C 16/4557 Heated nozzles
• CPC Class Codes: C23C 16/45572 Cooled nozzles
• CPC Class Codes: C23C 16/5096 Flat-bed apparatus
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32724 Temperature

Abstract

A temperature controlled showerhead for chemical vapor deposition (CVD) chambers enhances heat dissipation to enable accurate temperature control with an electric heater. Heat dissipates by conduction through a showerhead stem and fluid passageway and radiation from a back plate. A temperature control system includes one or more temperature controlled showerheads in a CVD chamber with fluid passageways serially connected to a heat exchanger.

Claims

1. A temperature-controlled, chandelier-type showerhead comprising:

i) a stem comprising a convective cooling fluid passageway, wherein the stem is configured to be connected with a semiconductor processing chamber;

ii) a back plate thermally coupled to the stem; and

iii) a face plate thermally coupled to the back plate;

wherein;

the stem has a first end that is configured to connect with or protrude through a top of the semiconductor processing chamber when the temperature-controlled, chandelier-type showerhead is installed in the semiconductor processing chamber,

the back plate is configured to be supported within the semiconductor processing chamber by the stem,

the convective cooling fluid passageway includes an inlet and an outlet, and

the inlet and the outlet are both located in the first end.

2. The temperature-controlled, chandelier-type showerhead of claim 1, further comprising a temperature sensor configured to measure a temperature of cooling fluid exiting the convective cooling fluid passageway.

3. The temperature-controlled, chandelier-type showerhead of claim 2, wherein the temperature sensor is a thermocouple.

4. The temperature-controlled, chandelier-type showerhead of claim 1, wherein an external surface of the back plate includes a coating to increase emissivity.

5. The temperature-controlled, chandelier-type showerhead of claim 4, wherein the coating is anodized aluminum.

6. The temperature-controlled, chandelier-type showerhead of claim 1, further comprising a heater physically attached to the back plate.

7. The temperature-controlled, chandelier-type showerhead of claim 1, wherein the face plate is removably attached to the back plate.

8. The temperature-controlled, chandelier-type showerhead of claim 1, wherein at least part of the convective cooling fluid passageway follows a helical path within the stem.

9. The temperature-controlled, chandelier-type showerhead of claim 1, further comprising a gas inlet channel located within the stem and in fluidic communication with a manifold area located between the back plate and the face plate.

10. The temperature-controlled, chandelier-type showerhead of claim 9, wherein the convective cooling fluid passageway encircles the gas inlet channel when viewed along the center axis of the gas inlet channel.

11. The temperature-controlled, chandelier-type showerhead of claim 9, wherein the face plate includes a plurality of through-holes that provide a fluidic path between the manifold area and an exterior surface of the face plate.

12. The temperature-controlled, chandelier-type showerhead of claim 11, wherein the number of through-holes falls within a range selected from the group of ranges consisting of:

between 100 and 10,000 through-holes, between 2000 to 5000 through-holes, between 3000 to 4000 through-holes, and 200 to 2000 through-holes.

13. The temperature-controlled, chandelier-type showerhead of claim 11, wherein the through-holes have diameters of between 0.01 inches to 0.5 inches.

14. The temperature-controlled, chandelier-type showerhead of claim 11, wherein the through-holes have diameters of about 0.04 inches.

15. The temperature-controlled, chandelier-type showerhead of claim 9, wherein the manifold area may be defined by a gap between the face plate and the back plate of between about 0.5″

to 1″

.

16. The temperature-controlled, chandelier-type showerhead of claim 14, wherein the gap is about 0.75″

.

17. The temperature-controlled, chandelier-type showerhead of claim 9, further comprising a baffle plate interposed between the back plate and the face plate and centered on the center axis of the gas inlet channel.

18. The temperature-controlled, chandelier-type showerhead of claim 9, wherein the gas inlet channel is fluidically isolated from the convective cooling fluid passageway within the stem.

19. The temperature-controlled, chandelier-type showerhead of claim 1, wherein the face plate includes a circumferential side wall having a ledge and the outer perimeter of the back plate contacts the ledge.

20. A semiconductor processing tool comprising:

a chamber having a chamber top; and

the temperature-controlled, chandelier-type showerhead of claim 1, wherein the temperature-controlled, chandelier-type showerhead is connected with the chamber top via the stem.