Method for polymer-assisted chip transfer

• US 10,586,725 B1
• Filed: 01/10/2018
• Issued: 03/10/2020
• Est. Priority Date: 01/10/2018
• Status: Active Grant

• Current Assignee: META Platforms Technologies LLC (Meta Platforms, Inc. (f/k/a Facebook, Inc.))
• Original Assignee: Facebook Technologies, LLC (Meta Platforms, Inc. (f/k/a Facebook, Inc.))
• Inventors: Saketi, Pooya, Torrents Abad, Oscar, Pourchet, Allan, Hughes, Patrick Joseph, Moh, Karsten, Brodoceanu, Daniel
• Primary Examiner(s): Chan, Sing P
• Application Number:
  US15/867,380
• Time in Patent Office: 790 Days
• Field of Search: 156247, 156249, 156289, 1563071, 1563073, 1563075, 1563082, 1563096, 1563099, 156310, 156314, 156315, 156320, 156323, 156714, 156715, 156719
• CPC Class Codes: B32B 2310/0843 using laser
• CPC Class Codes: B32B 2457/14 Semiconductor wafers
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/32 containing nitrogen

Abstract

One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.

Claims

1. A method comprising:

depositing a first adhesive layer on a first substrate, the first adhesive layer made of a first material;

depositing a second adhesive layer on the first adhesive layer, the second adhesive layer made of a second material that is different from the first material, at least one of the first and second materials being a polymer material;

providing a second substrate with one or more chips attached;

placing the one or more chips on the first substrate through the first and second adhesive layers, the one or more chips attached to the second substrate and being secured to the first substrate after placement on the first substrate;

performing laser lift-off on an interface of the one or more chips and the second substrate;

removing the second substrate from the one or more chips after performing the laser lift-off;

removing the second adhesive layer from the first substrate after performing the laser lift-off;

softening the first adhesive layer after removing the second adhesive layer; and

removing the one or more chips from the first substrate.

2. The method of claim 1, wherein the one or more chips are weighted during the placement of one or more chips on the first substrate.

3. The method of claim 1, wherein removing the second adhesive layer comprises dissolving the second adhesive layer in a solvent in which the second material is soluble and the first material is not soluble.

4. The method of claim 3, wherein the solvent is water.

5. The method of claim 1, wherein softening the first adhesive layer comprises heating the first substrate to at least a first glass transition temperature of the first material.

6. The method of claim 1, further comprising, before placing the one or more chips on the first substrate:

drying the first and second adhesive layers; and

softening the first and second adhesive layers.

7. The method of claim 6, wherein softening the first and second adhesive layers comprises heating the first substrate to the higher of a first glass transition temperature of the first material and a second glass transition temperature of the second material.

8. The method of claim 1, wherein one of the first material and the second material is polyvinyl acetate, and the other of the first material and the second material is polyvinyl alcohol.

9. The method of claim 1, wherein one of the first material and the second material is polyvinyl pyrrolidone, and the other of the first material and the second material is polyvinyl butyral.

10. The method of claim 1, wherein the first substrate is made of is a rigid material.

11. The method of claim 10, wherein the first substrate is made of glass.

12. The method of claim 1, wherein the first adhesive layer is thinner than the second adhesive layer.

13. The method of claim 12, wherein the first adhesive layer is approximately 1 micrometer thick and the second adhesive layer is 2-3 micrometers thick.

14. A method comprising:

securing one or more chips to a first substrate by;

depositing a first adhesive layer on the first substrate, the first adhesive layer made of a first material;

depositing a second adhesive layer on the first substrate, the second adhesive layer made of a second material that is different from the first material, at least one of the first and second materials being a polymer material;

placing one or more chips on the first substrate through the first and second adhesive layers, the one or more chips secured to the first substrate after placement on the first substrate; and

detaching the one or more chips from the first substrate by;

removing the second adhesive layer from the first substrate;

softening the first adhesive layer after removing the second adhesive layer; and

removing the one or more chips from the first substrate after softening the first adhesive layer.

15. The method of claim 14, further comprising:

transporting the one or more chips with the one or more chips secured to the first substrate.

16. The method of claim 14, further comprising:

performing at least one fabrication step the one or more chips with the one or more chips secured to the first substrate.

17. The method of claim 14, wherein one of the first material and the second material is polyvinyl acetate, and the other of the first material and the second material is polyvinyl alcohol.

18. The method of claim 14, wherein one of the first material and the second material is polyvinyl pyrrolidone, and the other of the first material and the second material is polyvinyl butyral.

19. The method of claim 14, wherein removing the second adhesive layer comprises dissolving the second adhesive layer in a solvent in which the second material is soluble and the first material is not soluble.

20. The method of claim 14, wherein one of the first material and the second material is a wax.