Semiconductor device
First Claim
1. A semiconductor device, comprising:
- a SiC substrate;
a SiC layer provided on the SiC substrate, the SiC layer including a first trench at a side of front face of the SiC layer, the first trench including a side face and a bottom face;
a first conductivity type first SiC region provided in the SiC layer;
a second conductivity type second SiC region provided between the first SiC region and the SiC substrate in the SiC layer;
a first conductivity type third SiC region provided between the second SiC region and the SiC substrate in the SiC layer, a boundary between the second SiC region and the third SiC region disposed at a side of the side face of the first trench, the boundary including a first region, a distance between the first region and the front face of the SiC layer increasing as a distance from the side face of the first trench to the first region increasing, a distance between the side face of the first trench to an end of the first region close to the first trench being 0 μ
m or more and 0.3 μ
m or less;
a second conductivity type fourth SiC region provided on a side of the first SiC region in the SiC layer, the fourth SiC region having higher second conductivity type impurity concentration than that of the second SiC region;
a gate insulating film provided on the side face and the bottom face of the first trench;
a gate electrode, the gate insulating film disposed between the gate electrode and the first SiC region, the second SiC region, and the third SiC region;
a first electrode provided on the front face of the SiC layer; and
a second electrode, the SiC layer and the SiC substrate provided between the first electrode and the second electrode,wherein a minimum distance between the second electrode and the first trench is larger than a minimum distance between the second electrode and the second SiC region,a first distance between the first electrode and a boundary of the second SiC region and the fourth SiC region is smaller than a second distance between the boundary of the second SiC region and the fourth SiC region and the boundary of the second SiC region and the third SiC region,the first distance is measured on a line perpendicular to the front face of the SiC layer,the second distance is measured on the line, andthe line crosses an interface between the fourth SiC region and the first electrode.
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Accused Products
Abstract
A semiconductor device according to embodiments includes, a SiC substrate, SiC layer, a trench having a side face and a bottom face, a first conductivity type first SiC region, a second conductivity type second SiC region between the first SiC region and the SiC substrate, a first conductivity type third SiC region between the second SiC region and the SiC substrate, a boundary between the second SiC region and the third SiC region provided at a side of the side face, the boundary including a first region, a distance between the first region and a front face of the SiC layer increasing as a distance from the side face to the first region increasing, and distance from the side face to the first region being 0 μm or more and 0.3 μm or less, a gate insulating film and gate insulating film.
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Citations
31 Claims
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1. A semiconductor device, comprising:
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a SiC substrate; a SiC layer provided on the SiC substrate, the SiC layer including a first trench at a side of front face of the SiC layer, the first trench including a side face and a bottom face; a first conductivity type first SiC region provided in the SiC layer; a second conductivity type second SiC region provided between the first SiC region and the SiC substrate in the SiC layer; a first conductivity type third SiC region provided between the second SiC region and the SiC substrate in the SiC layer, a boundary between the second SiC region and the third SiC region disposed at a side of the side face of the first trench, the boundary including a first region, a distance between the first region and the front face of the SiC layer increasing as a distance from the side face of the first trench to the first region increasing, a distance between the side face of the first trench to an end of the first region close to the first trench being 0 μ
m or more and 0.3 μ
m or less;a second conductivity type fourth SiC region provided on a side of the first SiC region in the SiC layer, the fourth SiC region having higher second conductivity type impurity concentration than that of the second SiC region; a gate insulating film provided on the side face and the bottom face of the first trench; a gate electrode, the gate insulating film disposed between the gate electrode and the first SiC region, the second SiC region, and the third SiC region; a first electrode provided on the front face of the SiC layer; and a second electrode, the SiC layer and the SiC substrate provided between the first electrode and the second electrode, wherein a minimum distance between the second electrode and the first trench is larger than a minimum distance between the second electrode and the second SiC region, a first distance between the first electrode and a boundary of the second SiC region and the fourth SiC region is smaller than a second distance between the boundary of the second SiC region and the fourth SiC region and the boundary of the second SiC region and the third SiC region, the first distance is measured on a line perpendicular to the front face of the SiC layer, the second distance is measured on the line, and the line crosses an interface between the fourth SiC region and the first electrode. - View Dependent Claims (2, 3, 4, 5, 6, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 24, 29)
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7. A semiconductor device, comprising:
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a SiC substrate; a SiC layer provided on the SiC substrate, the SiC layer including a first trench at a side of front face of the SiC layer, the first trench including a side face and a bottom face; a first conductivity type first SiC region provided in the SiC layer; a second conductivity type second SiC region provided between the first SiC region and the SiC substrate in the SiC layer; a first conductivity type third SiC region provided between the second SiC region and the SiC substrate in the SiC layer, a boundary between the second SiC region and the third SiC region disposed at a side of the side face of the first trench, the boundary including a first region, a distance between the first region and the front face of the SiC layer increasing as a distance from the side face of the first trench to the first region increasing, a distance between the side face of the first trench to an end of the first region close to the first trench being 0 μ
m or more and 0.3 μ
m or less;a gate insulating film provided on the side face and the bottom face of the first trench; a gate electrode, the gate insulating film disposed between the gate electrode and the first SiC region, the second SiC region, and the third SiC region; a first electrode provided on the front face of the SiC layer; and a second electrode, the SiC layer and the SiC substrate provided between the first electrode and the second electrode, wherein a minimum distance between the second electrode and the first trench is larger than a minimum distance between the second electrode and the second SiC region, and the boundary includes a side region substantially perpendicular to the front face of the SiC layer, and the first region is provided between the side region and the first trench. - View Dependent Claims (27, 28)
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18. A semiconductor device, comprising:
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a SiC substrate; a SiC layer provided on the SiC substrate, the SiC layer including a first trench at a side of front face of the SiC layer, the first trench including a side face and a bottom face; a first conductivity type first SiC region provided in the SiC layer; a second conductivity type second SiC region provided between the first SiC region and the SiC substrate in the SiC layer; a first conductivity type third SiC region provided between the second SiC region and the SiC substrate in the SiC layer, a boundary between the second SiC region and the third SiC region disposed at a side of the side face of the first trench, the boundary including a first region, the first region having a first position and a second position, the first position being closer to the first trench than the second position, a distance between the second position and the front face of the SiC layer being larger than a distance between the first position and the front face of the SiC layer, a distance between the side face of the first trench to an end of the first region close to the first trench being 0 μ
m or more and 0.3 μ
m or less;a second conductivity type fourth SiC region provided on a side of the first SiC region in the SiC layer, the fourth SiC region having higher second conductivity type impurity concentration than that of the second SiC region; a gate insulating film provided on the side face and the bottom face of the first trench; a gate electrode, the gate insulating film disposed between the gate electrode and the first SiC region, the second SiC region, and the third SiC region; a first electrode provided on the front face of the SiC layer; and a second electrode, the SiC layer and the SiC substrate provided between the first electrode and the second electrode, wherein a minimum distance between the second electrode and the first trench is larger than a minimum distance between the second electrode and the second SiC region, a first distance between the first electrode and a boundary of the second SiC region and the fourth SiC region is smaller than a second distance between the boundary of the second SiC region and the fourth SiC region and the boundary of the second SiC region and the third SiC region, the first distance is measured on a line perpendicular to the front face of the SiC layer, the second distance is measured on the line, and the line crosses an interface between the fourth SiC region and the first electrode. - View Dependent Claims (20, 22, 25, 30)
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19. A semiconductor device, comprising:
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a SiC substrate; a SiC layer provided on the SiC substrate, the SiC layer including a first trench at a side of front face of the SiC layer, the first trench including a side face and a bottom face; a first conductivity type first SiC region provided in the SiC layer; a second conductivity type second SiC region provided between the first SiC region and the SiC substrate in the SiC layer; a first conductivity type third SiC region provided between the second SiC region and the SiC substrate in the SiC layer, a boundary between the second SiC region and the third SiC region disposed at a side of the side face of the first trench, the boundary including a first region, the first region having a first position and a second position, the first position being closer to the first trench than the second position, a distance between the second position and a back face of the SiC substrate being smaller than a distance between the first position and the back face of the SiC substrate, a distance between the side face of the first trench to an end of the first region close to the first trench being 0 μ
m or more and 0.3 μ
m or less;a second conductivity type fourth SiC region provided on a side of the first SiC region in the SiC layer, the fourth SiC region having higher second conductivity type impurity concentration than that of the second SiC region; a gate insulating film provided on the side face and the bottom face of the first trench; a gate electrode, the gate insulating film disposed between the gate electrode and the first SiC region, the second SiC region, and the third SiC region; a first electrode provided on the front face of the SiC layer; and a second electrode, the SiC layer and the SiC substrate provided between the first electrode and the second electrode, wherein a minimum distance between the second electrode and the first trench is larger than a minimum distance between the second electrode and the second SiC region, a first distance between the first electrode and a boundary of the second SiC region and the fourth SiC region is smaller than a second distance between the boundary of the second SiC region and the fourth SiC region and the boundary of the second SiC region and the third SiC region, the first distance is measured on a line perpendicular to the front face of the SiC layer, the second distance is measured on the line, and the line crosses an interface between the fourth SiC region and the first electrode. - View Dependent Claims (21, 23, 26, 31)
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Specification