Techniques for combining CMP process tracking data with 3D printed CMP consumables

• US 10,593,574 B2
• Filed: 11/06/2015
• Issued: 03/17/2020
• Est. Priority Date: 11/06/2015
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Fung, Jason G., Bajaj, Rajeev, Redfield, Daniel, Khanna, Aniruddh, Cornejo, Mario, Menk, Gregory E., Watkins, John
• Primary Examiner(s): Rose, Robert A
• Application Number:
  US14/935,134
• Publication Number:
  US 20170133252A1
• Time in Patent Office: 1,593 Days
• Field of Search: 451 5, 451 6, 451 8, 451 41
• CPC Class Codes: B24B 37/26 characterised by the shape of the lapping pad surface, e.g. grooved
• CPC Class Codes: B24B 49/003 involving acoustic means
• CPC Class Codes: B24B 49/10 involving electrical means B24B49/02, B24B49/08 take precedence
• CPC Class Codes: B24B 49/14 taking regard of the temperature during grinding
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: B29C 64/106 using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
• CPC Class Codes: B29K 2995/0003 having particular electrical or magnetic properties, e.g. piezoelectric
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: B29L 2031/736 Grinding or polishing equipment
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/30625 With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
• CPC Class Codes: H01L 21/67075 for wet etching
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67294 using identification means, e.g. labels on substrates or labels on containers
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

Claims

1. A polishing pad apparatus, comprising:

a printed polymeric body comprising;

a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings; and

one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface of the plurality of polishing features, and the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;

a radio frequency identification (RFID) tag integrally disposed within the printed polymeric body, wherein the RFID tag is positioned a distance from the polishing surface; and

a sensor integrally disposed within the printed polymeric body and communicatively coupled to the RFID tag.

2. The apparatus of claim 1, wherein the first and second materials are selected from the group consisting of epoxies, phenolics, amines, polyesters, urethanes, silicon, acrylates, mixtures, copolymers, and grafts thereof.

3. The apparatus of claim 1, wherein the RFID tag has an inductive antenna configured to communicate with an interrogator using a wireless communication technique.

4. The apparatus of claim 1, wherein the distance is between about 200 μ

m to about 500 μ

m from the polishing surface.

5. The apparatus of claim 1,

wherein the sensor is selected from the group consisting of a thermal sensor, an acoustic sensor, a conductivity sensor, an acceleration sensor, a torque sensor, a friction sensor, and a pressure sensor, and the RFID tag is configured to communicate with an interrogator using a wireless communication technique.

17. The apparatus of claim 1, wherein a recess is formed in the printed polymeric body, and the RFID tag is coupled to a surface of the recess formed within the printed polymeric body.

18. The apparatus of claim 17, wherein the RFID tag comprises an electrically conductive polymer material comprising conductive nano-particles.

24. The apparatus of claim 1, wherein the one or more polishing features are formed on the one or more base features, the one or more polishing features having a first height, the one or more base features having a second height, wherein the first height is greater than the second height.

6. A chemical mechanical polishing system, comprising:

a platen having a supporting surface;

a printed polishing pad having a radio frequency identification (RFID) tag disposed therein, wherein the RFID tag stores a plurality of information associated with properties of the printed polishing pad, the printed polishing pad being disposed over the supporting surface of the platen and comprising;

a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings; and

one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface, the plurality of polishing features having a first height, the one or more base features having a second height, wherein the first height is greater than the second height, and wherein the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;

an interrogator coupled to the platen, wherein the interrogator and the RFID tag are configured to communicate with one another using a wireless communication technique; and

a polishing head positioned opposite the platen, wherein the polishing head is configured to urge a substrate against the polishing surface of the printed polishing pad.

7. The polishing system of claim 6, wherein the printed polishing pad is formed from an electrically non-conductive polymer material and the RFID tag is formed from an electrically conductive polymer material.

8. The polishing system of claim 6, wherein the RFID tag comprises one or more of a thermal sensor, an acoustic sensor, a conductivity sensor, an acceleration sensor, a torque sensor, a friction sensor, or a pressure sensor.

9. The polishing system of claim 6, further comprising:

a retaining ring that includes an RFID tag disposed therein.

10. The polishing system of claim 6, further comprising:

a flexible membrane that includes an RFID tag disposed therein.

11. The polishing system of claim 6, wherein the interrogator is communicatively coupled to a controller that is adapted to monitor one or more processing parameters during a polishing process.

19. The polishing system of claim 6, wherein a recess is formed in the printed polishing pad, and the RFID tag is coupled to a surface of the recess formed within the printed polishing pad.

12. A method of polishing a substrate, comprising:

sensing one or more processing parameters with a radio frequency identification (RFID) tag disposed within a printed polishing pad, the RFID tag being communicatively coupled to a sensor disposed within the printed polishing pad, the printed polishing pad comprising;

a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings; and

one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface and the one or more base features and the one or more polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;

receiving, via an interrogator, one or more signals from the RFID tag; and

communicating the one or more signals to a controller adapted to control the polishing process, wherein the controller initiates a change in the polishing process in response to receiving the one or more signals.

13. The method of claim 12, wherein the one or more signals contain information generated by the sensor, wherein the sensor comprises one or more of a thermal sensor, an acoustic sensor, a conductivity sensor, an acceleration sensor, a torque sensor, a friction sensor, or a pressure sensor.

25. The method of claim 12, wherein the one or more polishing features are formed on the one or more base features, the one or more polishing features having a first height, the one or more base features having a second height, wherein the first height is greater than the second height.

14. A non-transitory computer-readable medium storing instructions that, when executed by a processor, cause a computer system to implement a substrate polishing process, by performing the operations of:

causing initiation of a substrate polishing process;

receiving signals corresponding to one or more processing parameters, wherein the signals are generated by a wireless communication apparatus disposed within a printed polishing pad, the wireless communication apparatus comprising a radio frequency identification (RFID) tag and a sensor communicatively coupled to the RFID tag, the printed polishing pad comprising;

a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric ring; and

one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface, and the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;

analyzing the signals to determine processing conditions; and

changing at least one of the one or more processing parameters in response to the processing conditions.

15. The non-transitory computer-readable medium of claim 14, wherein the processing parameters corresponding to the signals comprise one or more of a thermal signal, an acoustic signal, a conductivity signal, an acceleration signal, a torque signal, a friction signal, or a pressure signal.

16. The non-transitory computer-readable medium of claim 14, wherein the changing at least one of the one or more processing parameters is performed during the substrate polishing process.

26. The non-transitory computer-readable medium of claim 14, wherein the one or more polishing features are formed on the one or more base features, the one or more polishing features having a first height, the one or more base features having a second height, wherein the first height is greater than the second height.

20. A polishing pad apparatus, comprising:

a printed polymeric body comprising;

a plurality of polishing features, which have a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings; and

one or more base features, wherein the plurality of polishing features comprise a first material and the one or more base features comprise a second material different from the first material;

an RFID tag integrally disposed within the printed polymeric body, wherein the RFID tag is positioned a distance from the polishing surface and comprises an electrically conductive polymer material; and

a sensor communicatively coupled to the RFID tag, the sensor being disposed within the printed polymeric body.

21. A polishing pad apparatus, comprising:

a printed polymeric body comprising;

a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings; and

one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface of the one or more polishing features, and the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface; and

an RFID tag integrally disposed within the printed polymeric body, wherein the RFID tag stores a plurality of information associated with two or more properties of the printed polymeric body, wherein the RFID tag is positioned a distance from the polishing surface.

22. The apparatus of claim 21, wherein the properties of the printed polymeric body comprise:

a type of the printed polymeric body, a configuration of the printed polymeric body, a surface structure of the printed polymeric body, a material of the printed polymeric body, a plurality of physical properties of the printed polymeric body, or a texture of the printed polymeric body.

23. The apparatus of claim 21, wherein the first material and the second material each comprise an acrylate.

27. A polishing pad apparatus, comprising:

a printed polymeric body comprising;

a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings; and

one or more base features comprising a second material different than the first material,

wherein;

the one or more base features are disposed a distance from the polishing surface of the plurality of polishing features;

the plurality of polishing features have a first height and the one or more base features have a second height, wherein the first height is greater than the second height; and

the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface; and

a radio frequency (RFID) tag integrally disposed within the printed polymeric body, wherein the RFID tag is positioned a distance from the polishing surface.