Semiconductor light emitting device

• US 10,593,833 B2
• Filed: 07/01/2019
• Issued: 03/17/2020
• Est. Priority Date: 07/24/2001
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Niki, Isamu, Yamada, Motokazu, Sano, Masahiko, Shioji, Shuji
• Primary Examiner(s): Sefer, Ahmed N
• Application Number:
  US16/458,664
• Publication Number:
  US 20190326472A1
• Time in Patent Office: 260 Days
• CPC Class Codes: H01L 21/02378 Silicon carbide
• CPC Class Codes: H01L 21/0254 Nitrides
• CPC Class Codes: H01L 21/02647 Lateral overgrowth
• CPC Class Codes: H01L 2933/0083 Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/16 with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/24 of the light emitting region, e.g. non-planar junction
• CPC Class Codes: H01L 33/26 Materials of the light emitting region
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
• CPC Class Codes: Y10T 428/24479 including variation in thickness

Abstract

A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.

Claims

1. A semiconductor light emitting diode comprising:

a substrate;

a stack of GaN based semiconductor layers disposed on or above the substrate, the semiconductor layers and the substrate being made of different materials, the stack of GaN based semiconductor layers comprising an n-type GaN based semiconductor layer, a light emitting layer disposed on or above the n-type GaN based semiconductor layer, and a p-type GaN based semiconductor layer disposed on or above the light emitting layer;

an ohmic electrode disposed on or above the p-type GaN based semiconductor layer; and

an n electrode disposed on or above the n-type GaN based semiconductor layer,

wherein the diode is configured such that light generated in the GaN based semiconductor layers is released through the ohmic electrode or the substrate,

in plan view of the stack of GaN based semiconductor layers, the n electrode is disposed at a portion of the n-type GaN based semiconductor layer exposed through other layers of the stack of GaN based semiconductor layers and, and in the plan view of the stack of GaN based semiconductor layers, the n electrode is disposed inside the p-type GaN based semiconductor layer that remains on the substrate,

the substrate comprises protrusions that are disposed on a surface of the substrate and made of a same material as the substrate, the protrusions being configured to scatter or diffract the generated light and having a two-dimensional pattern of a repeating set of protrusions, and

in a sectional view of the substrate, side surfaces of the protrusions incline, and an inclination angle of the side surfaces from the surface of the substrate is more than 120 degrees and not more than 150 degrees.

2. The semiconductor light emitting diode of claim 1, wherein in the plan view of the stack of GaN based semiconductor layers, the protrusions do not have a component line that is parallel to an A-axis of the stack of GaN based semiconductor layers.

3. The semiconductor light emitting diode of claim 1, wherein the ohmic electrode covers almost the entirety of the stack of GaN based semiconductor layers.

4. The semiconductor light emitting diode of claim 1, wherein the ohmic electrode is transparent.

5. The semiconductor light emitting diode of claim 1, wherein the ohmic electrode is an alloy or a multilayer film including at least one selected from the group consisting of Ni, Pd, Co, Fe, Ti, Cu, Rh, Au, Ru, W, Zr, Mo, Ta, Pt, Ag, oxides of these metals and nitrides of these metals.

6. The semiconductor light emitting diode of claim 1, wherein the ohmic electrode is a reflecting electrode.

7. The semiconductor light emitting diode of claim 1, wherein the ohmic electrode is an alloy or a multilayer film including at least one selected from the group consisting of Rh, Ir, Ag and Al, oxides of these metals and nitrides of these metals.

8. The semiconductor light emitting diode of claim 1, wherein the substrate is a sharpie substrate having a C face as the primary surface.

9. The semiconductor light emitting diode of claim 1, further comprising a resin layer formed on or above the stack of GaN based semiconductor layers and containing yttrium aluminum oxide-based fluorescent substance.

10. A semiconductor light emitting diode comprising:

a substrate;

a stack of GaN based semiconductor layers disposed on or above the substrate, the semiconductor layers and the substrate being made of different materials, the stack of GaN based semiconductor layers comprising an n-type GaN based semiconductor layer, a light emitting layer disposed on or above the n-type GaN based semiconductor layer, and a p-type GaN based semiconductor layer disposed on or above the light emitting layer;

an ohmic electrode disposed on or above the p-type GaN based semiconductor layer; and

an n electrode disposed on or above the n-type GaN based semiconductor layer,

wherein the diode is configured such that light generated in the GaN based semiconductor layers is released through the ohmic electrode or the substrate,

in plan view of the stack of GaN based semiconductor layers, peripheral portions of the n-type GaN based semiconductor layer, the light emitting layer and the p-type GaN based semiconductor layer have a same shape,

the substrate comprises protrusions that are disposed on a surface of the substrate and made of a same material as the substrate, the protrusions being configured to scatter or diffract the generated light and having a two-dimensional pattern of a repeating set of protrusions, and

in a sectional view of the substrate, side surfaces of the protrusions incline, and an inclination angle of the side surfaces from the surface of the substrate is more than 120 degrees and not more than 150 degrees.

11. The semiconductor light emitting diode of claim 10, wherein in the plan view of the stack of GaN based semiconductor layers, the protrusions do not have a component line that is parallel to an A-axis of the stack of GaN based semiconductor layers.

12. The semiconductor light emitting diode of claim 10, wherein the ohmic electrode covers almost the entirety of the stack of GaN based semiconductor layers.

13. The semiconductor light emitting diode of claim 10, wherein the ohmic electrode is transparent.

14. The semiconductor light emitting diode of claim 10, wherein the ohmic electrode is an alloy or a multilayer film including at least one selected from the group consisting of Ni, Pd, Co, Fe, Ti, Cu, Rh, Au, Ru, W, Zr, Mo, Ta, Pt, Ag, oxides of these metals and nitrides of these metals.

15. The semiconductor light emitting diode of claim 10, wherein the ohmic electrode is a reflecting electrode.

16. The semiconductor light emitting diode of claim 10, wherein the ohmic electrode is an alloy or a multilayer film including at least one selected from the group consisting of Rh, Ir, Ag and Al, oxides of these metals and nitrides of these metals.

17. The semiconductor light emitting diode of claim 10, wherein the substrate is a sharpie substrate having a C face as the primary surface.

18. The semiconductor light emitting diode of claim 10, further comprising a resin layer formed on or above the stack of GaN based semiconductor layers and containing yttrium aluminum oxide-based fluorescent substance.