Distributed multi-aperture camera array
First Claim
1. An electronic camera assembly comprising:
- a circuit board;
a plurality of logic facets coupled to one side of the circuit board; and
a plurality of sensor facets, each sensor facet being coupled to a respective one of the plurality of logic facets, each sensor facet comprising a plurality of sensor pixels, each sensor facet capable of capturing light at a plurality of capture resolutions;
wherein;
each sensor facet comprises a selectable capture resolution from the plurality of capture resolutions;
each sensor facet is individually addressable such that the plurality of sensor facets are configurable to provide heterogeneous capture resolutions;
the circuit board comprises a plurality of facet locations; and
each particular facet location is configured to transmit signals from a particular sensor facet that is electrically coupled to the particular facet location to a display, thereby displaying light on the display that corresponds to light captured at a particular selected capture resolution by the particular sensor facet.
1 Assignment
0 Petitions
Accused Products
Abstract
In one embodiment, an electronic camera assembly includes a circuit board and a plurality of sensor facets. Each sensor facet is coupled to a respective one of a plurality of facet locations on one side of the circuit board. Each sensor facet includes a plurality of sensor pixels. Each sensor facet can capture light at a plurality of capture resolutions. Each sensor facet includes a selectable capture resolution from the plurality of capture resolutions. Each sensor facet is individually addressable such that the plurality of sensor facets are configurable to provide heterogeneous capture resolutions. Each particular facet location is configured to transmit signals from a particular sensor facet that is electrically coupled to the particular facet location to a display, thereby displaying light on the display that corresponds to light captured at a particular selected capture resolution by the particular sensor facet.
189 Citations
20 Claims
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1. An electronic camera assembly comprising:
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a circuit board; a plurality of logic facets coupled to one side of the circuit board; and a plurality of sensor facets, each sensor facet being coupled to a respective one of the plurality of logic facets, each sensor facet comprising a plurality of sensor pixels, each sensor facet capable of capturing light at a plurality of capture resolutions; wherein; each sensor facet comprises a selectable capture resolution from the plurality of capture resolutions; each sensor facet is individually addressable such that the plurality of sensor facets are configurable to provide heterogeneous capture resolutions; the circuit board comprises a plurality of facet locations; and each particular facet location is configured to transmit signals from a particular sensor facet that is electrically coupled to the particular facet location to a display, thereby displaying light on the display that corresponds to light captured at a particular selected capture resolution by the particular sensor facet. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electronic camera assembly comprising:
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a circuit board; and a plurality of sensor facets, each sensor facet being coupled to a respective one of a plurality of facet locations on one side of the circuit board, each sensor facet comprising a plurality of sensor pixels, each sensor facet capable of capturing light at a plurality of capture resolutions; wherein; each sensor facet comprises a selectable capture resolution from the plurality of capture resolutions; each sensor facet is individually addressable such that the plurality of sensor facets are configurable to provide heterogeneous capture resolutions; and each particular facet location is configured to transmit signals from a particular sensor facet that is electrically coupled to the particular facet location to a display, thereby displaying light on the display that corresponds to light captured at a particular selected capture resolution by the particular sensor facet. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of manufacturing an electronic camera assembly, the method comprising:
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forming a plurality of facet locations on a flexible circuit board, each facet location corresponding to one of a plurality of sensor facets, the plurality of facet locations arranged into a plurality of facet columns; cutting the flexible circuit board into a pattern that permits the flexible circuit board to be later formed into a three-dimensional shape, wherein; when the flexible circuit is flat, at least some of the facet locations are separated from one or more adjacent facet locations by a plurality of gaps; and when the flexible circuit board is formed into the three-dimensional shape, the plurality of gaps are substantially eliminated; assembling the electronic camera assembly by coupling a plurality of rigid sensor facets to a first side of the flexible circuit board, each rigid sensor facet being coupled to a respective one of the facet locations; and forming the assembled electronic camera assembly into the three-dimensional shape. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification