Low equivalent series resistance RF filter for an active implantable medical device

• US 10,596,369 B2
• Filed: 09/05/2018
• Issued: 03/24/2020
• Est. Priority Date: 03/01/2011
• Status: Active Grant

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Stevenson, Robert A., Frysz, Christine A., Marzano, Thomas, Seitz, Keith W., Martino, Marc Gregory
• Primary Examiner(s): Wehrheim, Lindsey G
• Application Number:
  US16/121,716
• Publication Number:
  US 20190001123A1
• Time in Patent Office: 566 Days
• Field of Search: 607 63
• CPC Class Codes: A61N 1/08 Arrangements or circuits for monitoring, protecting, controlling or indicating for external stimulators A61N1/3603; for implantable neurostimulators A61N1/36128; for heart stimulators A61N1/37; for defibrillators A61N1/3925
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/12 Ceramic dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/236 leading through the housing, i.e. lead-through
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters

Abstract

A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device.

Claims

1. A hermetically sealed filtered feedthrough assembly that is attachable to an opening of a housing of an active implantable medical device (AIMD), the filtered feedthrough assembly comprising:

a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an AIMD;

b) an insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, the insulator comprising an insulator outer surface extending to an insulator body fluid side and to an insulator device side, wherein, when the ferrule is attached to the housing of the AIMD, the insulator body fluid and device sides reside outside and inside the AIMD, respectively;

c) at least one insulator active via hole extending through the insulator to the insulator body fluid and device sides;

d) an electrically conductive active leadwire residing in the at least one insulator active via hole where a second gold braze hermetically seals the active leadwire to the insulator, the active leadwire extending from an active leadwire body fluid side portion to an active leadwire device side portion; and

e) a capacitor disposed adjacent to the insulator device side, the capacitor comprising;

i) a capacitor dielectric comprising a capacitor dielectric outer surface extending to a capacitor dielectric first side adjacent to the insulator device side and to a capacitor dielectric second side, wherein the capacitor dielectric supports at least one active electrode plate interleaved in a capacitive relationship with at least one ground electrode plate;

ii) a capacitor active metallization supported on the capacitor dielectric and being conductively connected to the at least one active electrode plate, wherein an active electrical connection conductively connects the active leadwire to the capacitor active metallization; and

iii) a capacitor ground metallization supported on the capacitor dielectric and being conductively connected to the at least one ground electrode plate, wherein a ground electrical connection conductively connects the capacitor ground metallization to the ferrule, and

iv) wherein the capacitor dielectric has a dielectric constant k that is greater than 0, but less than 1000, and

v) wherein the capacitor is the first filter capacitor conductively connected to the conductive leadwire device side portion at or adjacent to the insulator device side.

2. The filtered feedthrough assembly of claim 1, wherein at least one capacitor active passageway extends through the capacitor dielectric to the capacitor dielectric first and second sides, and wherein the capacitor active metallization supported on the capacitor dielectric in the capacitor active passageway is conductively connected to the at least one active electrode plate, and wherein the active leadwire device side portion resides in the capacitor active passageway where the active electrical connection conductively connects the active leadwire to the capacitor active metallization of the capacitor.

3. The filtered feedthrough assembly of claim 2, wherein the capacitor ground metallization is supported on the capacitor dielectric outer surface conductively connected to the at least one ground electrode plate, and wherein the ground electrical connection conductively connects the capacitor ground metallization of the capacitor to the ferrule.

4. The filtered feedthrough assembly of claim 3, further comprising:

a) at least one insulator ground via hole extending through the insulator to the insulator body fluid and device sides;

b) an electrically conductive ground leadwire residing in the at least one insulator ground via hole where a third gold braze hermetically seals the ground leadwire to the insulator, the ground leadwire extending from a ground leadwire body fluid side portion to a ground leadwire device side portion, wherein at least the ground leadwire device side portion extends outwardly beyond the insulator device side; and

c) at least one capacitor ground passageway extending through the capacitor dielectric to the capacitor dielectric first and second sides, wherein the ground leadwire device side portion resides in the at least one capacitor ground passageway, and

d) wherein a first portion of the capacitor ground metallization supported on the capacitor dielectric in the at least one capacitor ground passageway is conductively connected to the at least one ground electrode plate, and wherein a first portion of the ground electrical connection conductively connects the first portion of the capacitor ground metallization to the ground leadwire device side portion, and

e) wherein the ground leadwire is also conductively and mechanically connected to the ferrule.

5. The filtered feedthrough assembly of claim 4, wherein the capacitor dielectric outer surface is devoid of the capacitor ground metallization.

6. The filtered feedthrough assembly of claim 4, wherein the ferrule comprises at least one of a peninsula extending inwardly into the ferrule opening and a bridge extending completely across the ferrule opening, and wherein the ground leadwire device side portion extending through the at least one capacitor ground passageway in the capacitor dielectric is conductively and mechanically connected to the at least one of the peninsula and the bridge of the ferrule.

7. The filtered feedthrough assembly of claim 4, wherein a second portion of the capacitor ground metallization supported on the capacitor dielectric outer surface is conductively connected to the at least one ground electrode plate, and wherein a second portion of the ground electrical connection conductively connects the second portion of the capacitor ground metallization to the ferrule so that the capacitor is grounded to the ferrule at both:

a) the first portion of the ground electrical connection conductively connecting the first portion of the capacitor ground metallization and the ground leadwire to the ferrule; and

b) the second portion of the ground electrical connection conductively connecting the second portion of the capacitor ground metallization to the ferrule.

8. The filtered feedthrough assembly of claim 7, wherein the second portion of the ground electrical connection is conductively connected to the first gold braze hermetically sealing the insulator to the ferrule.

9. The filtered feedthrough assembly of claim 1, wherein:

a) the ferrule has a ferrule outer perimeter comprising a ferrule outer perimeter first portion and a ferrule outer perimeter second portion, and the capacitor dielectric outer surface comprises a capacitor dielectric outer surface first portion and a capacitor dielectric outer surface second portion, and

b) at least a portion of the capacitor dielectric outer surface first portion is spaced inwardly toward the active leadwire with respect to the ferrule outer perimeter first portion, and the capacitor dielectric outer surface second portion overhangs the ferrule outer perimeter second portion.

10. The filtered feedthrough assembly of claim 9, wherein the capacitor has a rectangular shape in cross-section, and wherein the capacitor dielectric outer surface first portion is shorter than the capacitor dielectric outer surface second portion overhanging the ferrule outer perimeter second portion.

11. The filtered feedthrough assembly of claim 1, wherein the ferrule comprises a ferrule device side surface corresponding to the insulator device side, the ferrule device side surface having at least one recessed pocket provided with a gold pad, and wherein at least a portion of the ground electrical connection physically connects the capacitor ground metallization to the gold pad to thereby provide an oxide-resistant ground attachment of the capacitor to the ferrule.

12. The filtered feedthrough assembly of claim 1, wherein the hermetic seal of the insulator to the ferrule comprises an insulator metallization disposed on the insulator outer surface, and wherein the first gold braze hermetically seals the insulator metallization to the ferrule.

13. The filtered feedthrough assembly of claim 12, wherein the insulator metallization comprises an adhesion layer disposed on the insulator outer surface and a wetting layer disposed on the adhesion layer, and wherein the adhesion layer is titanium and the wetting layer comprises molybdenum or niobium.

14. The filtered feedthrough assembly of claim 1, wherein the conductive active leadwire comprises a first active leadwire and a second active leadwire which is not of the same material as the first active leadwire,

a) wherein the first active leadwire comprises a first active leadwire first end spaced from a first active leadwire second end, the first active leadwire first end residing in the at least one insulator active via hole with the first active leadwire second end extending outwardly beyond the insulator body fluid side, and

b) wherein the second active leadwire comprises a second active leadwire first end spaced from a second active leadwire second end, the second active leadwire first end residing in the at least one insulator active via hole at or adjacent to the first active leadwire first end with the second active leadwire second end extending outwardly beyond the insulator device side, and

c) wherein the second gold braze contacts the first active leadwire first end and the second active leadwire first end to form the hermetic seal separating the insulator body fluid side from the insulator device side in the at least one insulator active via hole.

15. The filtered feedthrough assembly of claim 14, wherein at least one capacitor active passageway extends through the capacitor dielectric to the capacitor dielectric first and second sides, and the second active leadwire second end resides in the at least one capacitor active passageway extending through the capacitor dielectric, and wherein:

a) a third conductive active leadwire comprises a third active leadwire first end spaced from a third active leadwire second end, the third active leadwire first end residing at or adjacent to the second active leadwire second end in the at least one capacitor active passageway, and wherein the third active leadwire second end extends outwardly beyond the capacitor dielectric; and

b) a first electrically conductive material comprising the active electrical connection conductively connecting the second active leadwire second end, the third active leadwire first end and the capacitor active metallization conductively connected to the at least one active electrode plate of the capacitor together.

16. The filtered feedthrough assembly of claim 1, wherein the capacitor is selected from the group consisting of a monolithic ceramic feedthrough filter capacitor, an internally grounded feedthrough capacitor, a hybrid internally grounded feedthrough capacitor, a flat-through capacitor, an MLCC chip capacitor, and an X2Y attenuator.

17. The filtered feedthrough assembly of claim 1, wherein the capacitor is a multi-element broadband lowpass filter having at least one inductor, the multi-element broadband lowpass filter forming one of the group consisting of an L-filter, a reverse L-filter, an LL-filter, a reverse LL-filter, a T-filter, a Pi-filter, and an n-element lowpass filter.

18. The filtered feedthrough assembly of claim 1, wherein the capacitor is an MLCC chip capacitor that is mounted to a circuit board, and wherein the circuit board is mounted to at least one of the ferrule and the insulator.

19. The filtered feedthrough assembly of claim 18, wherein at least one circuit board ground plate is disposed on or in the circuit board, and wherein the at least one circuit board ground plate is conductively connected to the capacitor ground metallization in turn conductively connected to both the at least one ground electrode plate of the capacitor and to the ferrule.

20. The filtered feedthrough assembly of claim 19, wherein the at least one circuit board ground plate comprises at least one internal circuit board ground plate that is disposed in the circuit board and at least one external circuit board ground plate that is disposed on the circuit board, the at least one external circuit board ground plate facing at least one of the insulator and the ferrule, and wherein the at least one internal and external circuit board ground plates are conductively connected to the capacitor ground metallization in turn conductively connected to the at least one ground electrode plate of the capacitor and to the ferrule.

21. The filtered feedthrough assembly of claim 1, wherein the ground electrical connection conductively connecting the capacitor ground metallization to the ferrule is conductively connected to an oxide-resistant metal addition supported on the ferrule, and wherein the oxide-resistant metal addition is of a different metal in comparison to the ferrule.

22. The filtered feedthrough assembly of claim 1, wherein the active electrical connection conductively connecting the active leadwire device side portion to the capacitor active metallization physically contacts the second gold braze hermetically sealing the active leadwire to the insulator.

23. The filtered feedthrough assembly of claim 1, wherein a capacitance of the capacitor is between 10 and 20,000 picofarads.

24. The filtered feedthrough assembly of claim 1, wherein an equivalent series resistance (ESR) is the sum of a dielectric loss plus an ohmic loss of the capacitor dielectric comprising the capacitor, and wherein the capacitor'"'"'s dielectric loss tangent measured in ohms at a range of MRI RF pulsed frequencies is greater than zero, but less than five percent of the capacitor'"'"'s ESR.

25. The filtered feedthrough assembly of claim 24, wherein the capacitor'"'"'s ESR at the range of MRI RF pulsed frequencies is greater than zero, but less than 0.5 ohm.

26. The filtered feedthrough assembly of claim 24, wherein the capacitor'"'"'s ESR at the range of MRI RF pulsed frequencies is greater than zero, but less than 2.0 ohms.

27. The filtered feedthrough assembly of claim 24, wherein the range of MRI RF pulsed frequencies is centered at 64 MHz or 128 MHz.

28. The filtered feedthrough assembly of claim 1, wherein a capacitance of the capacitor is between 350 and 10,000 picofarads.

29. A filtered feedthrough, comprising:

a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an active implantable medical device (AIMD);

b) an insulator residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, the insulator comprising an insulator outer surface extending to an insulator body fluid side and an insulator device side, wherein, when the ferrule is attached to the housing of an AIMD, the insulator body fluid and device sides reside outside and inside the AIMD, respectively;

c) at least one insulator active via hole extending through the insulator to the insulator body fluid and device sides;

d) an electrically conductive active leadwire residing in the at least one insulator active via hole where a second gold braze hermetically seals the active leadwire to the insulator, the active leadwire extending from an active leadwire body fluid side portion to an active leadwire device side portion;

e) a capacitor disposed adjacent to the insulator device side, the capacitor comprising;

i) a capacitor dielectric comprising a capacitor dielectric outer surface extending to a capacitor dielectric first side adjacent to the insulator device side and to a capacitor dielectric second side, wherein the capacitor dielectric supports at least one active electrode plate interleaved in a capacitive relationship with at least one ground electrode plate;

ii) at least one capacitor active passageway extending through the capacitor dielectric to the capacitor dielectric first and second sides;

iii) a capacitor active metallization supported on the capacitor dielectric in the at least one capacitor active passageway where the capacitor active metallization is conductively connected to the at least one active electrode plate, wherein the active leadwire device side portion resides in the at least one capacitor active passageway where an active electrical connection conductively connects the active leadwire to the capacitor active metallization; and

iv) a capacitor ground metallization supported on the capacitor dielectric and being conductively connected to the at least one ground electrode plate, wherein a ground electrical connection conductively connects the capacitor ground metallization to the ferrule, and

v) wherein the capacitor dielectric has a dielectric constant k that is greater than 0, but less than 1000, and

vi) wherein the capacitor is the first filter capacitor conductively connected to the conductive leadwire device side portion at or adjacent to the insulator device side.

30. The filtered feedthrough of claim 29, further comprising:

a) at least one insulator ground via hole extending through the insulator to the insulator body fluid and device sides;

b) an electrically conductive ground leadwire residing in the at least one insulator ground via hole where a third gold braze hermetically seals the ground leadwire to the insulator, the ground leadwire extending from a ground leadwire body fluid side portion to a ground leadwire device side portion, wherein at least the ground leadwire device side portion extends outwardly beyond the insulator device side; and

c) at least one capacitor ground passageway extending through the capacitor dielectric to the capacitor dielectric first and second sides, wherein the ground leadwire device side portion resides in the at least one capacitor ground passageway, and

d) wherein a first portion of the capacitor ground metallization supported on the capacitor dielectric in the at least one capacitor ground passageway is conductively connected to the at least one ground electrode plate, and wherein a first portion of the ground electrical connection conductively connects the first portion of the capacitor ground metallization to the ground leadwire device side portion, and

e) wherein the ground leadwire is also conductively and mechanically connected to the ferrule.