Encapsulant composition for use with electrical components in hard disk drives, and related electrical components and hard disk drives

• US 10,597,486 B2
• Filed: 10/31/2017
• Issued: 03/24/2020
• Est. Priority Date: 11/02/2016
• Status: Active Grant

• Current Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Original Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Inventors: Peterson, Michael John, Fabry, Michael R.
• Primary Examiner(s): McNally, Daniel
• Application Number:
  US15/799,790
• Publication Number:
  US 20180118876A1
• Time in Patent Office: 875 Days
• CPC Class Codes: B32B 2037/1253 curable adhesive
• CPC Class Codes: C08G 59/184 with amines
• CPC Class Codes: C08G 59/3209 obtained by polymerisation of unsaturated mono-epoxy compounds
• CPC Class Codes: C08G 59/50 Amines
• CPC Class Codes: C08K 3/00 Use of inorganic substances as compounding ingredients
• CPC Class Codes: C08L 63/10 Epoxy resins modified by unsaturated compounds
• CPC Class Codes: C09D 163/00 Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
• CPC Class Codes: C09J 163/10 Epoxy resins modified by unsaturated compounds
• CPC Class Codes: G11B 25/043 using rotating discs
• CPC Class Codes: G11B 33/02 Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
• CPC Class Codes: G11B 33/1446 Reducing contamination, e.g. by dust, debris
• CPC Class Codes: G11B 5/4826 Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive G11B5/484 takes precedence; details of head housings or structures G11B5/10, G11B5/127; adjustment relative to the record carrier G11B5/56
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 23/295 containing a filler H01L23/296 takes precedence
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist
• CPC Class Codes: H05K 3/285 Permanent coating compositions

Abstract

The present disclosure relates to encapsulant compositions for use with hard disk drive devices.

Claims

1. A method of coating one or more surfaces of at least a portion of an electrical structure for use in a hard disk drive, wherein the method comprises:

a) applying an uncured encapsulant composition on at least a portion of a surface of the electrical structure, wherein the uncured encapsulant composition comprises;

i) uncured epoxy resin component; and

ii) an inorganic filler particle component, wherein the inorganic filler particle component is present in an amount of at least 0.05% by weight of the uncured encapsulant composition; and

b) curing the encapsulant composition, wherein the cured encapsulant composition has a Total Outgassing value of 1000 nanograms per gram or less of outgassed compounds of cured encapsulant composition according to Outgassing Test Procedure.

2. The method of claim 1, wherein the uncured encapsulant composition cures at least 95% in 10 minutes or less at a temperature of 130°

C. or more.

3. The method of claim 1, wherein the electrical structure comprises a ceramic cap, a preamplifier integrated circuit, a head pad, and/or a sensor.

4. An electrical structure for use in a hard disk drive, wherein the electrical structure has a coating on at least a portion of a surface of the electrical structure, wherein the coating comprises a cured encapsulant composition, wherein the cured encapsulant composition comprises:

a) cured epoxy resin component; and

b) an inorganic filler particle component, wherein the inorganic filler particle component is present in an amount of at least 0.05% by weight of the cured encapsulant composition, and wherein the cured encapsulant composition has a Total Outgassing value of 1000 nanograms per gram or less of outgassed compounds of cured encapsulant composition according to Outgassing Test Procedure.

5. The electrical component of claim 4, wherein the cured encapsulant is derived from an uncured encapsulant composition that cures at least 95% in 10 minutes or less at a temperature of 130°

C. or more.

6. The electrical component of claim 4, wherein the cured encapsulant composition includes substantially no silane compounds.

7. The electrical component of claim 4, wherein inorganic filler particles have an average particle size of at least 0.05 micrometers.

8. The electrical component of claim 4, wherein the electrical structure comprises a ceramic cap, a preamplifier integrated circuit, a head pad, and/or a sensor.

9. A hard disk drive comprising the electrical structure of claim 4.

10. A method of assembling a hard disk drive electrical component and printed circuit substrate, wherein the method comprises:

a) providing an integrated circuit component having a first major surface comprising one or more electrical interconnects;

b) providing a printed circuit substrate having a first major surface comprising one or more electrical contacts, wherein the first major surface of the integrated circuit component faces the first major surface of the printed circuit substrate;

c) physically and electrically coupling the one or more electrical interconnects to the one or more electrical contacts, wherein a space is formed between the integrated circuit component and the printed circuit substrate;

d) dispensing an uncured encapsulant composition near the space between the integrated circuit component and the printed circuit substrate so that at least a portion of the uncured encapsulant composition flows into at least a portion of the space via capillary action, wherein the uncured encapsulant composition comprises;

i) an uncured epoxy resin component; and

ii) an inorganic filler particle component, wherein the inorganic filler particle component is present in an amount in the range from 30 to 80% by weight of the uncured encapsulant composition; and

e) curing the encapsulant composition that is present in the space between the integrated circuit component and the printed circuit substrate, wherein the cured encapsulant composition has a Total Outgassing value of 1000 nanograms per gram or less of outgassed compounds of cured encapsulant composition according to Outgassing Test Procedure.

11. The method of claim 10, wherein the cured encapsulant composition includes substantially no silane compounds.

12. The method of claim 10, wherein inorganic filler particles have an average particle size of at least 0.05 micrometers.

13. The method of claim 10, wherein dispensing an uncured encapsulant composition comprises dispensing the uncured encapsulant composition from an ink jet near the space between the integrated circuit component and the printed circuit substrate.

14. The method of claim 10, wherein the uncured encapsulant composition cures at least 95% in 10 minutes or less at a temperature of 130°

C. or more.

15. The method of claim 10, wherein the inorganic filler particle component comprises alumina particles, silica particles, silicon oxide particles, silicon nitride particles, silicon dioxide particles, glass particles, aluminum oxide particles, and/or aluminum nitride particles.

16. The method of claim 10, wherein the inorganic filler particle component has an average particle size in the range from 0.5 to 50 micrometers.