Scalable high-bandwidth connectivity

• US 10,601,105 B2
• Filed: 03/02/2017
• Issued: 03/24/2020
• Est. Priority Date: 05/12/2011
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Keyssa, Inc.
• Inventors: McCormack, Gary D., Kyles, Ian A.
• Primary Examiner(s): Patel, Nimesh G
• Application Number:
  US15/448,239
• Publication Number:
  US 20170179572A1
• Time in Patent Office: 1,118 Days
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 1/525 between emitting and receiving antennas
• CPC Class Codes: H01Q 5/25 Ultra-wideband [UWB] systems, e.g. multiple resonance systems; Pulse systems
• CPC Class Codes: H04B 5/26 using coils
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.

Claims

1. An integrated circuit package, comprising:

a dielectric substrate;

a first die on the dielectric substrate, the first die having a plurality of corners, including at least a first corner, a second corner, and a third corner between the first and second corners;

a first antenna connected to the first die between the first corner and the third corner;

a second antenna connected to the first die between the second corner and the third corner, and spaced apart from the first antenna; and

an extremely high frequency (EHF) radiation-blocking structure comprised of electrically conductive material including a via fence having a row of spaced-apart vias extending through the dielectric substrate, the EHF radiation-blocking structure extending from between the first and second corners of the first die to be at least partially located between the first antenna and the second antenna and oriented to block propagation of EHF radiation between the first antenna and the second antenna via the dielectric substrate.

2. The integrated circuit package of claim 1, wherein the EHF radiation-blocking structure is configured to block propagation of radiation having an operating frequency of the first and second antennae.

3. The integrated circuit package of claim 1, wherein the EHF radiation-blocking structure extends into the dielectric substrate in an uninterrupted line away from the first die.

4. The integrated circuit package of claim 1, further comprising a ground plane attached to the dielectric substrate, and wherein the via fence of the EHF radiation-blocking structure has a strip of conductive material on a surface of the dielectric substrate, and the row of spaced-apart vias are formed along a length of the strip of conductive material, such that the vias electrically connect the strip of conductive material to the ground plane.

5. The integrated circuit package of claim 4, wherein the plurality of vias are spaced apart at intervals less than a wavelength of an operating frequency of the first and second antennae.

6. The integrated circuit package of claim 1, wherein the first die comprises:

a transmitter circuit operatively connected to the first antenna; and

a receiver circuit operatively connected to the second antenna.

7. The integrated circuit package of claim 6, wherein the first die has a length and a width;

the first antenna is located at a first port disposed at a point along the length; and

the second antenna is located at a second port disposed at a point along the width.

8. The integrated circuit package of claim 7, wherein the length and the width of the die are between 1.0 mm to 2.0 mm.

9. The integrated circuit package of claim 1, wherein the EHF radiation-blocking structure extends from the third corner between the first and second corners.

10. The integrated circuit package of claim 1, further comprising a package encapsulant on at least the first antenna, the second antenna, and the die.

11. An integrated circuit package, comprising:

a dielectric substrate;

a first die on the dielectric substrate;

a first antenna connected to the first die, wherein the first antenna extends from a first edge of the first die;

a second antenna connected to the first die, wherein the second antenna extends from a second edge of the first die, and is spaced apart from the first antenna; and

an extremely high frequency (EHF) radiation-blocking structure comprised of electrically conductive material including a via fence having a row of spaced-apart vias extending through the dielectric substrate, the EHF radiation-blocking structure at least partially located between the first antenna and the second antenna and oriented to block propagation of EHF radiation between the first antenna and the second antenna via the dielectric substrate.

12. The integrated circuit package of claim 11, wherein:

the first antenna is configured to communicate with a third antenna extending from a first edge of a second die of a second integrated circuit package;

the second antenna is configured to communicate with a fourth antenna extending from a second edge of the second die, the fourth antenna spaced apart from the third antenna; and

the second integrated circuit package further comprises a second EHF radiation-blocking structure including a second via fence aligned with the via fence of the EHF radiation-blocking structure.