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Scalable high-bandwidth connectivity

  • US 10,601,105 B2
  • Filed: 03/02/2017
  • Issued: 03/24/2020
  • Est. Priority Date: 05/12/2011
  • Status: Active Grant
First Claim
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1. An integrated circuit package, comprising:

  • a dielectric substrate;

    a first die on the dielectric substrate, the first die having a plurality of corners, including at least a first corner, a second corner, and a third corner between the first and second corners;

    a first antenna connected to the first die between the first corner and the third corner;

    a second antenna connected to the first die between the second corner and the third corner, and spaced apart from the first antenna; and

    an extremely high frequency (EHF) radiation-blocking structure comprised of electrically conductive material including a via fence having a row of spaced-apart vias extending through the dielectric substrate, the EHF radiation-blocking structure extending from between the first and second corners of the first die to be at least partially located between the first antenna and the second antenna and oriented to block propagation of EHF radiation between the first antenna and the second antenna via the dielectric substrate.

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