Variable-conductance heat transfer device

• US 10,605,539 B2
• Filed: 11/06/2017
• Issued: 03/31/2020
• Est. Priority Date: 05/11/2012
• Status: Active Grant

• Current Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Original Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Inventors: Bilski, Walter John, Toth, Jerome E., Thayer, John G.
• Primary Examiner(s): Ruby, Travis C
• Application Number:
  US15/804,400
• Publication Number:
  US 20180216896A1
• Time in Patent Office: 876 Days
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28F 13/14 by endowing the walls of conduits with zones of different degrees of conduction of heat

Abstract

A heat transfer device is provided for conducting heat from a heat source. The heat transfer device generally includes an evaporator for generating a vapor, a condenser in fluid communication with the evaporator, and a vapor flow restrictor interposed between the evaporator and the condenser, wherein the vapor flow restrictor can increase vapor pressure in at least a portion of the evaporator relative to vapor pressure in the condenser.

Claims

1. A heat transfer device for conducting heat from a heat source, the heat transfer device comprising:

an evaporator for generating a vapor;

a condenser in fluid communication with the evaporator, wherein the evaporator and the condenser together define an interior space of the heat transfer device; and

a vapor flow restrictor interposed between the evaporator and the condenser,

wherein the vapor flow restrictor has opposed surfaces with an orifice extending between the opposed surfaces, the orifice having an inlet and an outlet having cross-sectional areas of equal size with the inlet disposed in one of the opposed surfaces and the outlet disposed in the other surface of the opposed surfaces, wherein the orifice defines a vapor flow path from the evaporator to the condenser, wherein the vapor flow path is unobstructed through the orifice at all operating temperatures, and

wherein the vapor flow restrictor and an interior surface of the heat transfer device define between them a liquid flow path for working fluid to pass in the interior space from the condenser back toward the evaporator.

2. The heat transfer device of claim 1, wherein the vapor flow restrictor is positioned no more than half way from the evaporator to the condenser.

3. The heat transfer device of claim 1, wherein the orifice is located in the vapor flow restrictor such that the orifice is located approximately at a center of the vapor flow restrictor.

4. The heat transfer device of claim 1, wherein the vapor flow restrictor defines a vapor flow restrictor diameter, the orifice defines an orifice diameter, and the orifice diameter is 0.5% to 15% of the vapor flow restrictor diameter.

5. The heat transfer device of claim 1, wherein at least a portion of the vapor flow restrictor is fixedly connected to an interior surface of the heat transfer device.

6. The heat transfer device of claim 1, wherein the vapor flow restrictor includes a plurality of tabs, the tabs connecting the vapor flow restrictor to an interior surface of the heat transfer device.

7. The heat transfer device of claim 6, wherein the tabs at least partially define at least one gap between the vapor flow restrictor and the interior surface of the heat transfer device, and wherein working fluid is returned to the evaporator from the condenser through the gap.

8. The heat transfer device of claim 1 further comprising a wick disposed on at least a portion of the interior surface of the heat transfer device.

9. The heat transfer device of claim 8, wherein at least a portion of a perimeter of the vapor flow restrictor is in contact with at least a portion of the wick.

10. The heat transfer device of claim 9, wherein the heat transfer device is configured such that the wick is disposed in an area defined between the perimeter of the vapor flow restrictor and the interior surface of the heat transfer device and working fluid flows from the condenser to the evaporator past the vapor flow restrictor through the wick.

11. The heat transfer device of claim 1, wherein the vapor is substantially free of non-condensable gas.

12. The heat transfer device of claim 1, wherein the orifice of the vapor flow restrictor has a constant cross section and an inlet and an outlet of equal cross-sectional areas.

13. The heat transfer device of claim 1, wherein the vapor flow restrictor comprises a plate.

14. The heat transfer device of claim 13, wherein the plate defines a plate diameter, the orifice defines an orifice diameter, and the orifice diameter is 0.5% to 15% of the plate diameter.

15. The heat transfer device of claim 1, wherein the opposed surfaces are planar surfaces.

16. The heat transfer device of claim 1, wherein the condenser is defined by at least one wall, and wherein the at least one wall defines an interior space of the heat transfer device.

17. The heat transfer device of claim 1, wherein the vapor flow restrictor includes a baffle, wherein the orifice extends through the baffle, wherein the vapor flow restrictor includes a plurality of tabs extending radially away from the baffle, the tabs connecting the baffle to an interior surface of the heat transfer device, wherein radially-extending gaps are defined between the baffle and the interior surface of the heat transfer device, wherein the gaps are positioned such that working fluid is configured to pass axially through the gaps as the working fluid moves from the condenser to the evaporator.