Electronic component device, high-frequency front end circuit, and communication device

• US 10,607,775 B2
• Filed: 06/26/2019
• Issued: 03/31/2020
• Est. Priority Date: 12/27/2016
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Nomiya, Masato
• Primary Examiner(s): Rachedine, Mohammed
• Application Number:
  US16/452,590
• Publication Number:
  US 20190318871A1
• Time in Patent Office: 279 Days
• Field of Search: None
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/004 with the coil helically wound around an axis without a core
• CPC Class Codes: H01F 27/008 with temperature compensation
• CPC Class Codes: H01F 27/40 Structural association with built-in electric component, e.g. fuse
• CPC Class Codes: H01G 4/012 Form of non-self-supporting electrodes
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01G 4/258 Temperature compensation means
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01L 23/12 Mountings, e.g. non-detachable insulating substrates
• CPC Class Codes: H01L 25/10 the devices having separate containers
• CPC Class Codes: H01L 25/11 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H03H 7/01 Frequency selective two-port networks
• CPC Class Codes: H04B 1/40 Circuits
• CPC Class Codes: H05K 3/46 Manufacturing multilayer circuits

Abstract

An electronic component device includes an electronic component, a resin structure including the electronic component such that one main surface thereof is exposed, a through-electrode, and first and second wiring layers, in which the electronic component includes an element body, an inner electrode in the element body and connected to the first and second wiring layers, and an adjustment electrode provided in an adjustment region in the element body, the first wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure, and a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structure≤the thermal expansion coefficient of the adjustment region≤the thermal expansion coefficient of the inner electrode.

Claims

1. An electronic component device comprising:

an electronic component;

a resin structure inside of which the electronic component is disposed such that one main surface of the electronic component is exposed therefrom; and

a wiring layer provided on at least a portion of a surface of each of the resin structure and the electronic component;

wherein

the electronic component includes;

an element body;

an inner electrode provided in the element body and connected to the wiring layer; and

an adjustment electrode provided at least in an adjustment region between the inner electrode and a side surface of the resin structure closest to the inner electrode in the element body;

the wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure; and

a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structure≤

the thermal expansion coefficient of the adjustment region≤

the thermal expansion coefficient of the inner electrode.

2. The electronic component device according to claim 1, wherein the thermal expansion coefficient of the adjustment electrode is larger than the thermal expansion coefficient of the element body.

3. The electronic component device according to claim 1, wherein the adjustment electrode is in contact with the resin structure.

4. The electronic component device according to claim 1, wherein the adjustment electrode is in contact with the inner electrode.

5. The electronic component device according to claim 1, wherein a plurality of the adjustment electrodes are provided along the inner electrode in a depth direction of the element body.

6. The electronic component device according to claim 5, wherein the plurality of adjustment electrodes have a same or substantially a same thickness in the depth direction of the element body.

7. The electronic component device according to claim 5, wherein the plurality of adjustment electrodes is arranged periodically along the inner electrode in the depth direction of the element body.

8. The electronic component device according to claim 1, wherein the adjustment electrode is made of a metal.

9. The electronic component device according to claim 1, wherein the adjustment electrode is made of a same material as a material of the inner electrode.

10. The electronic component device according to claim 4, wherein the adjustment electrode protrudes from the inner electrode.

11. The electronic component device according to claim 1, wherein

the inner electrode includes a first inner electrode and a second inner electrode connected to the first inner electrode;

and

at least one of the first inner electrode and the second inner electrode is an inductor.

12. The electronic component device according to claim 1, wherein

the inner electrode includes a first inner electrode and a second inner electrode;

the wiring layer includes a first wiring layer and a second wiring layer;

the first inner electrode is connected to the first wiring layer and is in contact with the adjustment region;

the second inner electrode is connected to the second wiring layer and is in contact with the adjustment region; and

the electronic component is a capacitor defined by a first planar electrode connected to the first inner electrode and a second planar electrode connected to the second inner electrode.

13. The electronic component device according to claim 1, wherein

the element body has a rectangular or substantially rectangular shape when viewed in a plan view from a side of a surface at which the wiring layer is provided;

and

the adjustment electrode is provided along a portion of each of two sides defining at least one corner portion of the rectangular or substantially rectangular shape of the element body.

14. An electronic component device comprising:

a mounting substrate;

the electronic component device according to claim 1, mounted on the mounting substrate; and

a mounted component mounted on the electronic component device.

15. The electronic component device according to claim 14, wherein

the resin structure includes a through-electrode penetrating through both surfaces of the resin structure;

and

the through-electrode is connected to the mounting substrate and the wiring layer.

16. The electronic component device according to claim 14, wherein a plurality of the electronic component devices are included, and the plurality of electronic component devices are stacked between the mounting substrate and the mounted component.

17. A high-frequency front end circuit comprising:

the electronic component device according to claim 1 defining a high-frequency element.

18. The high-frequency front end circuit according to claim 17, wherein the thermal expansion coefficient of the adjustment electrode is larger than the thermal expansion coefficient of the element body.

19. The high-frequency front end circuit according to claim 17, wherein the adjustment electrode is in contact with the resin structure.

20. A communication device comprising:

an RF signal processing circuit to process a high-frequency signal transmitted and received through an antenna element; and

the frequency front end circuit according to claim 17 to transmit the high-frequency signal between the antenna element and the RF signal processing circuit.