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Spot-solderable leads for semiconductor device packages

  • US 10,607,927 B2
  • Filed: 04/13/2017
  • Issued: 03/31/2020
  • Est. Priority Date: 09/09/2016
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • at least one semiconductor chip attached to a leadframe, the leadframe including leads of a first subset alternating with leads of an adjacent second subset, the subsets having elongated straight lead portions that are parallel to each other in a planar array;

    a package of polymeric compound covering the leadframe, the planar array of the straight lead portions of the first and the second subsets are located at a surface of the package, and un-encapsulated surfaces of the leads are coplanar with the surface of the package; and

    insulator-filled surface grooves located across the elongated straight lead portions of the leads of the first and second subsets, the insulator-filled surface grooves defining a solder-allowed area of the leads of the first and second subsets, the portions of the leads of the first and second subsets not containing insulator-filled surface grooves having an unencumbered full thickness.

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