Dual-sided radio-frequency package with overmold structure

• US 10,607,944 B2
• Filed: 10/04/2017
• Issued: 03/31/2020
• Est. Priority Date: 10/04/2016
• Status: Active Grant

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: Chen, Howard E., Darveaux, Robert Francis
• Primary Examiner(s): Dang, Phuc T
• Application Number:
  US15/724,722
• Publication Number:
  US 20180096949A1
• Time in Patent Office: 909 Days
• CPC Class Codes: H01L 21/2855 by physical means, e.g. sputtering, evaporation H01L21/28518 - H01L21/28537 and H01L21/28568 take precedence
• CPC Class Codes: H01L 21/32051 Deposition of metallic or metal-silicide layers
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/76802 by forming openings in dielectrics
• CPC Class Codes: H01L 21/76877 Filling of holes, grooves or trenches, e.g. vias, with conductive material
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2223/6616 Vertical connections, e.g. vias
• CPC Class Codes: H01L 2224/16141 the bodies being arranged on opposite sides of a substrate, e.g. mirror arrangements
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48106 the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
• CPC Class Codes: H01L 2224/48225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49052 : Different loop heights
• CPC Class Codes: H01L 2224/73257 : Bump and wire connectors
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/1058 : Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/107 : Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/481 : Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/49805 : the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/03 : all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1421 : RF devices
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19106 : in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array

Abstract

A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. A shielded package may be implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit. A set of through-mold connections may be implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate. The device may include a component implemented within the mounting volume and a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.

Claims

1. A packaged radio-frequency device comprising:

a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side;

a shielded package implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit;

a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate;

a component implemented within the mounting volume; and

a second overmold structure substantially encapsulating the set of through-mold connections so that at least a portion of the set of through-mold connections is exposed through the second overmold structure, the set of through-mold connections including a ball grid array, the ball grid array including a first group of solder balls arranged to partially or fully surround the component, at least some of the first group of solder balls electrically connected to input and output nodes of the first circuit.

2. The radio-frequency device of claim 1 wherein the set of through-mold connections includes a metallic material.

3. The radio-frequency device of claim 1 wherein the set of through-mold connections includes a set of pillars configured to allow the packaged radio-frequency device to be mounted on a circuit board.

4. The radio-frequency device of claim 1 wherein the first and second sides of the packaging substrate correspond to upper and lower sides, respectively, when the packaged radio-frequency device is oriented to be mounted on a circuit board.

5. The radio-frequency device of claim 1 wherein the ball grid array is configured to allow the packaged radio-frequency device to be mounted on a circuit board.

6. The radio-frequency device of claim 5 wherein the ball grid array further includes a second group of solder balls arranged to partially or fully surround the first group of solder balls.

7. The radio-frequency device of claim 6 wherein each of the second group of solder balls is electrically connected to a ground plane within the packaging substrate.

8. The radio-frequency device of claim 7 wherein the first group of solder balls forms a rectangular perimeter around the component mounted on the second side of the packaging substrate.

9. The radio-frequency device of claim 8 wherein the second group of solder balls forms a rectangular perimeter around the first group of solder balls.

10. The radio-frequency device of claim 1 wherein the first overmold structure substantially encapsulates the first circuit.

11. The radio-frequency device of claim 10 wherein the shielded package further includes an upper conductive layer implemented on the first overmold structure, the upper conductive layer electrically connected to a ground plane within the packaging substrate.

12. The radio-frequency device of claim 11 wherein the upper conductive layer and the ground plane are electrically connected through a conformal conductive coating implemented on one or more sides of the first overmold structure

13. The radio-frequency device of claim 12 wherein the conformal conductive coating extends to corresponding one or more sides of the packaging substrate.

14. The radio-frequency device of claim 11 wherein the upper conductive layer and the ground plane are electrically connected through one or more conductors within the first overmold structure.

15. The radio-frequency device of claim 14 wherein the one or more conductors include shielding wirebonds arranged relative to the first circuit to provide radio-frequency shielding functionality for at least a portion of the first circuit.

16. The radio-frequency device of claim 14 wherein the one or more conductors include one or more surface-mount technology devices mounted on the packaging substrate, the one or more surface-mount technology devices arranged relative to the first circuit to provide radio-frequency shielding functionality for at least a portion of the first circuit.

17. A wireless device comprising:

a circuit board configured to receive a plurality of packaged modules; and

a radio-frequency module mounted on the circuit board, the radio-frequency module including a packaging substrate configured to receive a plurality of components, the packaging substrate including a first side and a second side, the radio-frequency module further including a shielded package implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit, the radio-frequency module further including a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate, the radio-frequency module further including a component implemented within the mounting volume and a second overmold structure substantially encapsulating the set of through-mold connections so that at least a portion of the set of through-mold connections is exposed through the second overmold structure, the set of through-mold connections including a ball grid array, the ball grid array including a first group of solder balls arranged to partially or fully surround the component, at least some of the first group of solder balls electrically connected to input and output nodes of the first circuit.