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Dual-sided radio-frequency package with overmold structure

  • US 10,607,944 B2
  • Filed: 10/04/2017
  • Issued: 03/31/2020
  • Est. Priority Date: 10/04/2016
  • Status: Active Grant
First Claim
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1. A packaged radio-frequency device comprising:

  • a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side;

    a shielded package implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit;

    a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate;

    a component implemented within the mounting volume; and

    a second overmold structure substantially encapsulating the set of through-mold connections so that at least a portion of the set of through-mold connections is exposed through the second overmold structure, the set of through-mold connections including a ball grid array, the ball grid array including a first group of solder balls arranged to partially or fully surround the component, at least some of the first group of solder balls electrically connected to input and output nodes of the first circuit.

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