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Semiconductor devices for integration with light emitting chips and modules thereof

  • US 10,607,972 B2
  • Filed: 05/08/2018
  • Issued: 03/31/2020
  • Est. Priority Date: 11/18/2015
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a semiconductor substrate comprising a main surface and one or more active components formed in the substrate;

    an interconnect portion formed on the main surface and comprising an upper surface opposite the main surface;

    two contact pads disposed at the upper surface;

    an opening between the two contact pads that exposes dielectric material of the interconnect portion at the upper surface;

    a reflective structure disposed within the interconnect portion beneath the opening,wherein the reflective structure is electrically isolated from all of the active components formed in the substrate.

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