Radio frequency module

• US 10,608,682 B2
• Filed: 09/11/2019
• Issued: 03/31/2020
• Est. Priority Date: 03/14/2017
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Watanabe, Takashi
• Primary Examiner(s): Perez, James M
• Application Number:
  US16/567,201
• Publication Number:
  US 20200007174A1
• Time in Patent Office: 202 Days
• CPC Class Codes: H01L 23/12 Mountings, e.g. non-detachable insulating substrates
• CPC Class Codes: H01L 25/00 Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereofdevices consisting of a plurality of solid state components formed in or on a common substrate H01L27/00; photovoltaic modules or arrays of photovoltaic cells H01L31/042 ; panels or arrays of photo electrochemical cells H01G9/2068
• CPC Class Codes: H03F 2200/111 the amplifier being a dual or triple band amplifier, e.g. 900 and 1800 MHz, e.g. switched or not switched, simultaneously or not
• CPC Class Codes: H03F 2200/451 the amplifier being a radio frequency amplifier
• CPC Class Codes: H03F 2203/7209 the gated amplifier being switched from a first band to a second band
• CPC Class Codes: H03F 3/195 in integrated circuits
• CPC Class Codes: H03F 3/245 with semiconductor devices only
• CPC Class Codes: H03F 3/72 Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal
• CPC Class Codes: H04B 1/0042 Digital filtering H04B1/0035 takes precedence; digital filters per se H03H17/00
• CPC Class Codes: H04B 1/04 Circuits
• CPC Class Codes: H04B 1/18 Input circuits, e.g. for coupling to an antenna or a transmission line coupling networks between antennas or lines and receivers independent of the nature of the receiver H03H
• CPC Class Codes: H04B 2001/0408 with power amplifiers

Abstract

An amplifier circuit unit of a radio frequency module is mounted on a substrate with a first external terminal interposed therebetween, a switch circuit unit is mounted on the substrate with a second external terminal interposed therebetween, and a matching circuit unit is mounted on the substrate with a first terminal and a second terminal interposed therebetween. The first terminal is electrically connected to the second external terminal of the switch circuit unit, and the second terminal is electrically connected to the first external terminal of the amplifier circuit unit. When viewed from a direction perpendicular to one main surface of the substrate, the first terminal is superposed with the second external terminal of the switch circuit unit, and the second terminal is superposed with the first external terminal of the amplifier circuit unit.

Claims

1. A radio frequency module comprising:

a substrate;

a matching circuit unit mounted on one main surface of the substrate; and

a switch circuit unit and an amplifier circuit unit mounted on another main surface or in an inside of the substrate, wherein

the amplifier circuit unit has a first external terminal and is mounted on the substrate with the first external terminal interposed therebetween,

the switch circuit unit has a second external terminal and is mounted on the substrate with the second external terminal interposed therebetween,

the matching circuit unit has a first terminal and a second terminal, which are different from each other, and is mounted on the substrate with the first and second terminals interposed therebetween,

the first terminal is electrically connected to the second external terminal of the switch circuit unit,

the second terminal is electrically connected to the first external terminal of the amplifier circuit unit, and

when viewed from a direction perpendicular to the one main surface of the substrate,

the radio frequency module has at least one of a state in which the first terminal is superposed with the second external terminal of the switch circuit unit and a state in which the second terminal is superposed with the first external terminal of the amplifier circuit unit.

2. The radio frequency module according to claim 1, wherein

when viewed from the direction perpendicular to the one main surface of the substrate,

at least, the second terminal is superposed with the first external terminal of the amplifier circuit unit.

3. The radio frequency module according to claim 1, further comprising:

a first resin sealing portion provided on the one main surface of the substrate so as to cover the matching circuit unit; and

a first shield film provided to cover a side surface of the substrate and a side surface of the first resin sealing portion,

wherein

when viewed from the direction perpendicular to the one main surface of the substrate,

the matching circuit unit is arranged in a central region of the substrate.

4. The radio frequency module according to claim 1,

wherein the matching circuit unit is a chip inductor and is inserted between the switch circuit unit and the amplifier circuit unit such that the switch circuit unit, the matching circuit unit, and the amplifier circuit unit are connected in series.

5. The radio frequency module according to claim 4,

wherein the chip inductor is mounted on the substrate such that a coil axis is parallel to the one main surface of the substrate.

6. The radio frequency module according to claim 4, further comprising:

one or more chip inductors,

wherein at least two of the chip inductors are mounted on the substrate such that a coil axis of one of the chip inductors intersects with a coil axis of the other chip inductor.

7. The radio frequency module according to claim 6,

wherein the coil axis of the one of the chip inductors is orthogonal to the coil axis of the other chip inductor.

8. The radio frequency module according to claim 6, further comprising:

a band pass filter connected to the switch circuit unit,

wherein the band pass filter is mounted on the other main surface or in the inside of the substrate.

9. The radio frequency module according to claim 1,

wherein the switch circuit unit and the amplifier circuit unit are mounted on the other main surface of the substrate,

the radio frequency module further comprising:

a bump electrode that protrudes from the other main surface of the substrate;

a second resin sealing portion formed on the other main surface of the substrate so as to cover a side surface of the switch circuit unit and a side surface of the amplifier circuit unit as well as a side surface of the bump electrode; and

a second shield film formed so as to cover a side surface of the second resin sealing portion.

10. The radio frequency module according to claim 9, wherein

the bump electrode has a bottom portion that is in direct contact with the other main surface and a leading-end portion that is not in direct contact with the bottom portion,

the leading-end portion is exposed from a front surface of the second resin sealing portion, and

a portion of the bottom portion is exposed from the side surface of the second resin sealing portion along the other main surface of the substrate and is connected to the second shield film.

11. The radio frequency module according to claim 9, wherein

the bump electrode has a bottom portion that is in contact with the other main surface and a leading-end portion positioned farthest from the bottom portion, and

the leading-end portion has a cross-sectional area larger than a cross-sectional area of the bottom portion, and the leading-end portion is exposed from a front surface of the second resin sealing portion.

12. The radio frequency module according to claim 2, further comprising:

a first resin sealing portion provided on the one main surface of the substrate so as to cover the matching circuit unit; and

a first shield film provided to cover a side surface of the substrate and a side surface of the first resin sealing portion,

wherein

when viewed from the direction perpendicular to the one main surface of the substrate,

the matching circuit unit is arranged in a central region of the substrate.

13. The radio frequency module according to claim 2,

wherein the matching circuit unit is a chip inductor and is inserted between the switch circuit unit and the amplifier circuit unit such that the switch circuit unit, the matching circuit unit, and the amplifier circuit unit are connected in series.

14. The radio frequency module according to claim 2,

wherein the matching circuit unit is a chip inductor and is inserted between the switch circuit unit and the amplifier circuit unit such that the switch circuit unit, the matching circuit unit, and the amplifier circuit unit are connected in series.

15. The radio frequency module according to claim 5, further comprising:

one or more chip inductors,

wherein at least two of the chip inductors are mounted on the substrate such that a coil axis of one of the chip inductors intersects with a coil axis of the other chip inductor.