Systems and methods to form airgaps
First Claim
1. An etching method comprising:
- flowing a fluorine-containing precursor into a substrate processing region of a semiconductor processing chamber;
flowing a hydrogen-containing precursor into the substrate processing region;
contacting a substrate housed in the substrate processing region with the fluorine-containing precursor and the hydrogen-containing precursor, wherein the substrate comprises a trench, wherein a spacer is formed along a sidewall of the trench, wherein the spacer includes a plurality of layers including a first layer of a carbon-containing material, a second layer of an oxygen-containing material, and a third layer of a carbon-containing material, and wherein the second layer of the spacer is disposed between the first layer and third layer of the spacer; and
removing the oxygen-containing material.
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Accused Products
Abstract
Exemplary etching methods may include flowing a fluorine-containing precursor into a substrate processing region of a semiconductor processing chamber. The methods may include flowing a hydrogen-containing precursor into the substrate processing region. The methods may include contacting a substrate housed in the substrate processing region with the fluorine-containing precursor and the hydrogen-containing precursor. The substrate may include a trench or recessed feature, and a spacer may be formed along a sidewall of the trench or feature. The spacer may include a plurality of layers including a first layer of a carbon-containing or nitrogen-containing material, a second layer of an oxygen-containing material, and a third layer of a carbon-containing or nitrogen-containing material. The second layer of the spacer may be disposed between the first layer and third layer of the spacer. The methods may also include removing the oxygen-containing material.
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Citations
20 Claims
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1. An etching method comprising:
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flowing a fluorine-containing precursor into a substrate processing region of a semiconductor processing chamber; flowing a hydrogen-containing precursor into the substrate processing region; contacting a substrate housed in the substrate processing region with the fluorine-containing precursor and the hydrogen-containing precursor, wherein the substrate comprises a trench, wherein a spacer is formed along a sidewall of the trench, wherein the spacer includes a plurality of layers including a first layer of a carbon-containing material, a second layer of an oxygen-containing material, and a third layer of a carbon-containing material, and wherein the second layer of the spacer is disposed between the first layer and third layer of the spacer; and removing the oxygen-containing material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A removal method comprising:
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flowing a fluorine-containing precursor into a substrate processing region of a semiconductor processing chamber; flowing water vapor into the substrate processing region; contacting a substrate housed in the substrate processing region with the fluorine-containing precursor and the water vapor, wherein the substrate comprises a trench, wherein a spacer is formed along a sidewall of the trench, wherein the spacer includes a plurality of lateral layers including a first layer of a carbon-containing material adjacent a sidewall of the trench, a second layer comprising an oxygen-containing material, and a third layer of a carbon-containing material, and wherein the second layer of the spacer is disposed between the first layer of the spacer and third layer of the spacer; maintaining a relative humidity within the substrate processing region of the semiconductor processing chamber below or about 60%; and removing the second layer of the spacer. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. An etching method comprising:
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flowing anhydrous hydrogen fluoride into a substrate processing region of a semiconductor processing chamber; flowing water vapor into the substrate processing region; contacting a substrate housed in the substrate processing region with the anhydrous hydrogen fluoride and the water vapor, wherein the substrate comprises a trench, wherein a spacer is formed along a sidewall of the trench, wherein the spacer includes a plurality of lateral layers including a first layer of a carbon-containing material adjacent a sidewall of the trench, a second layer comprising a first oxygen-containing material and a second oxygen-containing material different from the first oxygen-containing material, and a third layer of a nitrogen-containing material, wherein the second layer of the spacer is disposed between the first layer of the spacer and third layer of the spacer, and wherein the second layer of the spacer at least partially extends laterally beneath the third layer of the spacer; maintaining a relative humidity within the substrate processing region of the semiconductor processing chamber below or about 60%; and removing the second layer of the spacer.
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Specification