Identifying a source of nuisance defects on a wafer
First Claim
1. A system configured to identify a source of nuisance defects on a wafer, comprising:
- an inspection subsystem comprising at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to a wafer, and wherein the detector is configured to detect energy from the wafer and to generate output responsive to the detected energy; and
one or more computer subsystems configured for;
detecting defects on the wafer by applying a hot threshold to the output such that at least a majority of the detected defects comprise nuisance defects;
determining locations of the detected defects with respect to design information for the wafer;
stacking information for the detected defects based on the determined locations relative to a structure on the wafer such that the detected defects having the same locations relative to the structure are coincident with each other in results of the stacking; and
identifying a source of the nuisance defects based on the results of the stacking.
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Accused Products
Abstract
Methods and systems for identifying a source of nuisance defects on a wafer are provided. One method includes detecting defects on a wafer by applying a hot threshold to output generated for the wafer by a detector of an inspection subsystem such that at least a majority of the detected defects include nuisance defects and determining locations of the detected defects with respect to design information for the wafer. In addition, the method includes stacking information for the detected defects based on the determined locations relative to a structure on the wafer such that the detected defects having the same locations relative to the structure are coincident with each other in results of the stacking. The method further includes identifying a source of the nuisance defects based on the results of the stacking.
24 Citations
19 Claims
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1. A system configured to identify a source of nuisance defects on a wafer, comprising:
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an inspection subsystem comprising at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to a wafer, and wherein the detector is configured to detect energy from the wafer and to generate output responsive to the detected energy; and one or more computer subsystems configured for; detecting defects on the wafer by applying a hot threshold to the output such that at least a majority of the detected defects comprise nuisance defects; determining locations of the detected defects with respect to design information for the wafer; stacking information for the detected defects based on the determined locations relative to a structure on the wafer such that the detected defects having the same locations relative to the structure are coincident with each other in results of the stacking; and identifying a source of the nuisance defects based on the results of the stacking. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a computer-implemented method for identifying a source of nuisance defects on a wafer, wherein the computer-implemented method comprises:
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detecting defects on the wafer by applying a hot threshold to output generated for the wafer by a detector of an inspection subsystem such that at least a majority of the detected defects comprise nuisance defects, wherein the inspection subsystem comprises at least an energy source and the detector, wherein the energy source is configured to generate energy that is directed to the wafer, and wherein the detector is configured to detect energy from the wafer and to generate the output responsive to the detected energy; determining locations of the detected defects with respect to design information for the wafer; stacking information for the detected defects based on the determined locations relative to a structure on the wafer such that the detected defects having the same locations relative to the structure are coincident with each other in results of the stacking; and identifying a source of the nuisance defects based on the results of the stacking.
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19. A computer-implemented method for identifying a source of nuisance defects on a wafer, comprising:
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detecting defects on the wafer by applying a hot threshold to output generated for the wafer by a detector of an inspection subsystem such that at least a majority of the detected defects comprise nuisance defects, wherein the inspection subsystem comprises at least an energy source and the detector, wherein the energy source is configured to generate energy that is directed to the wafer, and wherein the detector is configured to detect energy from the wafer and to generate the output responsive to the detected energy; determining locations of the detected defects with respect to design information for the wafer; stacking information for the detected defects based on the determined locations relative to a structure on the wafer such that the detected defects having the same locations relative to the structure are coincident with each other in results of the stacking; and identifying a source of the nuisance defects based on the results of the stacking, wherein said detecting, determining, stacking, and identifying are performed by one or more computer subsystems coupled to the inspection subsystem.
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Specification