Method for fabricating glass substrate package

• US 10,622,310 B2
• Filed: 09/11/2016
• Issued: 04/14/2020
• Est. Priority Date: 09/26/2012
• Status: Active Grant

• Current Assignee: Ping-Jung Yang
• Original Assignee: Ping-Jung Yang
• Inventors: Yang, Ping-Jung
• Primary Examiner(s): Frost, Anthony J
• Application Number:
  US15/261,956
• Publication Number:
  US 20170047313A1
• Time in Patent Office: 1,311 Days
• CPC Class Codes: C09K 2323/00 Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
• CPC Class Codes: C09K 2323/03 Viewing layer characterised by chemical composition
• CPC Class Codes: H01L 2224/03462 Electroplating
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/0558 being stacked
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/11334 using preformed bumps
• CPC Class Codes: H01L 2224/1146 Plating
• CPC Class Codes: H01L 2224/11462 Electroplating
• CPC Class Codes: H01L 2224/13005 Structure
• CPC Class Codes: H01L 2224/13022 the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/13076 being mutually engaged together, e.g. through inserts
• CPC Class Codes: H01L 2224/1308 : being stacked
• CPC Class Codes: H01L 2224/131 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13109 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13111 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/16147 : the bump connector connecting to a bonding area disposed in a recess of the surface
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16237 : the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 : the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48465 : the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 23/15 : Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49822 : Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49833 : the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/5384 : Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H10K 77/10 : Substrates, e.g. flexible substrates
• CPC Class Codes: Y02E 10/549 : Organic PV cells
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A display device comprises a display panel substrate and a glass substrate over said display panel substrate, wherein said display panel substrate comprises multiple contact pads, a display area, a first boundary, a second boundary, a third boundary and a fourth boundary, wherein said display area comprises a first edge, a second edge, a third edge and a fourth edge, wherein said first boundary is parallel to said third boundary and said first and third edges, wherein said second boundary is parallel to said fourth boundary and said second and fourth edges, wherein a first least distance between said first boundary and said first edge, wherein a second least distance between said second boundary and said second edge, a third least distance between said third boundary and said third edge, a fourth distance between said fourth boundary and said fourth edge, and wherein said first, second, third and fourth least distances are smaller than 100 micrometers, and wherein said glass substrate comprising multiple metal conductors through in said glass substrate and multiple metal bumps are between said glass substrate and said display panel substrate, wherein said one of said metal conductors is connected to one of said contact pads through one of said metal bumps.

Claims

1. A OLED display panel device comprising:

a first glass substrate has a first surface and a second surface opposed to said first surface, wherein said first surface is parallel to said second surface, multiple metal conductors extending through said first glass substrate beginning at said first surface and ending at said second surface, wherein a first metal layer is over said first surface, a second metal layer is over said first surface and a top most dielectric layer is over said first and second metal layers, wherein said first and second metal layers are connected to one of said metal conductors respectively, wherein a bottom most metal layer is under said second surface and a bottom most dielectric layer is cover said bottom most, metal layer, wherein said bottom most metal layer is connected to one of said metal conductors;

a second glass substrate stacks over said first glass substrate;

multiple organic light-emitting (OLED) components between said first and second glass substrates, wherein one of said organic light-emitting component comprises an anode layer, a cathode layer and an organic light-emitting layer between said anode layer and said cathode layer, wherein said anode layer is directly connected to said first metal layer through a first opening in said top most dielectric layer, wherein said a portion of said anode layer is in said first opening, and wherein said cathode layer is directly connected to said second metal layer through a second opening in said top most dielectric layer; and

a first chip bonded and under said first glass substrate, wherein said first chip comprises a metal bump connected to said bottom most metal layer through a third opening in said bottom most dielectric layer, wherein said metal bump is connected to said anode layer through said third opening, said bottom most metal layer, said one of said metal conductors and said first metal layer.

2. The OLED display panel device of claim 1, wherein said anode layer comprises a transparent electrode layer.

3. The OLED display panel device of claim 1, wherein said cathode layer comprises a transparent electrode layer.

4. The OLED display panel device of claim 1, wherein said anode layer comprises copper.

5. The OLED display panel device of claim 1, wherein said bottom most dielectric layer comprises a polymer layer.

6. The OLED display panel device of claim 1, wherein said metal conductor comprises a copper metal layer.

7. The OLED display panel device of claim 1, wherein said metal bump comprises a gold metal layer.

8. The OLED display panel device of claim 1, wherein said metal bump comprises a copper metal layer and gold metal layer over said copper layer.

9. The OLED display panel device of claim 1, wherein said metal bump comprises a solder layer.

10. The OLED display panel device of claim 1 further comprising a second chip under said second glass substrate, wherein a metal pad of said second chip is connected to one of said metal conductors through a metal wire.

11. The OLED display panel device of claim 1, wherein said first metal layer comprises an adhesion metal layer and a third metal layer over said adhesion metal layer.

12. The OLED display panel device of claim 1 further comprising a metal trace formed on said first glass substrate, wherein said metal trace is connected to said metal bump and one of said metal conductors.

13. The OLED display panel device of claim 12, wherein said metal trace comprises a copper layer.

14. The OLED display panel device of claim 12, wherein said metal trace comprises an aluminum layer.

15. The OLED display panel device of claim 1 further comprising a metal connection structure is on said first surface, wherein said metal connection structure comprises a first dielectric layer on said first surface, wherein a third opening is in said first dielectric layer and exposed a top surface of said metal conductor, a second dielectric layer on said first dielectric layer, wherein a fourth opening is in said second dielectric layer and exposed said top surface of said metal conductor, said third opening and a top surface of said first dielectric layer, a third metal layer on said top surface of said metal conductor, on said a sidewall of said third opening, on said top surface of said first dielectric layer and on said sidewall of said fourth opening and a fourth metal layer on said third metal layer and in said first and fourth openings, wherein a top surface of said fourth metal layer, a top surface of said second dielectric layer, a top surface of said third metal layer are coplanar.

16. The OLED display panel device of claim 1 further comprising a metal connection structure is on said second surface, wherein said metal connection structure comprises a first dielectric layer on said second surface, wherein a third opening is in said first dielectric layer and exposed a bottom surface of said metal conductor, a second dielectric layer on said first dielectric layer, wherein a fourth opening is in said second dielectric layer and exposed said bottom surface of said metal conductor, said third opening and a bottom surface of said first dielectric layer, a third metal layer on said bottom surface of said metal conductor, on said a sidewall of said third opening, on said bottom surface of said first dielectric layer and on said sidewall of said fourth opening and a fourth metal layer on said third metal layer and in said first and fourth openings, wherein a bottom surface of said fourth metal layer, a bottom surface of said second dielectric layer, a bottom surface of said third metal layer are coplanar.

17. The OLED display panel device of claim 1 further comprising multiple discrete passive components formed on said second glass substrate.

18. The OLED display panel device of claim 17, wherein said discrete passive component comprises a discrete capacitor.

19. The OLED display panel device of claim 1 further comprising a first metal trace formed on said first surface and a second metal trace formed on said second surface, wherein said first metal trace is connected to said second metal trace through one of said metal conductors.

20. The OLED panel display device of claim 1, wherein said third metal layer comprises an adhesion metal layer and a fifth metal layer over said adhesion metal layer.