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Yield estimation and control

  • US 10,627,723 B2
  • Filed: 11/14/2014
  • Issued: 04/21/2020
  • Est. Priority Date: 12/17/2013
  • Status: Active Grant
First Claim
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1. A defect prediction method for a device manufacturing process involving production substrates processed by a lithographic apparatus, the method comprising:

  • training, by a hardware computer system, a classification model using a training set comprising measured or determined values of a process parameter associated with the production substrates processed by the device manufacturing process and an indication regarding existence of defects associated with the production substrates processed in the device manufacturing process under the values of the process parameter, the process parameter representing a setting or condition of a physical process, a material, an object or an apparatus that occurred during, or is occurring during, application of physical processing to the production substrates; and

    producing, by the hardware computer system, an output from the classification model that indicates a prediction of a defect for a substrate.

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