Electronic device module
First Claim
Patent Images
1. An electronic device module comprising:
- a substrate;
a first component and at least a second component disposed on one surface of the substrate;
a shielding wall disposed between the first component and the second component, and disposed on the substrate; and
a sealing portion comprising the at first component, the second component and the shielding wall embedded therein, and disposed on the substrate,wherein the shielding wall comprises;
an insulating layer,a first conductive layer disposed on a first surface of the insulating layer,a second conductive layer disposed on a second surface of the insulating layer opposing the first surface, andan interlayer connecting conductor disposed in the insulating layer penetrating through the insulating layer from the first surface to the second surface to electrically connect the first conductive layer to the second conductive layer, anda shielding layer disposed on a surface of the sealing portion,wherein the first and second conductive layers are electrically connected to the shielding layer.
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Abstract
An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.
9 Citations
18 Claims
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1. An electronic device module comprising:
- a substrate;
a first component and at least a second component disposed on one surface of the substrate; a shielding wall disposed between the first component and the second component, and disposed on the substrate; and a sealing portion comprising the at first component, the second component and the shielding wall embedded therein, and disposed on the substrate, wherein the shielding wall comprises; an insulating layer, a first conductive layer disposed on a first surface of the insulating layer, a second conductive layer disposed on a second surface of the insulating layer opposing the first surface, and an interlayer connecting conductor disposed in the insulating layer penetrating through the insulating layer from the first surface to the second surface to electrically connect the first conductive layer to the second conductive layer, and a shielding layer disposed on a surface of the sealing portion, wherein the first and second conductive layers are electrically connected to the shielding layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
- a substrate;
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14. An electronic device module, comprising:
- a first circuit substrate including a ground electrode;
at least one first component and at least one second component disposed on one surface of the first circuit substrate; a second circuit substrate disposed between the at least one first component and the at least one second component and disposed on the first circuit substrate to be substantially perpendicular to the first circuit substrate; and a sealing portion having the at least one first component, the at least one second component and the second circuit substrate embedded therein, and disposed on the substrate, wherein the second circuit substrate comprises an insulating layer, two wiring layers disposed on opposing surfaces of the insulating layer, and a plurality of interlayer connecting conductors penetrating through the insulating layer to connect the two wiring layers to each other, wherein a wiring layer on the second circuit substrate is connected to the ground electrode on the first circuit substrate, and a shielding layer disposed on a surface of the sealing portion, wherein the first and second conductive layers are electrically connected to the shielding layer. - View Dependent Claims (15)
- a first circuit substrate including a ground electrode;
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16. An electronic device module, comprising:
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a first substrate comprising a first region and a second region on a surface; a first component disposed in the first region; a second component disposed in the second region; a second substrate disposed on the surface and extending from the surface to divide the surface into the first region and the second region, a first sealing portion embedding the first component; a second sealing portion embedding the second component; wherein the second substrate comprises; an insulating layer; a first conductive layer on one surface of the insulating layer facing the first region and a second conductive layer on an opposite surface of the insulating layer facing the second region; interlayer conductors each comprising a conductive material disposed in a through-hole penetrating through the insulating layer to electrically connect the first and second conductive layers, wherein the first and second conductive layers are electrically connected to the first substrate, and a shielding layer disposed on the first and second sealing portions electrically connected to the first and second conductive layers, wherein the second substrate is embedded in the first and second sealing portions. - View Dependent Claims (17, 18)
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Specification