Redistribution-layer fanout package stiffener
First Claim
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1. An apparatus comprising:
- a packaging substrate, wherein the packaging substrate is a redistribution layer, and wherein the redistribution layer includes a copper fanout structure positioned in a molding compound;
multiple semiconductor devices attached to the packaging substrate, the multiple semiconductor devices defining a path along the packaging substrate between a first pair of the multiple semiconductor devices; and
a stiffener structure coupled to the packaging substrate and positioned with a longitudinal axis of the stiffener structure being perpendicular to the path.
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Abstract
An apparatus may include a packaging substrate. The apparatus may further include multiple semiconductor devices attached to the packaging substrate, the multiple semiconductor devices defining a path along the packaging substrate between a pair of the multiple semiconductor devices. The apparatus may also include a stiffener structure coupled to the packaging substrate and positioned with a longitudinal axis of the stiffener structure being perpendicular to the path.
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Citations
16 Claims
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1. An apparatus comprising:
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a packaging substrate, wherein the packaging substrate is a redistribution layer, and wherein the redistribution layer includes a copper fanout structure positioned in a molding compound; multiple semiconductor devices attached to the packaging substrate, the multiple semiconductor devices defining a path along the packaging substrate between a first pair of the multiple semiconductor devices; and a stiffener structure coupled to the packaging substrate and positioned with a longitudinal axis of the stiffener structure being perpendicular to the path. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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attaching a first semiconductor device to a packaging substrate, wherein the packaging substrate is a redistribution layer, and wherein the redistribution layer includes a copper fanout structure positioned in a molding compound; attaching a second semiconductor device to the packaging substrate, the first semiconductor device and the second semiconductor device defining a path therebetween along the packaging substrate; attaching a stiffener structure to the packaging substrate with a longitudinal axis of the stiffener structure being perpendicular to the path. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. An apparatus comprising:
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a redistribution layer substrate having a copper fanout structure positioned in a molding compound; multiple semiconductor devices attached to the redistribution layer substrate, the multiple semiconductor devices defining a path along the redistribution layer substrate between a pair of the multiple semiconductor devices; and a copper stiffener structure coupled to the redistribution layer substrate and positioned with a longitudinal axis of the copper stiffener structure being perpendicular to the path. - View Dependent Claims (16)
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Specification