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Package structure and manufacturing method thereof

  • US 10,629,554 B2
  • Filed: 04/13/2018
  • Issued: 04/21/2020
  • Est. Priority Date: 04/13/2018
  • Status: Active Grant
First Claim
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1. A package structure, comprising:

  • a die having an active surface and a rear surface opposite to the active surface;

    an encapsulant encapsulating sidewalls of the die, wherein the encapsulant has a first surface and a second surface opposite to the first surface, the first surface is coplanar with the rear surface of the die, and the second surface is located at a level height different from the active surface of the die;

    a dam structure disposed on the active surface of the die, wherein a top surface of the dam structure is substantially coplanar with the second surface of the encapsulant; and

    a redistribution structure over the encapsulant, the dam structure, and the die, wherein the redistribution structure is electrically connected to the die,wherein the dam structure is spaced apart from a conductive element of the redistribution structure, the die comprises a plurality of connection pads and the dam structure comprises at least one opening, and the at least one opening exposes the plurality of connection pads, and the dam structure comprises a ring pattern having one opening, the ring pattern is disposed along edges of the active surface within the die, and the one opening exposes the plurality of connection pads.

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