Isolator integrated circuits with package structure cavity and fabrication methods

• US 10,636,778 B2
• Filed: 09/10/2018
• Issued: 04/28/2020
• Est. Priority Date: 12/30/2016
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Male, Barry Jon, Cook, Benjamin Stassen, Neidorff, Robert Alan, Kummerl, Steve
• Primary Examiner(s): Luke, Daniel
• Application Number:
  US16/126,577
• Publication Number:
  US 20190006338A1
• Time in Patent Office: 596 Days
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01L 2224/08113 the whole bonding area protruding from the surface of the body
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48149 the wire connector connecting to a bonding area protruding from the surface
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/315 the encapsulation having a cavity
• CPC Class Codes: H01L 23/49 wire-like arrangements or pins or rods using optical fibres H01L23/48; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/08 of an individual bonding area
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/101 : Devices sensitive to infrared, visible or ultraviolet radiation
• CPC Class Codes: H01L 31/103 : the potential barrier being of the PN homojunction type
• CPC Class Codes: H01L 31/1105 : the device being a bipolar phototransistor
• CPC Class Codes: H01L 31/167 : the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H01L 33/00 : Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof H10K50/00 takes precedence; devices consisting of a plurality of semiconductor components formed in or on a common substrate and including semiconductor components having potential barriers, specially adapted for light emission H01L27/15; semiconductor lasers H01S5/00
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H04B 10/803 : Free space interconnects, e.g. between circuit boards or chips

Abstract

In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.

Claims

1. An integrated circuit, comprising:

a leadframe structure, including electrical conductors;

a first coil structure electrically connected to a first pair of the electrical conductors of the leadframe structure, the first coil structure partially formed on a semiconductor die structure;

a second coil structure electrically connected to a second pair of the electrical conductors of the leadframe structure, the second coil structure partially formed on the semiconductor die structure; and

a molded package structure enclosing portions of the leadframe structure, the molded package structure exposing portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures, the molded package structure including a cavity to magnetically couple portions of the first and second coil structures.

2. The IC of claim 1, wherein the cavity is sealed.

3. The IC of claim 1, wherein portions of the first and second coil structures extend in the cavity.

4. The IC of claim 3, wherein the molded package structure encloses portions of the first and second coil structures.

5. The IC of claim 4, further comprising a ferrous material extending at least partially in the cavity.

6. The IC of claim 1, wherein the molded package structure encloses portions of the first and second coil structures.

7. The IC of claim 1, further comprising a ferrous material extending at least partially in the cavity.

8. The IC of claim 7, wherein the ferrous material is formed on the semiconductor die structure.