Assembly comprising an electric component
First Claim
1. An arrangement having a surface-mountable electrical device and having a carrier, the surface-mountable electrical device comprisingat least one electrical component which is a semiconductor component and which is intended for generating radiation,a control circuit for pulsed operation of the component,a capacitor which is connected to the component electrically in series and which is configured for the pulsed energization of the component, anda lead frame assembly as a mounting platform for the component, the capacitor and the control circuit, wherein the lead frame assembly comprises a plurality of different lead frames including at least a first lead frame, a second lead frame, and a third lead frame, and at least one of the plurality of different lead frames is thinner than at least one other of the lead frames of the plurality of different lead frames so that the lead frame assembly lies only partially in a mounting side,whereinthe device is applied to a top side of the carrier,a contact layer having a plurality of contact points is present on the top side, and the lead frames are electrically and mechanically connected to said contact points, andthe lead frames are partially spaced apart from the top side,wherein a first region of the third lead frame, on which the control circuit and the capacitor are arranged, is electrically connected directly to a second region of the third lead frame via the contact layer, wherein during operation of the component both connections of the capacitor are electrically connected to one another via the component, the control circuit and the contact layer such that by means of the contact layer an inductance for a discharge current out of the capacitor is decreased and a part of the discharge current flows through the contact layer.
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Accused Products
Abstract
The invention relates to an assembly comprising an electric component. The component has an electric part, a control circuit, and a capacitor. At least two lead frames are provided which are embedded into a housing. The part, the control circuit, and the capacitor are arranged on the lead frames, and the control circuit is designed to charge the capacitor and to supply the part with current from the capacitor in a clocked manner. The component has two contacts, and the component is arranged on a support. The support has an electrically conductive layer and the two contacts are connected to the layer in an electrically conductive manner. At least one first part of one lead frame is arranged at a greater distance from the electrically conductive layer than the second lead frame.
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Citations
13 Claims
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1. An arrangement having a surface-mountable electrical device and having a carrier, the surface-mountable electrical device comprising
at least one electrical component which is a semiconductor component and which is intended for generating radiation, a control circuit for pulsed operation of the component, a capacitor which is connected to the component electrically in series and which is configured for the pulsed energization of the component, and a lead frame assembly as a mounting platform for the component, the capacitor and the control circuit, wherein the lead frame assembly comprises a plurality of different lead frames including at least a first lead frame, a second lead frame, and a third lead frame, and at least one of the plurality of different lead frames is thinner than at least one other of the lead frames of the plurality of different lead frames so that the lead frame assembly lies only partially in a mounting side, wherein the device is applied to a top side of the carrier, a contact layer having a plurality of contact points is present on the top side, and the lead frames are electrically and mechanically connected to said contact points, and the lead frames are partially spaced apart from the top side, wherein a first region of the third lead frame, on which the control circuit and the capacitor are arranged, is electrically connected directly to a second region of the third lead frame via the contact layer, wherein during operation of the component both connections of the capacitor are electrically connected to one another via the component, the control circuit and the contact layer such that by means of the contact layer an inductance for a discharge current out of the capacitor is decreased and a part of the discharge current flows through the contact layer.
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9. An arrangement having a surface-mountable electrical device and having a carrier, the surface-mountable electrical device comprising
at least one electrical component which is a semiconductor component and which is intended for generating radiation, a control circuit for pulsed operation of the component, a capacitor which is connected to the component electrically in series and which is configured for the pulsed energization of the component, and a lead frame assembly having a plurality of different lead frames as a mounting platform for the component, the capacitor and the control circuit, wherein the lead frame assembly comprises a lead frame that is thinner than at least one other lead frame of the plurality of different lead frames so that the lead frame assembly lies only partially in a mounting side, wherein the device is applied to a top side of the carrier, a contact layer having a plurality of contact points is present on the top side, and the lead frames are electrically and mechanically connected to said contact points, and the lead frames are partially spaced apart from the top side, wherein in a plan view, a discharge current in the device through the component is congruent with the discharge current in the contact layer, wherein a distance between the contact layer and a first lead frame of the plurality of lead frames on which the component is located is at most 1.5 mm.
Specification