ESD protection circuit

• US 10,637,234 B2
• Filed: 06/22/2016
• Issued: 04/28/2020
• Est. Priority Date: 06/22/2016
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Morf, Thomas E., Toifl, Thomas H., Weiss, Jonas R.
• Primary Examiner(s): Tran, Thienvu V
• Assistant Examiner(s): Thomas, Lucy M
• Application Number:
  US15/189,408
• Publication Number:
  US 20170373493A1
• Time in Patent Office: 1,406 Days
• Field of Search: 361 56, 361111
• CPC Class Codes: H02H 9/046 responsive to excess voltage appearing at terminals of integrated circuits protection by specific structural integration design H01L27/0248

Abstract

An electrostatic discharge (ESD) protection circuit for providing ESD protection to an ESD protected circuit. The protection circuit comprises a signal pad and a crossover network for separating wanted electrical data signals and ESD signals according to their frequency. The protection circuit further comprises a first branch configured to transmit at least a spectral part of the wanted electrical data signals between the signal pad and the ESD protected circuit and a second branch configured to receive the ESD signals from the signal pad. Additionally there is provided a corresponding method, a corresponding integrated circuit chip and a corresponding design structure.

Claims

1. An integrated circuit chip comprising an electrostatic discharge (ESD) protection circuit for providing ESD protection to on-chip circuitry of the chip, the integrated circuit chip comprising:

a bond pad;

a crossover network directly coupled to the bond pad for separating wanted electrical data signals and ESD signals according to their frequency into at least a first branch and a second branch, wherein the first branch comprises a high pass filter, the high pass filter being configured to transmit only frequency components above a predefined spectrum of the ESD signals; and

the second branch comprises a low pass filter, the low pass filter being configured to transmit frequency components within the predefined spectrum of the ESD signals, wherein the high pass filter is implemented as a transformer, the transformer being capacitive coupled to the bond pad via a capacitor;

wherein the first branch is configured to transmit at least a spectral part of the wanted electrical data signals between the bond pad and the on-chip-circuitry; and

the second branch is configured to receive the ESD signals from the bond pad, the crossover network configured to transmit frequency components below approximately 2 GHz to the second branch and frequency components above approximately 4 GHz to the first branch.

2. The integrated circuit chip comprising the ESD protection circuit according to claim 1, the ESD protection circuit being configured such that the energy of the ESD signals is absorbed in the second branch.

3. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein the crossover network is a frequency diplexer.

4. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein the predefined spectrum of the ESD signals comprise the frequency range of standardized ESD-events.

5. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein the predefined spectrum of the ESD signals comprise the frequency range of the ESD charge device model (CDM).

6. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein

the second branch comprises one or more ESD-protection elements.

7. The integrated circuit chip comprising the ESD protection circuit according to claim 6, wherein the one or more ESD protection elements are implemented as diodes.

8. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein

the first branch is configured to transmit a high frequency part of the spectrum of the wanted signals to the ESD protected circuit;

the second branch is configured to transmit and to recover a low frequency part of the spectrum of the wanted signals to the ESD protected circuit.

9. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein the second branch is configured to recover the DC level of the wanted signals.

10. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein the first branch and the second branch comprise a line impedance termination.

11. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein the

high pass filter is configured as second order high pass filter;

and

the low pass filter is configured as second order low pass filter.

12. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein the

high pass filter is configured as third order high pass filter;

and

the low pass filter is configured as second order low pass filter.

13. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein the low pass filter is implemented as second order LC-filter comprising an inductor and a capacitor, wherein the inductor is arranged closer to the bond pad than the capacitor.

14. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein the high pass filter is implemented as second order LC-filter comprising an inductor and a capacitor, wherein the capacitor is arranged closer to the bond pad than the inductor.

15. The integrated circuit chip comprising the ESD protection circuit according to claim 1, wherein the high pass filter is implemented as filter comprising an inductor and a parallel arrangement of two diodes, wherein the diodes are arranged with opposite polarity and wherein the diodes are configured to provide a substantially equal capacitance.

16. An optical receiver comprising:

an integrated circuit chip comprising an electrostatic discharge (ESD) protection circuit for providing ESD protection to an ESD protected circuit, the ESD protection circuit comprising;

a bond pad;

a crossover network directly coupled to the bond pad for separating wanted electrical data signals and ESD signals according to their frequency into at least a first branch and a second branch, wherein the first branch comprises a high pass filter, the high pass filter being configured to transmit only frequency components above a predefined spectrum of the ESD signals; and

the second branch comprises a low pass filter, the low pass filter being configured to transmit frequency components within the predefined spectrum of the ESD signals, wherein the high pass filter is implemented as a transformer, the transformer being capacitive coupled to the bond pad via a capacitor;

wherein

the first branch is configured to transmit at least a spectral part of the wanted electrical data signals having frequency components above approximately 4 GHz between the bond pad and the ESD protected circuit; and

the second branch is configured to receive the ESD signals having frequency components below approximately 2 GHz from the bond pad; and

a photo-diode, wherein the photo-diode is directly coupled to the bond pad;

the second branch is configured to provide a bias voltage for the photo diode; and

the second branch is configured to deliver the DC level of the wanted signals to the receiver.

17. An optical transmitter comprising:

an integrated circuit chip comprising an electrostatic discharge (ESD) protection circuit for providing ESD protection to an ESD protected circuit, the ESD protection circuit comprising;

a bond pad;

a crossover network directly coupled to the bond pad for separating wanted electrical data signals and ESD signals according to their frequency into at least a first branch and a second branch, wherein the first branch comprises a high pass filter, the high pass filter being configured to transmit only frequency components above a predefined spectrum of the ESD signals; and

the second branch comprises a low pass filter, the low pass filter being configured to transmit frequency components within the predefined spectrum of the ESD signals, wherein the high pass filter is implemented as a transformer, the transformer being capacitive coupled to the bond pad via a capacitor;

wherein

the first branch is configured to transmit at least a spectral part of the wanted electrical data signals having frequency components above approximately 4 GHz between the bond pad and the ESD protected circuit; and

the second branch is configured to receive the ESD signals having frequency components below approximately 2 GHz from the bond pad;

and a laser device, wherein the laser device is directly coupled to the bond pad;

the second branch is configured to provide a bias voltage for the laser device.

18. The optical transmitter according to claim 17, wherein the laser device is a vertical cavity surface emitting laser.

19. A system comprising:

an integrated circuit chip comprising an electrostatic discharge (ESD) protection circuit for providing ESD protection to on-chip circuitry of the chip, the integrated circuit chip comprising;

a bond pad;

a crossover network directly coupled to the bond pad for separating wanted electrical data signals and ESD signals according to their frequency into at least a first branch and a second branch, wherein the first branch comprises a high pass filter, the high pass filter being configured to transmit only frequency components above a predefined spectrum of the ESD signals; and

the second branch comprises a low pass filter, the low pass filter being configured to transmit frequency components within the predefined spectrum of the ESD signals, wherein the high pass filter is implemented as a transformer, the transformer being capacitive coupled to the bond pad via a capacitor;

wherein

the first branch is configured to transmit at least a spectral part of the wanted electrical data signals between the bond pad and the on-chip-circuitry; and

the second branch is configured to receive the ESD signals from the bond pad; and

coding circuitry directly coupled to the bond pad, the coding circuitry being configured to provide coding for a wanted signal to be processed by the integrated circuit chip such that the frequency spectrum of the wanted signals is above the frequency spectrum of the ESD signals, and wherein the crossover network is configured to transmit frequency components below approximately 2 GHz to the second branch and frequency components above approximately 4 GHz to the first branch.