Circuit carrier and manifacturing method thereof
First Claim
1. A circuit carrier, comprising:
- at least one flexible structure, comprising;
a first dielectric layer; and
a conductive pattern, disposed on a surface of the first dielectric layer; and
a circuit structure, disposed on the at least one flexible structure and electrically connected to the conductive pattern of the at least one flexible structure, the circuit structure comprising;
a second dielectric layer, disposed on the at least one flexible structure and being in contact with the surface of the first dielectric layer where the conductive pattern is on; and
a circuit layer, disposed on and extending into the second dielectric layer to be in contact with the conductive pattern of the at least one flexible structure,wherein the at least one flexible structure is interposed in the circuit structure, a portion of the first dielectric layer and a portion of the conductive pattern of the at least one flexible structure are extended out from an edge of the circuit structure.
1 Assignment
0 Petitions
Accused Products
Abstract
A circuit carrier and a manufacturing method thereof are provided. The circuit carrier includes at least one flexible structure and a circuit structure. The flexible structure includes a first dielectric layer and a conductive pattern disposed thereon. The circuit structure is disposed on the flexible structure and electrically connected to the conductive pattern. The circuit structure includes a second dielectric layer and a circuit layer. The second dielectric layer is disposed on the flexible structure and has a Young'"'"'s modulus different from that of the first dielectric layer. The circuit layer is disposed on and extends into the second dielectric layer to be in contact with the conductive pattern of the flexible structure. The flexible structure is interposed in the circuit structure. A portion of the first dielectric layer and a portion of the conductive pattern of the flexible structure are extended out from an edge of the circuit structure.
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Citations
21 Claims
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1. A circuit carrier, comprising:
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at least one flexible structure, comprising; a first dielectric layer; and a conductive pattern, disposed on a surface of the first dielectric layer; and a circuit structure, disposed on the at least one flexible structure and electrically connected to the conductive pattern of the at least one flexible structure, the circuit structure comprising; a second dielectric layer, disposed on the at least one flexible structure and being in contact with the surface of the first dielectric layer where the conductive pattern is on; and a circuit layer, disposed on and extending into the second dielectric layer to be in contact with the conductive pattern of the at least one flexible structure, wherein the at least one flexible structure is interposed in the circuit structure, a portion of the first dielectric layer and a portion of the conductive pattern of the at least one flexible structure are extended out from an edge of the circuit structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 21)
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9. A method of manufacturing a circuit carrier, comprising:
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providing a flexible structure comprising a dielectric layer and a conductive pattern thereon; laminating a pre-patterned dielectric layer and forming a conductive material on the flexible structure, wherein the conductive material is in contact with the conductive pattern of the flexible structure, the pre-patterned dielectric layer comprises a first region, a second region connected to the first region, and an opening provided within the second region, and the opening of the pre-patterned dielectric layer exposes a peripheral region of the flexible structure and is covered by the conductive material; and selectively removing a first portion of the conductive material corresponding to the first region of the pre-patterned dielectric layer and a second portion of the conductive material corresponding to the second region of the pre-patterned dielectric layer to form a circuit layer and to expose the conductive pattern at the peripheral region of the flexible structure. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method of manufacturing a circuit carrier, comprising:
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forming conductive patterns on two opposing surfaces of a first dielectric layer to form a flexible structure; laminating a second dielectric layer on the two opposing surfaces of the first dielectric layer to sandwich the flexible structure therein, wherein a Young'"'"'s modulus of the second dielectric layer is different from that of the first dielectric layer; laminating a conductive material layer on the two opposing surfaces of the first dielectric layer to sandwich the second dielectric layer and the flexible structure therein; forming a patterned conductive layer over the second dielectric layer by partially removing the conductive material layer, wherein a portion of the patterned conductive layer penetrates through the second dielectric layer to be in contact with the conductive patterns of the flexible structure; and selectively etching the patterned conductive layer to form a circuit layer and to expose a peripheral portion of at least one of the conductive patterns of the flexible structure. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification